Datasheet

LM2695
www.ti.com SNVS413A –JANUARY 2006–REVISED APRIL 2013
If it is expected that the internal dissipation of the LM2695 will produce excessive junction temperatures during
normal operation, good use of the PC board’s ground plane can help considerably to dissipate heat. The
exposed pad on the bottom of the IC package can be soldered to a ground plane, and that plane should extend
out from beneath the IC, and be connected to ground plane on the board’s other side with several vias, to help
dissipate the heat. The exposed pad is internally connected to the IC substrate. Additionally the use of wide PC
board traces, where possible, can help conduct heat away from the IC. Judicious positioning of the PC board
within the end product, along with the use of any available air flow (forced or natural convection) can help reduce
the junction temperatures.
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