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LM70

www.ti.com

SNIS112G –JUNE 2000–REVISED MARCH 2013

LM70 SPI/MICROWIRE 10-Bit plus Sign Digital Temperature Sensor

Check for Samples: LM70

FEATURES

DESCRIPTION

• 0.25°C Temperature Resolution.

The LM70 is a temperature sensor, Delta-Sigma

• Shutdown Mode Conserves Power Between

analog-to-digital converter with an SPI and

Temperature Reading

MICROWIRE compatible interface available in WSON

• SPI and MICROWIRE Bus Interface

and VSSOP 8-pin packages. The host can query the

LM70 at any time to read temperature. A shutdown

• VSSOP-8 and WSON-8 Packages Save Space

mode decreases power consumption to less than 10

• UL Recognized Component

µA. This mode is useful in systems where low

average power consumption is critical.

APPLICATIONS

The LM70 has 10-bit plus sign temperature resolution

• System Thermal Management

(0.25°C per LSB) while operating over a temperature

• Personal Computers

range of −55°C to +150°C.

• Disk Drives

The LM70's 2.65V to 5.5V supply voltage range, low

• Office Electronics

supply current and simple SPI interface make it ideal

for a wide range of applications. These include

• Electronic Test Equipment

thermal management and protection applications in

hard disk drives, printers, electronic test equipment,

KEY SPECIFICATIONS

and office electronics.

• Supply Voltage 2.65V to 5.5V

• Supply Current

– Operating

– 260 μA (typ)

– 490 μA (max)

– Shutdown

– 12 μA (typ)

• Temperature Accuracy

– −40°C to 85°C, ±2°C(max)

– −10°C to 65°C, +1.5/−2°C(max)

– −55°C to 125°C, +3/−2°C(max)

– −55°C to 150°C, +3.5/−2°C(max)

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (21 pages)

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LM70 www.ti.com SNIS112G – JUNE 2000 – REVISED MARCH 2013 LM70 SPI/MICROWIRE 10-Bit plus Sign Digital Temperature Sensor Check for Samples: LM70 FEATURES 1 • • 2 • • • 0.25°C Temperature Resolution.
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LM70 SNIS112G – JUNE 2000 – REVISED MARCH 2013 www.ti.com Simplified Block Diagram Connection Diagram Top View Top View Figure 1. VSSOP-8 Package See Package Number DGK0008A Figure 2. WSON-8 Package See Package Number NGK0008A PIN DESCRIPTIONS VSSOP-8 Pin No. WSON-8 Pin No. SI/O 1 1 Input/Output - Serial bus bi-directional data line. Schmitt trigger input. From and to Controller SC 2 3 Clock - Serial bus clock Schmitt trigger input line.
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LM70 www.ti.com SNIS112G – JUNE 2000 – REVISED MARCH 2013 Typical Application Figure 3. COP Microcontroller Interface These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
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LM70 SNIS112G – JUNE 2000 – REVISED MARCH 2013 www.ti.com Absolute Maximum Ratings (1) −0.3V to 6.0V Supply Voltage −0.3V to V+ + 0.
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LM70 www.ti.com SNIS112G – JUNE 2000 – REVISED MARCH 2013 Logic Electrical Characteristics Digital DC Characteristics Unless otherwise noted, these specifications apply for V+ = 2.65V to 3.6V for the LM70-3 and V+ = 4.5V to 5.5V for the LM705. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ=+25°C, unless otherwise noted.
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LM70 SNIS112G – JUNE 2000 – REVISED MARCH 2013 www.ti.com Timing Diagrams Figure 4. Data Output Timing Diagram Figure 5. TRI-STATE Data Output Timing Diagram Figure 6.
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LM70 www.ti.com SNIS112G – JUNE 2000 – REVISED MARCH 2013 Figure 7. Temperature-to-Digital Transfer Function (Non-linear scale for clarity) Figure 8.
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LM70 SNIS112G – JUNE 2000 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics Average Power-On Reset Voltage vs Temperature Static Supply Current vs Temperature Figure 9. Figure 10. Temperature Error Figure 11.
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LM70 www.ti.com SNIS112G – JUNE 2000 – REVISED MARCH 2013 FUNCTIONAL DESCRIPTION The LM70 temperature sensor incorporates a band-gap type temperature sensor and 10-bit plus sign ΔΣ ADC (Delta-Sigma Analog-to-Digital Converter). Compatibility of the LM70's three wire serial interface with SPI and MICROWIRE allows simple communications with common microcontrollers and processors. Shutdown mode can be used to optimize current drain for different applications.
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LM70 SNIS112G – JUNE 2000 – REVISED MARCH 2013 www.ti.com Note that 210 ms will have to pass for a conversion to complete before the LM70 actually transmits temperature data. TEMPERATURE DATA FORMAT Temperature data is represented by a 11-bit, two's complement word with an LSB (Least Significant Bit) equal to 0.25°C: Digital Output Temperature Binary Hex +150°C 0100 1011 0001 1111 4B 1Fh +125°C 0011 1110 1001 1111 3E 9Fh +25°C 0000 1100 1001 1111 0B 9Fh +0.
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LM70 www.ti.com SNIS112G – JUNE 2000 – REVISED MARCH 2013 TEMPERATURE REGISTER Table 2. (Read Only): D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 MSB Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 LSB 1 1 1 X X D0–D1: Undefined. TRI-STATE will be output on SI/0. D2–D4: Always set high. D5–D15: Temperature Data. One LSB = 0.25°C. Two's complement format. MANUFACTURER'S/DEVICE ID REGISTER Table 3.
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LM70 SNIS112G – JUNE 2000 – REVISED MARCH 2013 www.ti.com Application Hints To get the expected results when measuring temperature with an integrated circuit temperature sensor like the LM70, it is important to understand that the sensor measures its own die temperature. For the LM70, the best thermal path between the die and the outside world is through the LM70's pins. In the VSSOP-8 package the ground pin is connected to the back side of the LM70 die and thus has the most effect on the die temperature.
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LM70 www.ti.com SNIS112G – JUNE 2000 – REVISED MARCH 2013 Figure 16.
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LM70 SNIS112G – JUNE 2000 – REVISED MARCH 2013 www.ti.com REVISION HISTORY Changes from Revision F (March 2013) to Revision G • 14 Page Changed layout of National Data Sheet to TI format ..........................................................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com (4) 1-Nov-2013 There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
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PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM70CILD-3/NOPB WSON NGK 8 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1 LM70CILD-5/NOPB WSON NGK 8 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1 LM70CILDX-3/NOPB WSON NGK 8 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM70CILD-3/NOPB WSON NGK 8 1000 213.0 191.0 55.0 LM70CILD-5/NOPB WSON NGK 8 1000 213.0 191.0 55.0 LM70CILDX-3/NOPB WSON NGK 8 4500 367.0 367.0 35.0 LM70CIMM-3 VSSOP DGK 8 1000 210.0 185.0 35.0 LM70CIMM-3/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM70CIMM-5 VSSOP DGK 8 1000 210.0 185.0 35.
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MECHANICAL DATA NGK0008A LDA08A (Rev C) www.ti.
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