Datasheet

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LM4864

www.ti.com

SNAS109F –SEPTEMBER 1999–REVISED MAY 2013

LM4864 725mW Audio Power Amplifier with Shutdown

Mode

Check for Samples: LM4864

FEATURES

DESCRIPTION

The LM4864 is a bridged audio power amplifier

• VSSOP, SOIC, PDIP

(1)

, and WSON Packaging

capable of delivering 725mW of continuous average

• No Output Coupling Capacitors, Bootstrap

power into an 8Ω load with 1% THD+N from a 5V

Capacitors, or Snubber Circuits are Necessary

power supply.

• Thermal Shutdown Protection Circuitry

Boomer

audio power amplifiers were designed

• Unity-Gain Stable

specifically to provide high quality output power from

a low supply voltage while requiring a minimal

• External Gain Configuration Capability

amount of external components. Since the LM4864

does not require output coupling capacitors, bootstrap

APPLICATIONS

capacitors or snubber networks, it is optimally suited

• Cellular phones

for low-power portable applications.

• Personal computers

The LM4864 features an externally controlled, low

• General purpose audio

power consumption shutdown mode, and thermal

shutdown protection.

KEY SPECIFICATIONS

The closed loop response of the unity-gain stable

• P

at 1% THD+N with V

= 5V, 1kHz

LM4864 can be configured by external gain-setting

resistors. The device is available in multiple package

– LM4864LD, 4Ω load 625 mW (typ)

types to suit various applications.

– LM4864LD, 8Ω load 725 mW (typ)

– LM4864M & LM4864N

(1)

, 8Ω load 675 mW

(typ)

– LM4864MM, 8Ω load

(2)

300 mW (typ)

– LM4864, 16Ω load 550 mW (typ)

– Shutdown current 0.7 µA (typ)

(1) Not recommended for new designs. Contact TI Audio

Marketing.

(2) The DGK0008BA package is thermally limited to 595 mW of

power dissipation at room temperature. Referring to Figure 21

in Typical Performance Characteristics, the power dissipation

limitation for the package occurs at 300 mW of output power.

This package limitation is based on 25°C ambient

temperature and θ

= 210°C. For higher output power

possibilities refer to POWER DISSIPATION.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2Boomer is a registered trademark of Texas Instruments.

3All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (24 pages)

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LM4864 www.ti.
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LM4864 SNAS109F – SEPTEMBER 1999 – REVISED MAY 2013 www.ti.com Typical Application Figure 1. Typical Audio Amplifier Application Circuit Connection Diagram Figure 2. VSSOP, SOIC, and PDIP Package- Top View See Package Number DGK0008A, D0008A or P0008E (3) Figure 3. WSON Package- Top View See Package Number NGY0010A (3) 2 Not recommended for new designs. Contact TI Audio Marketing.
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LM4864 www.ti.com SNAS109F – SEPTEMBER 1999 – REVISED MAY 2013 Figure 4. DIE LAYOUT (B-STEP) These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Supply Voltage 6.0V −65°C to +150°C Storage Temperature −0.3V to VDD + 0.
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LM4864 SNAS109F – SEPTEMBER 1999 – REVISED MAY 2013 www.ti.com Operating Ratings TMIN ≤ TA ≤ TMAX Temperature Range −40°C ≤ TA ≤ +85°C 2.7V ≤ VDD ≤ 5.5V Supply Voltage Electrical Characteristics VDD = 5V (1) (2) The following specifications apply for VDD = 5V, for all available packages, unless otherwise specified.
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LM4864 www.ti.com SNAS109F – SEPTEMBER 1999 – REVISED MAY 2013 Electrical Characteristics VDD = 3V (1) (2) The following specifications apply for VDD = 3V, for all available packages, unless otherwise specified.
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LM4864 SNAS109F – SEPTEMBER 1999 – REVISED MAY 2013 www.ti.com External Components Description (See Figure 1) Components Functional Description 1. Ri Inverting input resistance which sets the closed-loop gain in conjunction with RF. This resistor also forms a high pass filter with Ci at fc = 1/(2π RiCI). 2. Ci Input coupling capacitor which blocks the DC voltage at the amplifier's input terminals. Also creates a highpass filter with Ri at fc = 1/(2π RiCi).
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LM4864 www.ti.com SNAS109F – SEPTEMBER 1999 – REVISED MAY 2013 Typical Performance Characteristics THD+N vs Frequency THD+N vs Frequency Figure 5. Figure 6. THD+N vs Frequency THD+N vs Frequency Figure 7. Figure 8. THD+N vs Frequency THD+N vs Frequency Figure 9. Figure 10.
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LM4864 SNAS109F – SEPTEMBER 1999 – REVISED MAY 2013 www.ti.com Typical Performance Characteristics (continued) 8 THD+N vs Output Power THD+N vs Output Power Figure 11. Figure 12. THD+N vs Output Power THD+N vs Output Power Figure 13. Figure 14. THD+N vs Output Power THD+N vs Output Power Figure 15. Figure 16.
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LM4864 www.ti.com SNAS109F – SEPTEMBER 1999 – REVISED MAY 2013 Typical Performance Characteristics (continued) Output Power vs Supply Voltage Output Power vs Supply Voltage Figure 17. Figure 18. Output Power vs Supply Voltage Output Power vs Load Resistance Figure 19. Figure 20. Power Dissipation vs Output Power Power Derating Curve Figure 21. Figure 22.
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LM4864 SNAS109F – SEPTEMBER 1999 – REVISED MAY 2013 www.ti.com Typical Performance Characteristics (continued) 10 Dropout Voltage vs Supply Voltage Noise Floor Figure 23. Figure 24. Frequency Response vs Input Capacitor Size Power Supply Rejection Ratio Figure 25. Figure 26. Open Loop Frequency Response Supply Current vs Supply Voltage Figure 27. Figure 28.
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LM4864 www.ti.com SNAS109F – SEPTEMBER 1999 – REVISED MAY 2013 Typical Performance Characteristics for the LM4864LD (1) (1) THD+N vs Frequency THD+N vs Frequency Figure 29. Figure 30. THD+N vs Power Out THD+N vs Power Out Figure 31. Figure 32. Output Power vs Supply Voltage Power Dissipation vs Output Power Figure 33. Figure 34. The NGY0010A package has its exposed-DAP soldered to an exposed 1.2in2 area of 1oz printed circuit board copper.
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LM4864 SNAS109F – SEPTEMBER 1999 – REVISED MAY 2013 www.ti.com APPLICATION INFORMATION BRIDGE CONFIGURATION EXPLANATION As shown in Figure 1, the LM4864 has two operational amplifiers internally, allowing for a few different amplifier configurations. The first amplifier's gain is externally configurable, while the second amplifier is internally fixed in a unity-gain, inverting configuration.
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LM4864 www.ti.com SNAS109F – SEPTEMBER 1999 – REVISED MAY 2013 EXPOSED-DAP PACKAGE PCB MOUNTING CONSIDERATION The LM4864's exposed-dap (die attach paddle) package (NGY) provides a low thermal resistance between the die and the PCB to which the part is mounted and soldered. This allows rapid heat transfer from the die to the surrounding PCB copper traces, ground plane, and surrounding air. The NGY package should have its DAP soldered to a copper pad on the PCB.
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LM4864 SNAS109F – SEPTEMBER 1999 – REVISED MAY 2013 www.ti.com In addition to system cost and size, click and pop performance is effected by the size of the input coupling capacitor, Ci. A larger input coupling capacitor requires more charge to reach its quiescent DC voltage (nominally ½ VDD). This charge comes from the output via the feedback and is apt to create pops upon device enable. Thus, by minimizing the capacitor size based on necessary low frequency response, turn-on pops can be minimized.
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LM4864 www.ti.com SNAS109F – SEPTEMBER 1999 – REVISED MAY 2013 The high frequency pole is determined by the product of the desired high frequency pole, fH, and the differential gain, AVD. With a AVD = 2 and fH = 100 kHz, the resulting GBWP = 100 kHz which is much smaller than the LM4864 GBWP of 18 MHz. This figure displays that if a designer has a need to design an amplifier with a higher differential gain, the LM4864 can still be used without running into bandwidth problems.
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LM4864 SNAS109F – SEPTEMBER 1999 – REVISED MAY 2013 www.ti.com LM4864 MDC MWC 725MW Audio Power Amplifier With Shutdown Mode Figure 38. Die Layout (B - Step) Table 1.
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LM4864 www.ti.com SNAS109F – SEPTEMBER 1999 – REVISED MAY 2013 REVISION HISTORY Changes from Revision E (May 2013) to Revision F • Page Changed layout of National Data Sheet to TI format ..........................................................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.
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PACKAGE MATERIALS INFORMATION www.ti.com 8-May-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM4864MM VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM4864MM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM4864MMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 8-May-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM4864MM VSSOP DGK 8 1000 210.0 185.0 35.0 LM4864MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM4864MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 LM4864MX/NOPB SOIC D 8 2500 367.0 367.0 35.
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