Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLinear ICsLinear IC - Op-amp Current feedback SOT 23 5

10M 100M 1G

FREQUENCY (Hz)

-7

-6

-5

-4

-3

-2

-1

GAIN (dB)

-430

-380

-330

-280

-230

-180

-130

-80

-30

PHASE

(

)

= -1

= -10

= -4

= -2

OUT

= 2V

= 237:

= 100:

PHASE

GAIN

10M 100M

FREQUENCY (Hz)

-105

-100

-95

-90

-85

-80

-75

-70

-65

-60

-40

HD (dBc)

-55

-50

-45

= +2

= 237:

HD2, R

= 100:

HD3, R

= 100:

HD2, R

= 1k:

HD3, R

= 1k:

LMH6702

www.ti.com

SNOSA03F –NOVEMBER 2002–REVISED MARCH 2013

LMH6702 1.7 GHz, Ultra Low Distortion, Wideband Op Amp

Check for Samples: LMH6702

FEATURES

DESCRIPTION

The LMH6702 is a very wideband, DC coupled

= ±5V, T

= 25°C, A

= +2V/V, R

= 100Ω,

monolithic operational amplifier designed specifically

OUT

= 2V

, Typical Unless Noted:

for wide dynamic range systems requiring exceptional

• 2

Harmonics (5MHz, SOT-23) −100/−96dBc

signal fidelity. Benefiting from current feedback

• −3dB Bandwidth (V

OUT

= 0.5 V

) 1.7 GHz

architecture, the LMH6702 offers unity gain stability at

exceptional speed without need for external

• Low Noise 1.83nV/√Hz

compensation.

• Fast Settling to 0.1% 13.4ns

With its 720MHz bandwidth (A

= 2V/V, V

= 2V

• Fast Slew Rate 3100V/μs

10-bit distortion levels through 60MHz (R

= 100Ω),

• Supply Current 12.5mA

1.83nV/√Hz input referred noise and 12.5mA supply

• Output Current 80mA

current, the LMH6702 is the ideal driver or buffer for

high-speed flash A/D and D/A converters.

• Low Intermodulation Distortion (75MHz)

−67dBc

Wide dynamic range systems such as radar and

communication receivers, requiring a wideband

• Improved Replacement for CLC409 and

amplifier offering exceptional signal purity, will find the

CLC449

LMH6702's low input referred noise and low harmonic

and intermodulation distortion make it an attractive

APPLICATIONS

high speed solution.

• Flash A/D Driver

The LMH6702 is constructed using VIP10™

• D/A Transimpedance Buffer

complimentary bipolar process and proven current

• Wide Dynamic Range IF amp

feedback architecture. The LMH6702 is available in

SOIC and SOT-23 packages.

• Radar/Communication Receivers

• Line Driver

• High Resolution Video

Figure 1. Inverting Frequency Response Figure 2. Harmonic Distortion vs. Load and

Frequency

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2VIP10 is a trademark of Texas Instruments.

3All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (21 pages)

PAGE 1
LMH6702 www.ti.com SNOSA03F – NOVEMBER 2002 – REVISED MARCH 2013 LMH6702 1.7 GHz, Ultra Low Distortion, Wideband Op Amp Check for Samples: LMH6702 FEATURES DESCRIPTION 1 VS = ±5V, TA = 25°C, AV = +2V/V, RL = 100Ω, VOUT = 2VPP, Typical Unless Noted: 23 • 2nd/3rd Harmonics (5MHz, SOT-23) −100/−96dBc −3dB Bandwidth (VOUT = 0.5 VPP) 1.7 GHz Low Noise 1.83nV/√Hz Fast Settling to 0.1% 13.4ns Fast Slew Rate 3100V/μs Supply Current 12.
PAGE 2
LMH6702 SNOSA03F – NOVEMBER 2002 – REVISED MARCH 2013 www.ti.com Absolute Maximum Ratings (1) (2) VS ±6.75V IOUT See (3) Common Mode Input Voltage − V to V+ Maximum Junction Temperature +150°C −65°C to +150°C Storage Temperature Range Soldering Information ESD Tolerance (4) Infrared or Convection (20 sec.) 235°C Wave Soldering (10 sec.
PAGE 3
LMH6702 www.ti.
PAGE 4
LMH6702 SNOSA03F – NOVEMBER 2002 – REVISED MARCH 2013 www.ti.com Connection Diagrams N/C 1 8 N/C 1 5 OUT -IN 2 - 7 + 6 V + V +IN 3 - 2 OUT + V - 4 5 +IN N/C Figure 3. 8-Pin SOIC Top View 4 + V 3 4 -IN Figure 4.
PAGE 5
LMH6702 www.ti.com SNOSA03F – NOVEMBER 2002 – REVISED MARCH 2013 Typical Performance Characteristics (TA = 25°C, VS = ±5V, RL = 100Ω, Rf = 237Ω; Unless Specified).
PAGE 6
LMH6702 SNOSA03F – NOVEMBER 2002 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) (TA = 25°C, VS = ±5V, RL = 100Ω, Rf = 237Ω; Unless Specified). Step Response, 6VPP Percent Settling vs Time 1 4 AV = +2 3 RL = 100: SETTLING ERROR (%) 2 VOUT (V) RL = 100: VOUT = 6VPP 1 0 -1 -2 0.1 0.01 -3 0.001 -4 0 10 20 30 40 50 1 60 10 Figure 12. Harmonic Distortion vs.
PAGE 7
LMH6702 www.ti.com SNOSA03F – NOVEMBER 2002 – REVISED MARCH 2013 Typical Performance Characteristics (continued) (TA = 25°C, VS = ±5V, RL = 100Ω, Rf = 237Ω; Unless Specified). HD3 vs. Output Power (across 100Ω) (SOIC package) Input Offset for 3 Representative Units 0.5 -50 AV = +2 60MHz RF = 237: -60 -0.5 RL = 100: -70 -1 VOS (mV) HD (dBc) UNIT 1 0 20MHz -80 -90 -1.5 -2 UNIT 2 -2.5 -100 10MHz UNIT 3 5MHz -3 -110 -3.
PAGE 8
LMH6702 SNOSA03F – NOVEMBER 2002 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) (TA = 25°C, VS = ±5V, RL = 100Ω, Rf = 237Ω; Unless Specified). Transimpedance DG/DP (NTSC) VS = ±5V RL = 100: GAIN (dB) 90 0.02 180 160 MAG 80 140 70 120 60 100 PHASE 50 80 40 60 30 40 20 100k 1M 10M 100M 0.004 DP 0.002 0.01 0 0 -0.002 -0.01 DG -0.004 -0.02 20 10k RF = 237: RL = 150: DG (%) 100 NTSC 200 PHASE (°) 110 0.006 0.03 220 DP (°) 120 -0.
PAGE 9
LMH6702 www.ti.com SNOSA03F – NOVEMBER 2002 – REVISED MARCH 2013 APPLICATION SECTION FEEDBACK RESISTOR +5V 6.8µF AV = 1 +RF/RG = VOUT/VIN .01µF VIN 3 VOUT 6 CSS 0.1µF RIN 7 CPOS + LMH6702 2 4 CNEG RF .01µF RG 6.8µF -5V Figure 26. Recommended Non-Inverting Gain Circuit +5V 6.8µF RF .01µF 3 25: AV = = VOUT VIN 7 CPOS + VOUT 6 CSS 0.1µF RG LMH6702 2 VIN RG 4 CNEG .01µF RT 6.8µF -5V RF SELECT RT TO YIELD DESIRED RIN = RT||RG Figure 27.
PAGE 10
LMH6702 SNOSA03F – NOVEMBER 2002 – REVISED MARCH 2013 www.ti.com If this lay out technique has not been observed on a particular application board, designer may actually find that supply decoupling caps could adversely affect HD2 performance by increasing the coupling phenomenon already mentioned. Figure 28 below shows actual HD2 data on a board where the ground plane is "shared" between the supply decoupling capacitors and the rest of the circuit.
PAGE 11
LMH6702 www.ti.com SNOSA03F – NOVEMBER 2002 – REVISED MARCH 2013 2-TONE 3rd ORDER INTERMODULATION The 2-tone, 3rd order spurious plot shows a relatively constant difference between the test power level and the spurious level with the difference depending on frequency. The LMH6702 does not show an intercept type performance, (where the relative spurious levels change at a 2X rate vs.
PAGE 12
LMH6702 SNOSA03F – NOVEMBER 2002 – REVISED MARCH 2013 www.ti.com DC ACCURACY AND NOISE Example below shows the output offset computation equation for the non-inverting configuration using the typical bias current and offset specifications for AV = + 2: Output Offset : VO = (±IBN · RIN ± VIO) (1 + RF/RG) ± IBI · RF (1) Where RIN is the equivalent input impedance on the non-inverting input. Example computation for AV = +2, RF = 237Ω, RIN = 25Ω: VO = (±6μA · 25Ω ± 1mV) (1 + 237/237) ± 8μA · 237 = ±4.
PAGE 13
LMH6702 www.ti.com SNOSA03F – NOVEMBER 2002 – REVISED MARCH 2013 REVISION HISTORY Changes from Revision E (March 2013) to Revision F • Page Changed layout of National Data Sheet to TI format ..........................................................................................................
PAGE 14
PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.
PAGE 16
PACKAGE MATERIALS INFORMATION www.ti.com 21-Mar-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LMH6702MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LMH6702MF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LMH6702MFX/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.
PAGE 17
PACKAGE MATERIALS INFORMATION www.ti.com 21-Mar-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMH6702MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LMH6702MF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LMH6702MFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.
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