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LMZ10504

www.ti.com

SNVS610M –DECEMBER 2009–REVISED OCTOBER 2013

LMZ10504 4A SIMPLE SWITCHER® Power Module with 5.5V Maximum Input Voltage

Check for Samples: LMZ10504

KEY FEATURES

ELECTRICAL SPECIFICATIONS

• Integrated Shielded Inductor

• 20W Maximum Total Output Power

• Flexible Startup Sequencing Using External

• Up to 4A Output Current

Soft-Start, Tracking, and Precision Enable

• Input Voltage Range 2.95V to 5.5V

• Protection Against In-Rush Currents and

• Output Voltage Range 0.8V to 5V

Faults Such as Input UVLO and Output Short-

Circuit

• ±1.63% Feedback Voltage Accuracy Over

Temperature

• -40°C to +125°C Junction Temperature

Operating Range

• Efficiency up to 96%

• Single Exposed Pad and Standard Pinout for

PERFORMANCE BENEFITS

Easy Mounting and Manufacturing

• Pin-to-Pin Compatible with

• Operates at High Ambient Temperatures

– LMZ10503 (3A/15W max)

• High Efficiency up to 96% Reduces System

Heat Generation

– LMZ10505 (5A/25W max)

• Low Radiated Emissions (EMI) Complies with

• Fully Enable for WEBENCH® and Power

EN55022 Class B Standard

(2)

Designer

• Passes 10V/m Radiated Immunity EMI Test

APPLICATIONS

Standard EN61000 4-3

• Low Output Voltage Ripple of 10 mV Allows

• Point-of-Load Conversions from 3.3V and 5V

for Powering Noise-Sensitive Transceiver and

Rails

Signaling ICs

• Space Constrained Applications

• Fast Transient Response for Powering FPGAs

• Extreme Temperatures/no Air Flow

and ASICs

Environments

• Noise Sensitive Applications (i.e. Transceiver,

DESCRIPTION

Medical)

The LMZ10504 SIMPLE SWITCHER® power module

is a complete, easy-to-use DC-DC solution capable of

driving up to a 4A load with exceptional power

conversion efficiency, output voltage accuracy, line

and load regulation. The LMZ10504 is available in an

innovative package that enhances thermal

performance and allows for hand or machine

soldering.

Figure 1. Easy to Use PFM 7 Pin Package

10.16 x 13.77 x 4.57 mm (0.4 x 0.39 x 0.18 in)

= 20°C/W, θ

= 1.9°C/W

(1)(1)

RoHS Compliant

Peak Reflow Case Temp = 245°C

Power Module SMT Guidelines

(1) θ

measured on a 2.25” x 2.25” (5.8 cm x 5.8 cm) four layer

board, with one ounce copper, thirty six thermal vias, no air

flow, and 1W power dissipation. Refer to PCB Layout

Diagrams or Evaluation Board Application Note: AN-2022 (2) EN 55022:2006, +A1:2007, FCC Part 15 Subpart B: 2007.

(SNVA421). See Table 9 and layout for information on device under test.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (31 pages)

PAGE 1
LMZ10504 www.ti.com SNVS610M – DECEMBER 2009 – REVISED OCTOBER 2013 LMZ10504 4A SIMPLE SWITCHER® Power Module with 5.
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LMZ10504 SNVS610M – DECEMBER 2009 – REVISED OCTOBER 2013 www.ti.com DESCRIPTION (CONTINUED) The LMZ10504 can accept an input voltage rail between 2.95V and 5.5V and deliver an adjustable and highly accurate output voltage as low as 0.8V. One megahertz fixed frequency PWM switching provides a predictable EMI characteristic. Two external compensation components can be adjusted to set the fastest response time, while allowing the option to use ceramic and/or electrolytic output capacitors.
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LMZ10504 www.ti.com SNVS610M – DECEMBER 2009 – REVISED OCTOBER 2013 Typical Application Circuit VIN VOUT 1 VIN Cin 2 VOUT 6, 7 LMZ10504 FB EN SS CO 5 GND 4, EP 3 Rfbt CSS Rcomp Ccomp Rfbb Connection Diagram Exposed Pad Connect to GND 7 VOUT 6 VOUT 5 FB 4 GND 3 SS 2 EN 1 VIN Figure 5. Top View 7-Lead PFM Package Number NDW0007A PIN DESCRIPTIONS Pin Number Name 1 VIN Power supply input.
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LMZ10504 SNVS610M – DECEMBER 2009 – REVISED OCTOBER 2013 www.ti.com Absolute Maximum Ratings (1) (2) VIN, VOUT, EN, FB, SS to GND -0.3V to 6.0V ESD Susceptibility (3) ±2 kV Power Dissipation Internally Limited Junction Temperature 150°C Storage Temperature Range -65°C to 150°C Peak Reflow Case Temperature (30 sec) 245°C For soldering specifications, refer to the following document: www.ti.
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LMZ10504 www.ti.com SNVS610M – DECEMBER 2009 – REVISED OCTOBER 2013 Electrical Characteristics Specifications with standard typeface are for TJ = 25°C only; limits in bold face type apply over the operating junction temperature range TJ of -40°C to 125°C. Minimum and maximum limits are ensured through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. VIN = VEN = 3.
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LMZ10504 SNVS610M – DECEMBER 2009 – REVISED OCTOBER 2013 www.ti.com Electrical Characteristics Specifications with standard typeface are for TJ = 25°C only; limits in bold face type apply over the operating junction temperature range TJ of -40°C to 125°C. Minimum and maximum limits are ensured through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. VIN = VEN = 3.
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LMZ10504 www.ti.com SNVS610M – DECEMBER 2009 – REVISED OCTOBER 2013 Typical Performance Characteristics Unless otherwise specified, the following conditions apply: VIN = VEN = 5.0V, CIN is 47 µF 10V X5R ceramic capacitor; TAMBIENT = 25°C for efficiency curves and waveforms. Load Transient Response VIN = 3.3V, VOUT = 2.5V, IOUT = 0.4A to 3.6A to 0.4A step 20 mV/DIV, 20 MHz Bandwidth Limited Refer to Table 5 for BOM, includes optional components Load Transient Response VIN = 5.0V, VOUT = 2.5V, IOUT = 0.
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LMZ10504 SNVS610M – DECEMBER 2009 – REVISED OCTOBER 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = VEN = 5.0V, CIN is 47 µF 10V X5R ceramic capacitor; TAMBIENT = 25°C for efficiency curves and waveforms. 8 Efficiency VOUT = 3.3V Efficiency VOUT = 2.5V Figure 10. Figure 11. Efficiency VOUT = 1.8V Efficiency VOUT = 1.5V Figure 12. Figure 13. Efficiency VOUT = 1.2V Efficiency VOUT = 0.8V Figure 14. Figure 15.
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LMZ10504 www.ti.com SNVS610M – DECEMBER 2009 – REVISED OCTOBER 2013 Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = VEN = 5.0V, CIN is 47 µF 10V X5R ceramic capacitor; TAMBIENT = 25°C for efficiency curves and waveforms. Current Derating VIN = 5V, θJA = 20°C / W Current Derating VIN = 3.3V, θJA = 20°C / W Figure 16. Figure 17. Radiated Emissions (EN 55022, Class B) VIN = 5V, VOUT = 2.5V, IOUT = 4A Evaluation Board Startup VOUT = 2.
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LMZ10504 SNVS610M – DECEMBER 2009 – REVISED OCTOBER 2013 www.ti.com Block Diagram VIN 1 1: SS Drivers Voltage Mode Control 3 5 2.2 PF 1.5 PH 6, 7 VOUT N-MOSFET 2 EN P-MOSFET 2.2 PF 4, EP FB GND DESIGN GUIDELINE AND OPERATING DESCRIPTION Design Steps LMZ10504 is fully supported by Webench® and offers the following: component selection, performance, electrical, and thermal simulations as well as the Build-It board, for a reduced design time.
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LMZ10504 www.ti.com SNVS610M – DECEMBER 2009 – REVISED OCTOBER 2013 Neglecting capacitor equivalent series resistance (ESR), the resultant input capacitor AC ripple voltage is a triangular waveform. The minimum input capacitance for a given peak-to-peak value (ΔVIN) of VIN is specified as follows: Cin 8 IOUT x D x (1 - D) fSW x 'VIN (1) where the PWM duty cycle, D, is given by: D= VOUT VIN (2) If ΔVIN is 1% of VIN, this equals to 50 mV and fSW = 1 MHz 2.5V ) x (1 - 2.
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LMZ10504 SNVS610M – DECEMBER 2009 – REVISED OCTOBER 2013 www.ti.com The following equation provides a good first pass capacitance requirement for a load transient: Istep x VFB x L x VIN CO t 4 x VOUT x (VIN - VOUT) x 'Vo_tran (11) Where Istep is the peak to peak load step, VFB = 0.8V, and ΔVo_tran is the maximum output voltage deviation, which is ±20 mV. Therefore the capacitance requirement for the given design parameters is: Co 8 3.2A x 0.8V x 1.5 µH x 5V 4 x 2.5V x (5V - 2.
PAGE 13
LMZ10504 www.ti.com SNVS610M – DECEMBER 2009 – REVISED OCTOBER 2013 bandwidth and increased phase margin. Higher bandwidth is associated with faster system response to sudden changes such as load transients. Phase margin changes the characteristics of the response. Lower phase margin is associated with underdamped ringing and higher phase margin is associated with overdamped response.
PAGE 14
LMZ10504 SNVS610M – DECEMBER 2009 – REVISED OCTOBER 2013 www.ti.com (18) As a result, approximately 12 square cm of 1oz. copper on top and bottom layers is required for the PCB design. The PCB copper heat sink must be connected to the exposed pad (EP). Approximately thirty six, 8mils thermal vias spaced 59mils (1.5 mm) apart must connect the top copper to the bottom copper.
PAGE 15
LMZ10504 www.ti.com SNVS610M – DECEMBER 2009 – REVISED OCTOBER 2013 5. Provide adequate device heat-sinking. Use an array of heat-sinking vias to connect the exposed pad to the ground plane on the bottom PCB layer. If the PCB has multiple copper layers, thermal vias can also be employed to make connection to inner layer heatspreading ground planes. For best results use a 6 x 6 via array with minimum via diameter of 8mils thermal vias spaced 59mils (1.5 mm).
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LMZ10504 SNVS610M – DECEMBER 2009 – REVISED OCTOBER 2013 www.ti.com Soft-Start Capacitor Determine the soft-start capacitance with the following relationship CSS = tSS x ISS VFB (20) where VFB is the internal reference voltage (nominally 0.8V), ISS is the soft-start charging current (nominally 2 µA) and CSS is the external soft-start capacitance. Thus, the required soft-start capacitor per unit output voltage startup time is given by CSS = 2.
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LMZ10504 www.ti.com SNVS610M – DECEMBER 2009 – REVISED OCTOBER 2013 RATIOMETRIC STARTUP VOUT1 VOLTAGE VOUT2 EN TIME Tracking - Equal Slew Rates Alternatively, the tracking feature can be used to have similar output voltage ramp rates. This is referred to as simultaneous startup. In this case, the tracking resistors can be determined based on the following equation Rtrkb = 0.8V x Rtrkt VOUT2 - 0.8V (23) and to ensure proper overdrive of the SS pin VOUT2 < 0.
PAGE 18
LMZ10504 SNVS610M – DECEMBER 2009 – REVISED OCTOBER 2013 www.ti.com Over-Temperature Protection When the LMZ10504 senses a junction temperature greater than 145°C (typ.), both switching MOSFETs are turned off and the part enters a standby state. Upon sensing a junction temperature below 135°C (typ.), the part will re-initiate the soft-start sequence and begin switching once again.
PAGE 19
LMZ10504 www.ti.com SNVS610M – DECEMBER 2009 – REVISED OCTOBER 2013 U1 Optional VIN 1 Cin2 + 2 VOUT VIN EN CO1 LMZ10504 Cin1 FB CO3 CO2 Ccomp 5 Rfbt GND SS 3 VOUT 6, 7 Rcomp 4, EP CSS Optional Rfbb Figure 23. Table 5. Bill of Materials, VIN = 3.3V to 5V, VOUT = 2.
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LMZ10504 SNVS610M – DECEMBER 2009 – REVISED OCTOBER 2013 www.ti.com U1 VIN 1 + Cin4 Cin3 Cin2 Cin1 CO1 LMZ10504 Ren1 Cin5 VOUT 6, 7 VOUT VIN FB EN 2 SS 3 CO2 CO3 5 GND 4, EP Rfbt CSS Rcomp Ccomp Rfbb Figure 24. Table 7. Bill of Materials, VIN = 3.3V to 5V, VOUT = 2.
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LMZ10504 www.ti.com SNVS610M – DECEMBER 2009 – REVISED OCTOBER 2013 Table 9. Bill of Materials, VIN = 5V, VOUT = 2.5V, IOUT (MAX) = 4A, Complies with EN55022 Class B Radiated Emissions Designator Description Case Size Manufacturer Manufacturer P/N Quantity U1 SIMPLE SWITCHER® PFM-7 Texas Instruments LMZ10504TZ-ADJ 1 Cin1 1 µF, X7R, 16V 0805 TDK C2012X7R1C105K 1 Cin2 4.7 µF, X5R, 6.3V 0805 TDK C2012X5R0J475K 1 Cin3 47 µF, X5R, 6.
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LMZ10504 SNVS610M – DECEMBER 2009 – REVISED OCTOBER 2013 www.ti.com Figure 27. Internal Layer 1 (Ground) Figure 28.
PAGE 23
LMZ10504 www.ti.com SNVS610M – DECEMBER 2009 – REVISED OCTOBER 2013 Figure 29. Bottom Copper Power Module SMT Guidelines The recommendations below are for a standard module surface mount assembly.
PAGE 24
LMZ10504 SNVS610M – DECEMBER 2009 – REVISED OCTOBER 2013 www.ti.com Figure 30. Sample Reflow Profile Table 11. 24 Probe Max Temp (°C) Reached Max Temp Time Above 235°C Reached 235°C Time Above 245°C Reached 245°C Time Above 260°C Reached 260°C #1 242.5 6.58 0.49 6.39 0.00 – 0.00 – #2 242.5 7.10 0.55 6.31 0.00 7.10 0.00 – #3 241.0 7.09 0.42 6.44 0.00 – 0.
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LMZ10504 www.ti.com SNVS610M – DECEMBER 2009 – REVISED OCTOBER 2013 REVISION HISTORY Changes from Revision L (April 2013) to Revision M Page • Added Peak Reflow Case Temp = 245°C ............................................................................................................................ 1 • Deleted 10 mils .....................................................................................................................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 13-Sep-2014 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
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PACKAGE MATERIALS INFORMATION www.ti.com 1-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device LMZ10504TZ-ADJ/NOPB LMZ10504TZX-ADJ/NOP B Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TOPMOD NDW 7 250 330.0 24.4 10.6 14.22 5.0 16.0 24.0 Q2 TOPMOD NDW 7 500 330.0 24.4 10.6 14.22 5.0 16.0 24.
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PACKAGE MATERIALS INFORMATION www.ti.com 1-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMZ10504TZ-ADJ/NOPB TO-PMOD NDW 7 250 367.0 367.0 45.0 LMZ10504TZX-ADJ/NOPB TO-PMOD NDW 7 500 367.0 367.0 45.
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MECHANICAL DATA NDW0007A BOTTOM SIDE OF PACKAGE TOP SIDE OF PACKAGE TZA07A (Rev D) www.ti.
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