Datasheet
LM628, LM629
SNVS781C –JUNE 1999–REVISED MARCH 2013
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Connection Diagrams
LM628N LM629N LM629M
*Do not connect.
Figure 2. See Package Number DW or N
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
Voltage at Any Pin with Respect to GND −0.3V to +7.0V
Ambient Storage Temperature −65°C to +150°C
28-pin PDIP Package (Soldering, 4 sec.) 260°C
Lead Temperature
24-pin SOIC Package (Soldering, 10 sec.) 300°C
Maximum Power Dissipation (T
A
≤ 85°C)
(3)
605 mW
ESD Tolerance (C
ZAP
= 120 pF, R
ZAP
= 1.5k) 1000V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond the above Operating Ratings.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) When operating at ambient temperatures above 70°C, the device must be protected against excessive junction temperatures. Mounting
the package on a printed circuit board having an area greater than three square inches and surrounding the leads and body with wide
copper traces and large, uninterrupted areas of copper, such as a ground plane, suffices. The 28-pin DIP (N) and the 24-pin surface
mount package (M) are molded plastic packages with solid copper lead frames. Most of the heat generated at the die flows from the die,
through the copper lead frame, and into copper traces on the printed circuit board. The copper traces act as a heat sink. Double-sided
or multi-layer boards provide heat transfer characteristics superior to those of single-sided boards.
Operating Ratings
Temperature Range −40°C < T
A
< +85°C
LM628N-6, LM629N-6, LM629M-6 1.0 MHz < f
CLK
< 6.0 MHz
Clock Frequency
LM628N-8, LM629N-8, LM629M-8 1.0 MHz < f
CLK
< 8.0 MHz
V
DD
Range 4.5V < V
DD
< 5.5V
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