Datasheet

LLP PACKAGE DEVICES
The LM2671 is offered in the 16 lead LLP surface mount
package to allow for increased power dissipation compared
to the SO-8 and DIP.
The Die Attach Pad (DAP) can and should be connected to
PCB Ground plane/island. For CAD and assembly guidelines
refer to Application Note AN-1187 at http://
power.national.com.
21 www.national.com
LM2671