Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsPMICsLMZ12002EXTTZ/NOPB

LMZ12002EXT

www.ti.com

SNVS662F –JUNE 2010–REVISED OCTOBER 2013

LMZ12002EXT 2A SIMPLE SWITCHER® Power Module with 20V Maximum Input Voltage

for Military and Rugged Applications

Check for Samples: LMZ12002EXT

FEATURES

DESCRIPTION

• -55°C to 125°C Junction Temperature Range

The LMZ12002EXT SIMPLE SWITCHER® power

• Integrated Shielded Inductor

module is an easy-to-use step-down DC-DC solution

capable of driving up to 2A load with exceptional

• Simple PCB Layout

power conversion efficiency, line and load regulation,

• Flexible Startup Sequencing Using External

and output accuracy. The LMZ12002EXT is available

Soft-Start Capacitor and Precision Enable

in an innovative package that enhances thermal

• Protection Against Inrush Currents and Faults

performance and allows for hand or machine

Such as Input UVLO and Output Short Circuit

soldering.

• Single Exposed Pad and Standard Pinout for

The LMZ12002EXT can accept an input voltage rail

Easy Mounting and Manufacturing

between 4.5V and 20V and deliver an adjustable and

highly accurate output voltage as low as 0.8V. The

• Fast Transient Response for FPGAs and

LMZ12002EXT only requires three external resistors

ASICs

and four external capacitors to complete the power

• Low Output Voltage Ripple

solution. The LMZ12002EXT is a reliable and robust

• Pin-to-Pin Compatible Family:

design with the following protection features: thermal

shutdown, input under-voltage lockout, output over-

– LMZ14203EXT/2EXT/1EXT (42V max 3A, 2A,

voltage protection, short-circuit protection, output

1A)

current limit, and allows startup into a pre-biased

– LMZ14203/2/1 (42V max 3A, 2A, 1A)

output. A single resistor adjusts the switching

– LMZ12003/2/1 (20V max 3A, 2A, 1A)

frequency up to 1 MHz.

• Fully Webench® Power Designer enabled

PERFORMANCE BENEFITS

APPLICATIONS

• Low Radiated Emissions / High Radiated

• Point of load Conversions from 5V and 12V

Immunity

Input Rail

• Passes Vibration Standard MIL-STD-883

• Time Critical Projects

Method 2007.2 Condition A JESD22–B103B

Condition 1

• Space constrained high Thermal Requirement

Applications

• Passes Drop Standard MIL-STD-883 Method

2002.3 Condition B JESD22–B110 Condition B

• Negative Output Voltage Applications (See AN-

2027 SNVA425)

ELECTRICAL SPECIFICATIONS

• 12W Maximum Total Power Output

• Up to 2A Output Current

• Input Voltage Range 4.5V to 20V

• Output Voltage Range 0.8V to 6V

• Efficiency up to 92%

Figure 1. Easy to use PFM 7 Pin Package

10.16 x 13.77 x 4.57 mm (0.4 x 0.542 x 0.18 in)

= 20°C/W, θ

= 1.9°C/W

RoHS Compliant

Peak Reflow Case Temp = 245° C

Power Module SMT Guidelines

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (27 pages)

PAGE 1
LMZ12002EXT www.ti.
PAGE 2
LMZ12002EXT SNVS662F – JUNE 2010 – REVISED OCTOBER 2013 www.ti.com System Performance Figure 2. Efficiency VIN = 12V VOUT = 5.0V 100 95 EFFICIENCY (%) 90 85 80 75 70 65 60 55 25°C 50 0 1 0.5 2 1.5 OUTPUT CURRENT (A) Figure 3. Thermal Derating Curve VIN = 12V VOUT = 5.0V 2.5 OUTPUT CURRENT (A) 2 1.5 1 0.5 0 50 60 70 80 90 100 110 120 AMBIENT TEMPERATURE (°C) Figure 4. Radiated Emissions (EN 55022 Class B) from Evaluation Board RADIATED EMISSIONS (dBPV/m) 80.0 70.0 60.0 50.
PAGE 3
LMZ12002EXT www.ti.com SNVS662F – JUNE 2010 – REVISED OCTOBER 2013 Simplified Application Schematic VOUT FB SS GND EN VIN VIN RON LMZ12002EXT VOUT @ 2A CFF RON RFBT Enable CIN CSS COUT RFBB Connection Diagram Figure 5. Top View 7-Lead PFM PIN DESCRIPTIONS Pin Name Description 1 VIN Supply input — Nominal operating range is 4.5V to 20V . A small amount of internal capacitance is contained within the package assembly.
PAGE 4
LMZ12002EXT SNVS662F – JUNE 2010 – REVISED OCTOBER 2013 www.ti.com Absolute Maximum Ratings (1) VIN, RON to GND -0.3V to 25V EN, FB, SS to GND -0.3V to 7V Junction Temperature 150°C Storage Temperature Range -65°C to 150°C ESD Susceptibility (2) ±2 kV Peak Reflow Case Temperature (30 sec) 245°C For soldering specifications, refer to the following document: www.ti.com/lit/snoa549c (1) (2) Absolute Maximum Ratings are limits beyond which damage to the device may occur.
PAGE 5
LMZ12002EXT www.ti.com SNVS662F – JUNE 2010 – REVISED OCTOBER 2013 Electrical Characteristics Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -55°C to +125°C. Minimum and Maximum limits are ensured through test, design or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.
PAGE 6
LMZ12002EXT SNVS662F – JUNE 2010 – REVISED OCTOBER 2013 www.ti.com Typical Performance Characteristics Unless otherwise specified, the following conditions apply: VIN = 12V; Cin = 10uF X7R Ceramic; CO = 100uF X7R Ceramic; Tambient = 25 C for efficiency curves and waveforms. 100 Efficiency 4.5V Input 25°C Dissipation 4.5V Input @ 25°C 1.2 1.8 95 1.0 85 80 DISSIPATION (W) EFFICIENCY (%) 90 1.8 1.5 1.2 75 70 65 60 0.8 0.6 1.2 0.4 0.2 55 50 1.5 25°C 25°C 0 0 0.4 0.8 1.2 1.6 2 0 0.
PAGE 7
LMZ12002EXT www.ti.com SNVS662F – JUNE 2010 – REVISED OCTOBER 2013 Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; Cin = 10uF X7R Ceramic; CO = 100uF X7R Ceramic; Tambient = 25 C for efficiency curves and waveforms. Efficiency 8V Input @ 25°C Dissipation 6V Input @ 25°C 1.2 100 95 EFFICIENCY (%) 85 80 75 DISSIPATION (W) 5.0 3.3 2.5 1.8 1.5 1.2 90 70 65 60 5.0 3.3 0.8 2.5 1.8 0.6 1.5 1.2 0.4 0.2 55 50 1.
PAGE 8
LMZ12002EXT SNVS662F – JUNE 2010 – REVISED OCTOBER 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; Cin = 10uF X7R Ceramic; CO = 100uF X7R Ceramic; Tambient = 25 C for efficiency curves and waveforms. Efficiency 4.5V Input @ 85°C Dissipation 4.5V Input @ 85°C 1.6 100 1.8 1.4 1.2 DISSIPATION (W) EFFICIENCY (%) 90 1.8 80 1.2 70 1.5 1.5 1.0 0.8 1.2 0.6 0.4 60 0.2 85°C 85°C 0.0 50 0 0.4 0.8 1.2 1.
PAGE 9
LMZ12002EXT www.ti.com SNVS662F – JUNE 2010 – REVISED OCTOBER 2013 Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; Cin = 10uF X7R Ceramic; CO = 100uF X7R Ceramic; Tambient = 25 C for efficiency curves and waveforms. Efficiency 8V Input @ 85°C Dissipation 8V Input @ 85°C 1.6 100 3.3 5.0 1.4 2.5 1.5 1.8 2.5 1.2 DISSIPATION (W) EFFICIENCY (%) 90 80 1.8 70 1.2 1.5 3.3 1.0 0.8 1.2 5.0 0.6 0.4 60 0.2 85°C 85°C 0.
PAGE 10
LMZ12002EXT SNVS662F – JUNE 2010 – REVISED OCTOBER 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; Cin = 10uF X7R Ceramic; CO = 100uF X7R Ceramic; Tambient = 25 C for efficiency curves and waveforms. Line and Load Regulation @ 25°C Line and Load Regulation @ 85°C 1.825 1.820 1.820 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) 1.814 6 1.808 8 12 1.802 5 20 1.796 1.815 1.810 8 1.805 6 1.800 1.795 12 4.5 4.
PAGE 11
LMZ12002EXT www.ti.com SNVS662F – JUNE 2010 – REVISED OCTOBER 2013 Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; Cin = 10uF X7R Ceramic; CO = 100uF X7R Ceramic; Tambient = 25 C for efficiency curves and waveforms. 3.5 3.3 3.3 OUTPUT CURRENT (A) OUTPUT CURRENT (A) Current Limit 3.3VOUT @ 25°C 3.5 SHORT CIRCUIT 3.1 2.9 ONSET 2.7 Current Limit 1.8VOUT @ 85°C SHORT CIRCUIT 3.1 2.9 ONSET 2.7 25°C 85°C 2.5 2.
PAGE 12
LMZ12002EXT SNVS662F – JUNE 2010 – REVISED OCTOBER 2013 www.ti.com APPLICATION BLOCK DIAGRAM Vin VIN 1 Linear reg Cvcc 5 CIN SS Css CBST 3 EN RON 2 VOUT 7 RON Timer CFF 6 6.8 éH VO Co FB RFBT RFBB 0.47 éF Regulator IC Internal Passives GND 4 COT Control Circuit Overview Constant On Time control is based on a comparator and an on-time one shot, with the output voltage feedback compared with an internal 0.8V reference.
PAGE 13
LMZ12002EXT www.ti.com SNVS662F – JUNE 2010 – REVISED OCTOBER 2013 The LMZ12002EXT demonstration and evaluation boards use 11.8kΩ for RENB and 32.4kΩ for RENT resulting in a rising UVLO of 4.5V. This divider presents 5.34V to the EN input when the divider input is raised to 20V. OUTPUT VOLTAGE SELECTION Output voltage is determined by a divider of two resistors connected between VO and ground. The midpoint of the divider is connected to the FB input. The voltage at FB is compared to a 0.
PAGE 14
LMZ12002EXT SNVS662F – JUNE 2010 – REVISED OCTOBER 2013 www.ti.com CO ≥ 2A*0.8V*10μH*12V / (4*3.3V*( 12V — 3.3V)*33mV) ≥ 50μF The LMZ12002EXT demonstration and evaluation boards are populated with a 100 uF 6.3V X5R output capacitor. Locations for extra output capacitors are provided. See AN-2024 for locations. CIN SELECTION The LMZ12002EXT module contains an internal 0.47 µF input ceramic capacitor.
PAGE 15
LMZ12002EXT www.ti.com SNVS662F – JUNE 2010 – REVISED OCTOBER 2013 If RON calculated in Equation 10 is less than the minimum value determined in Equation 13 a lower frequency should be selected. Alternatively, VIN(MAX) can also be limited in order to keep the frequency unchanged. Additionally note, the minimum off-time of 260 ns limits the maximum duty ratio. Larger RON (lower FSW) should be selected in any application requiring large duty ratio.
PAGE 16
LMZ12002EXT SNVS662F – JUNE 2010 – REVISED OCTOBER 2013 www.ti.com ILR P-P=VO*(VIN- VO)/(10µH*fSW*VIN) (16) Where VIN is the maximum input voltage and fSW is determined from Equation 9. If the output current IO is determined by assuming that IO = IL, the higher and lower peak of ILR can be determined. Be aware that the lower peak of ILR must be positive if CCM operation is required. POWER DISSIPATION AND BOARD THERMAL REQUIREMENTS For the design case of VIN = 12V, VO = 3.
PAGE 17
LMZ12002EXT www.ti.com SNVS662F – JUNE 2010 – REVISED OCTOBER 2013 Both feedback resistors, RFBT and RFBB, and the feed forward capacitor CFF, should be located close to the FB pin. Since the FB node is high impedance, maintain the copper area as small as possible. The trace are from RFBT, RFBB, and CFF should be routed away from the body of the LMZ12002EXT to minimize noise. 4. Make input and output bus connections as wide as possible.
PAGE 18
LMZ12002EXT SNVS662F – JUNE 2010 – REVISED OCTOBER 2013 www.ti.com Figure 42. Pre-Biased Startup Evaluation Board Schematic Diagram U1 EP Enable VIN VOUT FB 1.8VO @ 2A 7 GND SS 6 5 VIN EN 4 3 2 1 RON LMZ12002EXTTZ-ADJ 4.5V to 20V RENT 32.4k CFF 0.022 PF RON 32.4k RENB 11.8k 18 CIN2 10 PF RFBT 1.37k CIN1 1 PF CSS 0.022 PF RFBB 1.
PAGE 19
LMZ12002EXT www.ti.com SNVS662F – JUNE 2010 – REVISED OCTOBER 2013 Ref Des Description Case Size Manufacturer Manufacturer P/N U1 SIMPLE SWITCHER ® PFM-7 Texas Instruments LMZ12002EXTTZ-ADJ Cin1 1 µF, 50V, X7R 1206 Taiyo Yuden UMK316B7105KL-T Cin2 10 µF, 50V, X7R 1210 Taiyo Yuden UMK325BJ106MM-T CO1 1 µF, 50V, X7R 1206 Taiyo Yuden UMK316B7105KL-T CO2 100 µF, 6.3V, X7R 1210 Taiyo Yuden JMK325BJ10CR7MM-T RFBT 1.37 kΩ 0603 Vishay Dale CRCW06031K37FKEA RFBB 1.
PAGE 20
LMZ12002EXT SNVS662F – JUNE 2010 – REVISED OCTOBER 2013 www.ti.
PAGE 21
LMZ12002EXT www.ti.com SNVS662F – JUNE 2010 – REVISED OCTOBER 2013 REVISION HISTORY Changes from Revision E (April 2013) to Revision F Page • Added Peak Reflow Case Temp = 245°C ............................................................................................................................ 1 • Deleted 12mils ......................................................................................................................................................................
PAGE 22
PACKAGE OPTION ADDENDUM www.ti.
PAGE 23
PACKAGE OPTION ADDENDUM www.ti.com 13-Sep-2014 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PAGE 24
PACKAGE MATERIALS INFORMATION www.ti.com 26-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LMZ12002EXTTZ/NOPB TOPMOD NDW 7 250 330.0 24.4 10.6 14.22 5.0 16.0 24.0 Q2 LMZ12002EXTTZX/NOPB TOPMOD NDW 7 500 330.0 24.4 10.6 14.22 5.0 16.0 24.
PAGE 25
PACKAGE MATERIALS INFORMATION www.ti.com 26-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMZ12002EXTTZ/NOPB TO-PMOD NDW 7 250 367.0 367.0 45.0 LMZ12002EXTTZX/NOPB TO-PMOD NDW 7 500 367.0 367.0 45.
PAGE 26
MECHANICAL DATA NDW0007A BOTTOM SIDE OF PACKAGE TOP SIDE OF PACKAGE TZA07A (Rev D) www.ti.
PAGE 27
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.