Datasheet

LMV7210DBV or DCK PACKAGE
(TOP VIEW)
LMV7220D, DGK, OR DRG PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
V
CC
+
2OUT
2IN−
2IN+
1OUT
1IN−
1IN+
V
CC−
1
2
3
5
4
OUT
V
CC−
IN+
V
CC+
IN−
LMV721
LMV722
www.ti.com
SLOS470C JUNE 2005REVISED SEPTEMBER 2010
10-MHz LOW-NOISE LOW-VOLTAGE LOW-POWER
OPERATIONAL AMPLIFIERS
Check for Samples: LMV721, LMV722
1
FEATURES
Power-Supply Voltage Range: 2.2 V to 5.5 V
Low Supply Current: 930 mA/Amplifier at 2.2 V
High Unity-Gain Bandwidth: 10 MHz
Rail-to-Rail Output Swing
600- Load: 120 mV From Either Rail at
2.2 V
2-k Load: 50 mV From Either Rail at 2.2 V
Input Common-Mode Voltage Range Includes
Ground
Input Voltage Noise: 9 nV/Hz at f = 1 kHz
APPLICATIONS
Cellular and Cordless Phones
Active Filter and Buffers
Laptops and PDAs
Battery Powered Electronics
DESCRIPTION/ORDERING INFORMATION
The LMV721 (single) and LMV722 (dual) are low-noise low-voltage low-power operational amplifiers that can be
designed into a wide range of applications. The LMV721 and LMV722 have a unity-gain bandwidth of 10 MHz, a
slew rate of 5 V/ms, and a quiescent current of 930 mA/amplifier at 2.2 V.
The LMV721 and LMV722 are designed to provide optimal performance in low-voltage and low-noise systems.
They provide rail-to-rail output swing into heavy loads. The input common-mode voltage range includes ground,
and the maximum input offset voltage are 3.5 mV (over recommended temperature range) for the devices. Their
capacitive load capability is also good at low supply voltages. The operating range is from 2.2 V to 5.5 V.
ORDERING INFORMATION
(1)
T
A
PACKAGE
(2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
Reel of 3000 LMV721IDCKR
SC-70 – DCK RK_
Single Reel of 250 LMV721IDCKT
SOT-23 – DBV Reel of 3000 LMV721IDBVR RBF_
–40°C to 105°C Reel of 2500 LMV722IDR
SOIC – D MV722I
Tube of 75 LMV722ID
Dual
VSSOP – DGK Reel of 2500 LMV722IDGKR R6_
QFN – DRG Reel of 2500 LMV722IDRGR ZYY
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) DBV/DCK/DGK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005–2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

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