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LMZ12010

www.ti.com

SNVS667G –FEBRUARY 2010–REVISED OCTOBER 2013

LMZ12010 10A SIMPLE SWITCHER® Power Module with 20V Maximum Input Voltage

Check for Samples: LMZ12010

FEATURES

ELECTRICAL SPECIFICATIONS

• Integrated Shielded Inductor

• 50W Maximum Total Output Power

• Simple PCB Layout

• Up to 10A Output Current

• Fixed Switching Frequency (350 kHz)

• Input Voltage Range 6V to 20V

• Flexible Startup Sequencing Using External

• Output Voltage Range 0.8V to 6V

Soft-start, Tracking and Precision Enable

• Efficiency up to 92%

• Protection Against Inrush Currents and Faults

such as Input UVLO and Output Short Circuit

PERFORMANCE BENEFITS

• – 40°C to 125°C Junction Temperature Range

• High Efficiency Reduces System Heat

• Single Exposed Pad and Standard Pinout for

Generation

Easy Mounting and Manufacturing

• Low Radiated Emissions (EMI) Complies with

• Fully Enabled for Webench® Power Designer

EN55022

(2)

• Pin Compatible with LMZ22010/08/06,

• Only 7 External Components

LMZ12008/06, LMZ23610/08/06, and

• Low Output Voltage Ripple

LMZ13610/08/06

• No External Heat Sink Required

APPLICATIONS

DESCRIPTION

• Point of Load Conversions from 12V Input Rail

The LMZ12010 SIMPLE SWITCHER© power module

• Time Critical Projects

is an easy-to-use step-down DC-DC solution capable

• Space Constrained / High Thermal

of driving up to 10A load. The LMZ12010 is available

Requirement Applications

in an innovative package that enhances thermal

performance and allows for hand or machine

• Negative Output Voltage Application

soldering.

•

See AN-2027 SNVA425.

The LMZ12010 can accept an input voltage rail

between 6V and 20V and deliver an adjustable and

highly accurate output voltage as low as 0.8V. The

LMZ12010 only requires two external resistors and

external capacitors to complete the power solution.

The LMZ12010 is a reliable and robust design with

the following protection features: thermal shutdown,

programmable input under-voltage lockout, output

over-voltage protection, short-circuit protection, output

current limit, and allows startup into a pre-biased

output.

Figure 1. Easy to use 11 pin package

15 x 17.79 x 5.9 mm (0.59 x 0.7 x 0.232 in)

= 9.9 °C/W, θ

= 1.0 °C/W

(1)

RoHS Compliant

Peak Reflow Case Temp = 245°C

Power Module SMT Guidelines

(2) EN 55022:2006, +A1:2007, FCC Part 15 Subpart B, tested on

(1) θ

measured on a 75mm x 90 mm four-layer PCB. Evaluation Board with EMI configuration.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (30 pages)

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LMZ12010 www.ti.
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LMZ12010 SNVS667G – FEBRUARY 2010 – REVISED OCTOBER 2013 www.ti.com System Performance Figure 2. Efficiency VIN = 12V, VOUT = 3.3V 100 EFFICIENCY (%) 90 80 70 60 50 12Vin 40 0 1 2 3 4 5 6 7 8 OUTPUT CURRENT (A) 9 10 Figure 3. Thermal derating curve VIN = 12V, VOUT = 3.3V OUTPUT CURRENT (A) 12 10 8 6 4 2 0 JA = 9.9 °C/W 20 30 40 50 60 70 80 90 100 110 120 AMBIENT TEMPERATURE (°C) Figure 4.
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LMZ12010 www.ti.com SNVS667G – FEBRUARY 2010 – REVISED OCTOBER 2013 Simplified Application Schematic VOUT 6V 5V 3.3V 2.5V 1.8V 1.5V 1.2V 1.0V 0.8V VOUT SS FB AGND PGND VIN EN VIN LMZ12010 RFBT 15.4k 5.62k 3.32k 2.26k 1.87k 1.00k 1.07k 1.62k 0 RFBB VIN Range 2.37k 8.5...20V 1.07k 7...20V 1.07k 6...20V 1.07k 6...20V 1.50k 6...20V 1.13k 6...20V 2.05k 6...20V 6.49k 6...20V 4.02k 6...20V VOUT CFF 4.7 nF (OPT) Enable RFBT See Table CSS CIN 3 x 10 PF 0.
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LMZ12010 SNVS667G – FEBRUARY 2010 – REVISED OCTOBER 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings VIN to PGND -0.3V to 24V EN to AGND -0.3V to 5.5V SS, FB to AGND -0.3V to 2.5V AGND to PGND -0.3V to 0.
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LMZ12010 www.ti.com SNVS667G – FEBRUARY 2010 – REVISED OCTOBER 2013 Electrical Characteristics Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits are ensured through test, design or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.
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LMZ12010 SNVS667G – FEBRUARY 2010 – REVISED OCTOBER 2013 www.ti.com Typical Performance Characteristics Unless otherwise specified, the following conditions apply: VIN = 12V; CIN = three x 10μF + 47nF X7R Ceramic; COUT = two x 330μF Specialty Polymer + 47 uF Ceramic + 47nF Ceramic; CFF = 4.7nF; Tambient = 25° C for waveforms. All indicated temperatures are ambient. Efficiency 5.0V output @ 25°C Dissipation 5.
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LMZ12010 www.ti.com SNVS667G – FEBRUARY 2010 – REVISED OCTOBER 2013 Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; CIN = three x 10μF + 47nF X7R Ceramic; COUT = two x 330μF Specialty Polymer + 47 uF Ceramic + 47nF Ceramic; CFF = 4.7nF; Tambient = 25° C for waveforms. All indicated temperatures are ambient. Dissipation 1.8V output @ 25°C 8 80 7 DISSIPATION (W) EFFICIENCY (%) Efficiency 1.
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LMZ12010 SNVS667G – FEBRUARY 2010 – REVISED OCTOBER 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; CIN = three x 10μF + 47nF X7R Ceramic; COUT = two x 330μF Specialty Polymer + 47 uF Ceramic + 47nF Ceramic; CFF = 4.7nF; Tambient = 25° C for waveforms. All indicated temperatures are ambient. Dissipation 1.0V output @ 25°C 8 80 7 70 6 DISSIPATION (W) EFFICIENCY (%) Efficiency 1.
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LMZ12010 www.ti.com SNVS667G – FEBRUARY 2010 – REVISED OCTOBER 2013 Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; CIN = three x 10μF + 47nF X7R Ceramic; COUT = two x 330μF Specialty Polymer + 47 uF Ceramic + 47nF Ceramic; CFF = 4.7nF; Tambient = 25° C for waveforms. All indicated temperatures are ambient. Dissipation 2.5V output @ 85°C 8 90 7 80 6 DISSIPATION (W) EFFICIENCY (%) Efficiency 2.
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LMZ12010 SNVS667G – FEBRUARY 2010 – REVISED OCTOBER 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; CIN = three x 10μF + 47nF X7R Ceramic; COUT = two x 330μF Specialty Polymer + 47 uF Ceramic + 47nF Ceramic; CFF = 4.7nF; Tambient = 25° C for waveforms. All indicated temperatures are ambient. Dissipation 1.2V output @ 85°C 8 80 7 70 6 DISSIPATION (W) EFFICIENCY (%) Efficiency 1.
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LMZ12010 www.ti.com SNVS667G – FEBRUARY 2010 – REVISED OCTOBER 2013 Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; CIN = three x 10μF + 47nF X7R Ceramic; COUT = two x 330μF Specialty Polymer + 47 uF Ceramic + 47nF Ceramic; CFF = 4.7nF; Tambient = 25° C for waveforms. All indicated temperatures are ambient. θJA vs copper heat sinking area Thermal derating VIN = 12V, VOUT = 3.
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LMZ12010 SNVS667G – FEBRUARY 2010 – REVISED OCTOBER 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; CIN = three x 10μF + 47nF X7R Ceramic; COUT = two x 330μF Specialty Polymer + 47 uF Ceramic + 47nF Ceramic; CFF = 4.7nF; Tambient = 25° C for waveforms. All indicated temperatures are ambient. Output ripple 12VIN, 1.2VOUT @ Full Load, BW = 20 MHz Output ripple 12VIN, 1.2VOUT@ Full Load, BW = 250 MHz Figure 42.
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LMZ12010 www.ti.com SNVS667G – FEBRUARY 2010 – REVISED OCTOBER 2013 Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; CIN = three x 10μF + 47nF X7R Ceramic; COUT = two x 330μF Specialty Polymer + 47 uF Ceramic + 47nF Ceramic; CFF = 4.7nF; Tambient = 25° C for waveforms. All indicated temperatures are ambient. 3.3VOUT Soft Start, no CSS 3.3VOUT Soft Start, CSS = 0.47uF Figure 48. Figure 49.
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LMZ12010 SNVS667G – FEBRUARY 2010 – REVISED OCTOBER 2013 www.ti.com BLOCK DIAGRAM Linear Regulator 2M VIN 1 3 3 CIN EN CBST CINint 1 2.
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LMZ12010 www.ti.com SNVS667G – FEBRUARY 2010 – REVISED OCTOBER 2013 DESIGN STEPS FOR THE LMZ12010 APPLICATION The LMZ12010 is fully supported by Webench® which offers: component selection, electrical and thermal simulations. Additionally, there are both evaluation and demonstration boards that may be used as a starting point for design. The following list of steps can be used to manually design the LMZ12010 application. All references to values refer to the typical applications schematic Figure 55.
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LMZ12010 SNVS667G – FEBRUARY 2010 – REVISED OCTOBER 2013 www.ti.com INT-VCC (5V) VIN 13 PA 2.0M RENT 42.2k RENH ENABLE RUN 100: 5.1V RENB 12.7k 1.274V Figure 50. Enable Input Detail OUTPUT VOLTAGE SELECTION Output voltage is determined by a divider of two resistors connected between VOUT and AGND. The midpoint of the divider is connected to the FB input. The regulated output voltage determined by the external divider resistors RFBT and RFBB is: VOUT = 0.
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LMZ12010 www.ti.com SNVS667G – FEBRUARY 2010 – REVISED OCTOBER 2013 TRACKING SUPPLY DIVIDER OPTION The tracking function allows the module to be connected as a slave supply to a primary voltage rail (often the 3.3V system rail) where the slave module output voltage is lower than that of the master. Proper configuration allows the slave rail to power up coincident with the master rail such that the voltage difference between the rails during ramp-up is small (i.e. <0.15V typ).
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LMZ12010 SNVS667G – FEBRUARY 2010 – REVISED OCTOBER 2013 www.ti.com Note that the stability requirement for minimum output capacitance must always be met. One recommended output capacitor combination is two 330μF, 15 mOhm ESR tantalum polymer capacitors connected in parallel with a 47 uF 6.3V X5R ceramic. This combination provides excellent performance that may exceed the requirements of certain applications. Additionally some small 47nF ceramic capacitors can be used for high frequency EMI suppression.
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LMZ12010 www.ti.com SNVS667G – FEBRUARY 2010 – REVISED OCTOBER 2013 To reach θCA = 13.15, the PCB is required to dissipate heat effectively. With no airflow and no external heat-sink, a good estimate of the required board area covered by 2 oz. copper on both the top and bottom metal layers is: Board Area_cm2 8 500 . °C x cm 2 TCA W (15) As a result, approximately 38.02 square cm of 2 oz copper on top and bottom layers is the minimum required area for the example PCB design. This is 6.16 x 6.16 cm (2.
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LMZ12010 SNVS667G – FEBRUARY 2010 – REVISED OCTOBER 2013 www.ti.com 2. Have a single point ground. The ground connections for the feedback, soft-start, and enable components should be routed to the AGND pin of the device. This prevents any switched or load currents from flowing in the analog ground traces. If not properly handled, poor grounding can result in degraded load regulation or erratic output voltage ripple behavior.
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LMZ12010 www.ti.com SNVS667G – FEBRUARY 2010 – REVISED OCTOBER 2013 Figure 53. Pre-Biased Startup DISCONTINUOUS CONDUCTION AND CONTINUOUS CONDUCTION MODES At light load the regulator will operate in discontinuous conduction mode (DCM). With load currents above the critical conduction point, it will operate in continuous conduction mode (CCM). When operating in DCM, inductor current is maintained to an average value equaling Iout .
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LMZ12010 SNVS667G – FEBRUARY 2010 – REVISED OCTOBER 2013 www.ti.com Typical Application Schematic Diagram and BOM C + IN5 (OPT) CIN6 (OPT) VOUT SS FB PGND AGND VIN EN VIN LMZ12010 VOUT RENT CIN2,3,4 D1 5.1V (OPT) CIN1 CO3,4 CSS RENB CO1 (OPT) CO2 CO 5 (OPT) LOAD (OPT) RFBB RFBT Figure 55. Table 2. Typical Application Bill of Materials 22 Ref Des Description Case Size Manufacturer Manufacturer P/N U1 SIMPLE SWITCHER ® PFM-11 Texas Instruments LMZ12010TZ CIN1,6 (OPT) 0.
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LMZ12010 www.ti.com SNVS667G – FEBRUARY 2010 – REVISED OCTOBER 2013 Figure 56. Layout Example Power Module SMT Guidelines The recommendations below are for a standard module surface mount assembly • Land Pattern – Follow the PCB land pattern with either soldermask defined or non-soldermask defined pads.
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LMZ12010 SNVS667G – FEBRUARY 2010 – REVISED OCTOBER 2013 • • • • www.ti.com pattern – For all other I/O pads use a 1:1 ratio between the aperture and the land pattern recommendation Solder Paste – Use a standard SAC Alloy such as SAC 305, type 3 or higher. Stencil Thickness – 0.125 to 0.15mm Reflow - Refer to solder paste supplier recommendation and optimized per board size and density Maximum number of reflows allowed is one Figure 57. Sample Reflow Profile Table 3.
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LMZ12010 www.ti.com SNVS667G – FEBRUARY 2010 – REVISED OCTOBER 2013 REVISION HISTORY Changes from Revision F (March 2013) to Revision G Page • Added Peak Reflow Case Temp = 245°C ............................................................................................................................ 1 • Changed 12mil ....................................................................................................................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE MATERIALS INFORMATION www.ti.com 2-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device LMZ12010TZE/NOPB Package Package Pins Type Drawing PFM NDY 11 SPQ 250 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 32.4 Pack Materials-Page 1 15.45 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 18.34 6.2 20.0 32.
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PACKAGE MATERIALS INFORMATION www.ti.com 2-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMZ12010TZE/NOPB PFM NDY 11 250 367.0 367.0 55.
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MECHANICAL DATA NDY0011A BOTTOM SIDE OF PACKAGE TOP SIDE OF PACKAGE TZA11A (Rev F) www.ti.
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