Datasheet

LMP91002
www.ti.com SNIS163A –APRIL 2012–REVISED MARCH 2013
Absolute Maximum Ratings
(1)(2)(3)
Human Body Model 2kV
ESD Tolerance
(4)
Charge-Device Model 1kV
Machine Model 200V
Voltage between any two pins 6.0V
Current through VDD or VSS 50mA
Current sunk and sourced by CE pin 10mA
Current out of other pins
(5)
5mA
Storage Temperature Range -65°C to 150°C
Junction Temperature
(6)
150°C
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Operating Ratings is not implied. Operating Ratings indicate conditions at which the
device is functional and the device should not be operated beyond such conditions.
(2) For soldering specifications, see www.ti.com/lit/SNOA549.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(4) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC) Field- Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(5) All non-power pins of this device are protected against ESD by snapback devices. Voltage at such pins will rise beyond absmax if
current is forced into pin.
(6) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
, and the ambient temperature, T
A
. The maximum allowable power
dissipation at any ambient temperature is P
DMAX
= (T
J(MAX)
- T
A
)/ θ
JA
All numbers apply for packages soldered directly onto a PC board.
Operating Ratings
(1)
Supply Voltage V
S
= (VDD - AGND) 2.7V to 3.6V
Temperature Range
(2)
-40°C to 85°C
Package Thermal Resistance
(2)
14-Pin WSON (θ
JA
) 44 °C/W
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Operating Ratings is not implied. Operating Ratings indicate conditions at which the
device is functional and the device should not be operated beyond such conditions.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
, and the ambient temperature, T
A
. The maximum allowable power
dissipation at any ambient temperature is P
DMAX
= (T
J(MAX)
- T
A
)/ θ
JA
All numbers apply for packages soldered directly onto a PC board.
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