Datasheet

1
FEATURES
LMV341
DBV OR DCK P
OP VIEW)
ACKAGE
(T
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1OUT
1IN-
1IN+
V
+
2IN+
2IN-
2OUT
4OUT
4IN-
4IN+
GND
3IN+
3IN-
3OUT
LMV344
PW P
OP VIEW)
ACKAGE
(T
1
2
3
6
4
V
+
OUTIN–
GND
IN+
5
SHDN
DESCRIPTION/ORDERING INFORMATION
LMV341-Q1
LMV344-Q1
www.ti.com
.............................................................................................................................................................. SGLS342C JULY 2006 REVISED JUNE 2009
RAIL-TO-RAIL OUTPUT CMOS OPERATIONAL AMPLIFIERS
Qualified for Automotive Applications Low Supply Current: 100 µ A Typ
2.7-V and 5-V Performance Gain Bandwidth: 1 MHz Typ
Rail-to-Rail Output Swing Slew Rate: 1 V/ µ s Typ
Input Bias Current: 1 pA Typ Turn-On Time From Shutdown: 5 µ s Typ
Input Offset Voltage: 0.25 mV Typ Input Referred Voltage Noise (at 10 kHz):
20 nV/ Hz
The LMV341 and LMV344 devices are single and quad CMOS operational amplifiers, respectively, with low
voltage, low power, and rail-to-rail output swing capabilities. The PMOS input stage offers an ultra-low input bias
current of 1 pA (typ) and an offset voltage of 0.25 mV (typ). The single supply amplifier is designed specifically
for low-voltage (2.7 V to 5 V) operation, with a wide common-mode input voltage range that typically extends
from 0.2 V to 0.8 V from the positive supply rail. Additional features are a 20-nV/ Hz voltage noise at 10 kHz,
1-MHz unity-gain bandwidth, 1-V/ µ s slew rate, and 100- µ A current consumption per channel.
An extended industrial temperature range from 40 ° C to 125 ° C makes this device suitable for automotive
applications.
ORDERING INFORMATION
(1)
T
A
PACKAGE
(2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
SC-70 DCK Reel of 3000 LMV341QDCKRQ1 RR_
40 ° C to 125 ° C SOT-23 DBV Reel of 3000 LMV341QDBVRQ1 RCH_
TSSOP PW Reel of 2000 LMV344IPWRQ1 LMV344Q
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com .
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
(3) DBV/DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006 2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

Summary of content (27 pages)