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LM3046

www.ti.com

SNLS372B –JULY 1999–REVISED MARCH 2013

LM3046 Transistor Array

Check for Samples: LM3046

FEATURES

APPLICATIONS

• Two Matched Pairs of Transistors

• General Use in All Types of Signal Processing

Systems Operating Anywhere in the

– V

Matched ±5 mV

Frequency Range from DC to VHF

– Input Offset Current 2 μA Max at I

= 1 mA

• Custom Designed Differential Amplifiers

• Five General Purpose Monolithic transistors

• Temperature Compensated Amplifiers

• Operation from DC to 120 MHz

• Wide Operating Current Range

• Low Noise Figure: 3.2 dB typ at 1 kHz

DESCRIPTION

The LM3046 consists of five general purpose silicon NPN transistors on a common monolithic substrate. Two of

the transistors are internally connected to form a differentially-connected pair. The transistors are well suited to a

wide variety of applications in low power system in the DC through VHF range. They may be used as discrete

transistors in conventional circuits however, in addition, they provide the very significant inherent integrated

circuit advantages of close electrical and thermal matching. The LM3046 is supplied in a 14-lead SOIC package.

Schematic and Connection Diagram

Figure 1. SOIC Package

Top View

See Package Number D (R-PDSO-G14)

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (13 pages)

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LM3046 www.ti.com SNLS372B – JULY 1999 – REVISED MARCH 2013 LM3046 Transistor Array Check for Samples: LM3046 FEATURES APPLICATIONS • • 1 2 • • • • Two Matched Pairs of Transistors – VBE Matched ±5 mV – Input Offset Current 2 μA Max at IC = 1 mA Five General Purpose Monolithic transistors Operation from DC to 120 MHz Wide Operating Current Range Low Noise Figure: 3.
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LM3046 SNLS372B – JULY 1999 – REVISED MARCH 2013 www.ti.com Absolute Maximum Ratings (1) (2) (3) Power Dissipation Each Transistor Total Package TA = 25°C 300 750 TA = 25°C to 55°C 300 750 TA > 55°C Derate at 6.67 TA = 25°C to 75°C 15 Collector to Base Voltage, VCBO 20 Collector to Substrate Voltage, VCIO (4) 20 Emitter to Base Voltage, VEBO 50 −65°C to +85°C Storage Temperature Range Dual-In-Line Package Soldering (10 Sec.
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LM3046 www.ti.
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LM3046 SNLS372B – JULY 1999 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics 4 Typical Collector To Base Cutoff Current vs Ambient Temperature for Each Transistor Typical Collector To Emitter Cutoff Current vs Ambient Temperature for Each Transistor Figure 2. Figure 3. Typical Static Forward Current-Transfer Ratio and Beta Ratio for Transistors Q1 and Q2 vs Emitter Current Typical Input Offset Current for Matched Transistor Pair Q1 Q2 vs Collector Current Figure 4. Figure 5.
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LM3046 www.ti.com SNLS372B – JULY 1999 – REVISED MARCH 2013 Typical Performance Characteristics (continued) Typical Input Offset Voltage Characteristics for Differential Pair and Paired Isolated Transistors vs Ambient Temperature Typical Noise Figure vs Collector Current Figure 8. Figure 9. Typical Noise Figure vs Collector Current Typical Noise Figure vs Collector Current Figure 10. Figure 11.
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LM3046 SNLS372B – JULY 1999 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) 6 Typical Input Admittance vs Frequency Typical Output Admittance vs Frequency Figure 14. Figure 15. Typical Reverse Transfer Admittance vs Frequency Typical Gain-Bandwidth Product vs Collector Current Figure 16. Figure 17.
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LM3046 www.ti.com SNLS372B – JULY 1999 – REVISED MARCH 2013 REVISION HISTORY Changes from Revision A (March 2013) to Revision B • Page Changed layout of National Data Sheet to TI format ............................................................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
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PACKAGE MATERIALS INFORMATION www.ti.com 26-Mar-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM3046MX SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1 LM3046MX/NOPB SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.
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PACKAGE MATERIALS INFORMATION www.ti.com 26-Mar-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM3046MX SOIC D 14 2500 367.0 367.0 35.0 LM3046MX/NOPB SOIC D 14 2500 367.0 367.0 35.
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