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LMZ22010

www.ti.com

SNVS687G –MARCH 2011–REVISED OCTOBER 2013

LMZ22010 10A SIMPLE SWITCHER® Power Module with 20V Maximum Input Voltage and

Current Sharing

Check for Samples: LMZ22010

FEATURES

• Integrated Shielded Inductor

DESCRIPTION

• Simple PCB Layout

The LMZ22010 SIMPLE SWITCHER© power module

• Frequency Synchronization Input (350 kHz to

is an easy-to-use step-down DC-DC solution capable

of driving up to 10A load. The LMZ22010 is available

600 kHz)

in an innovative package that enhances thermal

• Current Sharing Capability

performance and allows for hand or machine

• Flexible Startup Sequencing Using External

soldering.

Soft-start, Tracking and Precision Enable

The LMZ22010 can accept an input voltage rail

• Protection Against Inrush Currents and Faults

between 6V and 20V and deliver an adjustable and

such as Input UVLO and Output Short Circuit

highly accurate output voltage as low as 0.8V. The

• – 40°C to 125°C Junction Temperature Range

LMZ22010 only requires two external resistors and

external capacitors to complete the power solution.

• Single Exposed Pad and Standard Pinout for

The LMZ22010 is a reliable and robust design with

Easy Mounting and Manufacturing

the following protection features: thermal shutdown,

• Fully Enabled for Webench® Power Designer

programmable input under-voltage lockout, output

• Pin Compatible with LMZ22008/06,

over-voltage protection, short-circuit protection, output

current limit, and allows startup into a pre-biased

LMZ12010/08/06, LMZ23610/08/06, and

output.

LMZ13610/08/06

The sync input allows synchronization over the 314 to

APPLICATIONS

600 kHz switching frequency range and up to 6

modules can be connected in parallel for higher load

• Point of Load Conversions from 12V Input Rail

currents.

• Time Critical Projects

• Space Constrained / High Thermal

ELECTRICAL SPECIFICATIONS

Requirement Applications

• 50W Maximum Total Output Power

• Negative Output Voltage Applications

• Up to 10A Output Current

See AN-2027 SNVA425

• Input Voltage Range 6V to 20V

• Output Voltage Range 0.8V to 6V

• Efficiency up to 92%

PERFORMANCE BENEFITS

• High Efficiency Reduces System Heat

Generation

• Low Radiated Emissions (EMI) Complies with

EN55022

(2)

• Only 7 External Components

Figure 1. Easy to use 11 pin package

• Low Output Voltage Ripple

15 x 17.79 x 5.9 mm (0.59 x 0.7 x 0.232 in)

• No External Heat Sink Required

= 9.9 °C/W, θ

= 1.0 °C/W

(1)

RoHS Compliant

• Simple Current sharing for Higher Current

Peak Reflow Case Temp = 245°C

Applications

Power Module SMT Guidelines

(2) EN 55022:2006, +A1:2007, FCC Part 15 Subpart B, tested on

(1) θ

measured on a 75mm x 90 mm four-layer PCB. Evaluation Board with EMI configuration.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (32 pages)

PAGE 1
LMZ22010 www.ti.
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LMZ22010 SNVS687G – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com System Performance Figure 2. Efficiency VIN = 12V, VOUT = 3.3V 100 EFFICIENCY (%) 90 80 70 60 50 12Vin 40 0 1 2 3 4 5 6 7 8 OUTPUT CURRENT (A) 9 10 Figure 3. Thermal derating curve VIN = 12V, VOUT = 3.3V OUTPUT CURRENT (A) 12 10 8 6 4 2 0 JA = 9.9 °C/W 20 30 40 50 60 70 80 90 100 110 120 AMBIENT TEMPERATURE (°C) Figure 4.
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LMZ22010 www.ti.com SNVS687G – MARCH 2011 – REVISED OCTOBER 2013 Simplified Application Schematic VOUT 6V 5V 3.3V 2.5V 1.8V 1.5V 1.2V 1.0V 0.8V VOUT SH SS FB AGND PGND EN SYNC VIN VIN LMZ22010 RFBT 15.4k 5.62k 3.32k 2.26k 1.87k 1.00k 1.07k 1.62k 0 RFBB VIN Range 2.37k 8.5...20V 1.07k 7...20V 1.07k 6...20V 1.07k 6...20V 1.50k 6...20V 1.13k 6...20V 2.05k 6...20V 6.49k 6...20V 4.02k 6...20V VOUT Share Clock CFF 4.7 nF (OPT) Enable RFBT See Table CSS CIN 3 x 10 PF 0.
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LMZ22010 SNVS687G – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com Pin Descriptions (continued) Pin Name Description EP PGND Exposed Pad / Power Ground — Electrical path for the power circuits within the module. PGND is not internally connected to AGND (pin 5,6). Must be electrically connected to pins 5 and 6 external to the package. The exposed pad is also used to dissipate heat from the package during operation. Use one hundred thermal vias from top to bottom copper for best thermal performance.
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LMZ22010 www.ti.com SNVS687G – MARCH 2011 – REVISED OCTOBER 2013 Electrical Characteristics Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits are ensured through test, design or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.
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LMZ22010 SNVS687G – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com Typical Performance Characteristics Unless otherwise specified, the following conditions apply: VIN = 12V; CIN = three x 10μF + 47nF X7R Ceramic; COUT = two x 330μF Specialty Polymer + 47 uF Ceramic + 47nF Ceramic; CFF = 4.7nF; Tambient = 25° C for waveforms. All indicated temperatures are ambient. Efficiency 5.0V output @ 25°C Dissipation 5.
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LMZ22010 www.ti.com SNVS687G – MARCH 2011 – REVISED OCTOBER 2013 Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; CIN = three x 10μF + 47nF X7R Ceramic; COUT = two x 330μF Specialty Polymer + 47 uF Ceramic + 47nF Ceramic; CFF = 4.7nF; Tambient = 25° C for waveforms. All indicated temperatures are ambient. Dissipation 1.8V output @ 25°C 8 80 7 DISSIPATION (W) EFFICIENCY (%) Efficiency 1.
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LMZ22010 SNVS687G – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; CIN = three x 10μF + 47nF X7R Ceramic; COUT = two x 330μF Specialty Polymer + 47 uF Ceramic + 47nF Ceramic; CFF = 4.7nF; Tambient = 25° C for waveforms. All indicated temperatures are ambient. Dissipation 1.0V output @ 25°C 8 80 7 70 6 DISSIPATION (W) EFFICIENCY (%) Efficiency 1.
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LMZ22010 www.ti.com SNVS687G – MARCH 2011 – REVISED OCTOBER 2013 Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; CIN = three x 10μF + 47nF X7R Ceramic; COUT = two x 330μF Specialty Polymer + 47 uF Ceramic + 47nF Ceramic; CFF = 4.7nF; Tambient = 25° C for waveforms. All indicated temperatures are ambient. Dissipation 2.5V output @ 85°C 8 90 7 80 6 DISSIPATION (W) EFFICIENCY (%) Efficiency 2.
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LMZ22010 SNVS687G – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; CIN = three x 10μF + 47nF X7R Ceramic; COUT = two x 330μF Specialty Polymer + 47 uF Ceramic + 47nF Ceramic; CFF = 4.7nF; Tambient = 25° C for waveforms. All indicated temperatures are ambient. Dissipation 1.2V output @ 85°C 8 80 7 70 6 DISSIPATION (W) EFFICIENCY (%) Efficiency 1.
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LMZ22010 www.ti.com SNVS687G – MARCH 2011 – REVISED OCTOBER 2013 Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; CIN = three x 10μF + 47nF X7R Ceramic; COUT = two x 330μF Specialty Polymer + 47 uF Ceramic + 47nF Ceramic; CFF = 4.7nF; Tambient = 25° C for waveforms. All indicated temperatures are ambient. θJA vs copper heat sinking area Thermal derating VIN = 12V, VOUT = 3.
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LMZ22010 SNVS687G – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; CIN = three x 10μF + 47nF X7R Ceramic; COUT = two x 330μF Specialty Polymer + 47 uF Ceramic + 47nF Ceramic; CFF = 4.7nF; Tambient = 25° C for waveforms. All indicated temperatures are ambient. Output ripple 12VIN, 1.2VOUT @ Full Load, BW = 20 MHz Output ripple 12VIN, 1.2VOUT@ Full Load, BW = 250 MHz Figure 42. Figure 43.
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LMZ22010 www.ti.com SNVS687G – MARCH 2011 – REVISED OCTOBER 2013 Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; CIN = three x 10μF + 47nF X7R Ceramic; COUT = two x 330μF Specialty Polymer + 47 uF Ceramic + 47nF Ceramic; CFF = 4.7nF; Tambient = 25° C for waveforms. All indicated temperatures are ambient. 3.3VOUT Soft Start, no CSS 3.3VOUT Soft Start, CSS = 0.47uF Figure 48. Figure 49.
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LMZ22010 SNVS687G – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com BLOCK DIAGRAM Linear Regulator 2M VIN 1 3 3 CIN EN 2 350 kHz PWM SS 2.
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LMZ22010 www.ti.com SNVS687G – MARCH 2011 – REVISED OCTOBER 2013 DESIGN STEPS FOR THE LMZ22010 APPLICATION The LMZ22010 is fully supported by Webench® which offers: component selection, electrical and thermal simulations. Additionally, there are both evaluation and demonstration boards that may be used as a starting point for design. The following list of steps can be used to manually design the LMZ22010 application. All references to values refer to the typical applications schematic Figure 58.
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LMZ22010 SNVS687G – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com INT-VCC (5V) VIN 13 PA 2.0M RENT 42.2k RENH ENABLE RUN 100: 5.1V RENB 12.7k 1.274V Figure 50. Enable input detail OUTPUT VOLTAGE SELECTION Output voltage is determined by a divider of two resistors connected between VOUT and AGND. The midpoint of the divider is connected to the FB input. The regulated output voltage determined by the external divider resistors RFBT and RFBB is: VOUT = 0.
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LMZ22010 www.ti.com SNVS687G – MARCH 2011 – REVISED OCTOBER 2013 TRACKING SUPPLY DIVIDER OPTION The tracking function allows the module to be connected as a slave supply to a primary voltage rail (often the 3.3V system rail) where the slave module output voltage is lower than that of the master. Proper configuration allows the slave rail to power up coincident with the master rail such that the voltage difference between the rails during ramp-up is small (i.e. <0.15V typ).
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LMZ22010 SNVS687G – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com Note that the stability requirement for minimum output capacitance must always be met. One recommended output capacitor combination is two 330μF, 15 mOhm ESR tantalum polymer capacitors connected in parallel with a 47 uF 6.3V X5R ceramic. This combination provides excellent performance that may exceed the requirements of certain applications. Additionally some small 47nF ceramic capacitors can be used for high frequency EMI suppression.
PAGE 19
LMZ22010 www.ti.com SNVS687G – MARCH 2011 – REVISED OCTOBER 2013 To reach θCA = 13.15, the PCB is required to dissipate heat effectively. With no airflow and no external heat-sink, a good estimate of the required board area covered by 2 oz. copper on both the top and bottom metal layers is: Board Area_cm2 8 500 . °C x cm 2 TCA W (15) As a result, approximately 38.02 square cm of 2 oz copper on top and bottom layers is the minimum required area for the example PCB design. This is 6.16 x 6.16 cm (2.
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LMZ22010 SNVS687G – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com 2. Have a single point ground. The ground connections for the feedback, soft-start, and enable components should be routed to the AGND pin of the device. This prevents any switched or load currents from flowing in the analog ground traces. If not properly handled, poor grounding can result in degraded load regulation or erratic output voltage ripple behavior. Additionally provide a single point ground connection from pin 4 (AGND) to EP/PGND.
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LMZ22010 www.ti.com SNVS687G – MARCH 2011 – REVISED OCTOBER 2013 In a current sharing system using two or more modules, the slaves have their error amp circuitry disconnected. The master over-rides the error amplifier outputs of the slaves. This signal is then compared to each module’s individual current sense circuitry. Due to this, the current sense gain of the entire system increases according to the number of modules slaved to the master.
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LMZ22010 SNVS687G – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com OUTPUT OVER-VOLTAGE PROTECTION If the voltage at FB is greater than a 0.86V internal reference, the output of the error amplifier is pulled toward ground, causing VOUT to fall. CURRENT LIMIT The LMZ22010 is protected by both low side (LS) and high side (HS) current limit circuitry. The LS current limit detection is carried out during the off-time by monitoring the current through the LS synchronous MOSFET.
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LMZ22010 www.ti.com SNVS687G – MARCH 2011 – REVISED OCTOBER 2013 Figure 57. CCM and DCM Operating Modes VIN = 12V, VO = 3.3V, IO = 3A/0.3A The approximate formula for determining the DCM/CCM boundary is as follows: (VIN - VOUT) x D IDCB = 2 x L x fSW (17) The inductor internal to the module is 2.2 μH. This value was chosen as a good balance between low and high input voltage applications. The main parameter affected by the inductor is the amplitude of the inductor ripple current (ΔiL).
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LMZ22010 SNVS687G – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com Table 1. Typical Application Bill of Materials 24 Ref Des Description Case Size Manufacturer Manufacturer P/N U1 SIMPLE SWITCHER ® PFM-11 Texas Instruments LMZ22010TZ CIN1,6 (OPT) 0.047 µF, 50V, X7R 1206 Yageo America CC1206KRX7R9BB473 CIN2,3,4 10 µF, 50V, X7R 1210 Taiyo Yuden UMK325BJ106MM-T CIN5 (OPT) CAP, AL, 150µF, 50V Radial G Panasonic EEE-FK1H151P CO1,5 (OPT) 0.
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LMZ22010 www.ti.com SNVS687G – MARCH 2011 – REVISED OCTOBER 2013 Figure 59.
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LMZ22010 SNVS687G – MARCH 2011 – REVISED OCTOBER 2013 • • • • www.ti.com – For all other I/O pads use a 1:1 ratio between the aperture and the land pattern recommendation Solder Paste – Use a standard SAC Alloy such as SAC 305, type 3 or higher Stencil Thickness – 0.125 to 0.15mm Reflow - Refer to solder paste supplier recommendation and optimized per board size and density Maximum number of reflows allowed is one Figure 60. Sample Reflow Profile Table 2.
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LMZ22010 www.ti.com SNVS687G – MARCH 2011 – REVISED OCTOBER 2013 REVISION HISTORY Changes from Revision F (March 2013) to Revision G Page • Added Peak Reflow Case Temp = 245°C ............................................................................................................................ 1 • Deleted 12mils ......................................................................................................................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device LMZ22010TZE/NOPB Package Package Pins Type Drawing PFM NDY 11 SPQ 250 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 32.4 Pack Materials-Page 1 15.45 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 18.34 6.2 20.0 32.
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PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMZ22010TZE/NOPB PFM NDY 11 250 367.0 367.0 55.
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MECHANICAL DATA NDY0011A BOTTOM SIDE OF PACKAGE TOP SIDE OF PACKAGE TZA11A (Rev F) www.ti.
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