Datasheet
LM3444
SNVS682C –NOVEMBER 2010–REVISED MAY 2013
www.ti.com
ELECTRICAL CHARACTERISTICS
Limits in standard type face are for T
J
= 25°C and those with boldface type apply over the full Operating Temperature
Range ( T
J
= −40°C to +125°C). Minimum and Maximum limits are specified through test, design, or statistical correlation.
Typical values represent the most likely parametric norm at T
J
= 25°C, and are provided for reference purposes only. Unless
otherwise stated the following conditions apply: V
CC
= 12V.
Symbol Parameter Conditions Min Typ Max Units
V
CC
SUPPLY
I
VCC
Operating supply current 1.58 2.25 mA
V
CC-UVLO
Rising threshold 7.4 7.7 V
Falling threshold 6.0 6.4
Hysterisis 1
COFF
V
COFF
Time out threshold 1.22 1.276 1.327 V
5
R
COFF
Off timer sinking impedance 33 60 Ω
t
COFF
Restart timer 180 µs
CURRENT LIMIT
V
ISNS
ISNS limit threshold 1.17 1.269 1.364 V
4
t
ISNS
Leading edge blanking time 125 ns
Current limit reset delay 180 µs
ISNS limit to GATE delay ISNS = 0 to 1.75V step 33 ns
CURRENT SENSE COMPARATOR
V
FILTER
FILTER open circuit voltage 720 750 780 mV
R
FILTER
FILTER impedance 1.12 MΩ
V
OS
Current sense comparator offset voltage -4.0 0.1 4.0 mV
GATE DRIVE OUTPUT
V
DRVH
GATE high saturation I
GATE
= 50 mA 0.24 0.50 V
V
DRVL
GATE low saturation I
GATE
= 100 mA 0.22 0.50
I
DRV
Peak souce current GATE = V
CC
/2 -0.77 A
Peak sink current GATE = V
CC
/2 0.88
t
DV
Rise time C
load
= 1 nF 15 ns
Fall time C
load
= 1 nF 15
THERMAL SHUTDOWN
T
SD
Thermal shutdown temperature See
(1)
165 °C
Thermal shutdown hysteresis 20
THERMAL SPECIFICATION
R
θJA
VSSOP junction to ambient 124 °C/W
R
θJC
VSSOP junction to case 76
(1) Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design. In applications where high power dissipation
and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient
temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
J-MAX-OP
= 125°C), the maximum power dissipation
of the device in the application (P
D-MAX
), and the junction-to ambient thermal resistance of the part/package in the application (R
θJA
), as
given by the following equation: T
A-MAX
= T
J-MAX-OP
– (R
θJA
× P
D-MAX
).
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