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FEATURES

D OR DGK PACKAGE

(TOP VIEW)

1OUT

1IN−

1IN+

GND

2OUT

2IN−

2IN+

APPLICATIONS

DESCRIPTION/ORDERING INFORMATION

−

IN−

IN+

OUT

LP358, LP2904

ULTRA-LOW-POWER DUAL OPERATIONAL AMPLIFIERS

SLOS475 – AUGUST 2005

• Low Supply Current . . . 85 µ A Typ

• Low Offset Voltage . . . 2 mV Typ

• Low Input Bias Current . . . 2 nA Typ

• Input Common Mode to GND

• Wide Supply Voltage . . . 3 V < V

< 32 V

• Pin Compatible With LM358

• LCD Displays

• Portable Instrumentation

• Sensor/Metering Equipment

• Consumer Electronics (MP3 Players, Toys)

• Power Supplies

The LP358 and LP2904 are dual low-power operational amplifiers especially suited for battery-operated

applications. Good input specifications and wide supply-voltage range still are achieved, despite the ultra-low

supply current. Single-supply operation is achieved with an input common-mode range that includes GND.

The LP358 and LP2904 are ideal in applications where wide supply voltage and low power are more important

than speed and bandwidth. These applications include portable instrumentation, LCD displays, consumer

electronics (MP3 players, toys, etc.), and power supplies.

ORDERING INFORMATION

PACKAGE

(1)

ORDERABLE PART NUMBER TOP-SIDE MARKING

Tube of 75 LP358D

SOIC – D LP358

Reel of 2500 LP358DR

0 ° C to 70 ° C Tube of 100 LP358DGK

VSSOP – DGK Reel of 250 LP358DGKT PREVIEW

Reel of 2500 LP358DGKR

Tube of 75 LP2904D

SOIC – D PREVIEW

Reel of 2500 LP2904DR

–40 ° C to 85 ° C Tube of 100 LP2904DGK

VSSOP – DGK Reel of 250 LP2904DGKT PREVIEW

Reel of 2500 LP2904DGKR

SYMBOL (EACH AMPLIFIER)

(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (10 pages)

PAGE 1
LP358, LP2904 ULTRA-LOW-POWER DUAL OPERATIONAL AMPLIFIERS www.ti.com SLOS475 – AUGUST 2005 FEATURES • • • • • • D OR DGK PACKAGE (TOP VIEW) Low Supply Current . . . 85 µA Typ Low Offset Voltage . . . 2 mV Typ Low Input Bias Current . . . 2 nA Typ Input Common Mode to GND Wide Supply Voltage . . .
PAGE 2
LP358, LP2904 ULTRA-LOW-POWER DUAL OPERATIONAL AMPLIFIERS www.ti.com SLOS475 – AUGUST 2005 SCHEMATIC (EACH AMPLIFIER) VCC OUT IN− IN+ Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN VCC MAX Supply voltage range (2) Differential input VI Input voltage (either input) Package thermal impedance (5) (6) TJ Operating virtual junction temperature Tstg Storage temperature range (6) V 32 V Unlimited D package θJA (2) (3) (4) (5) ±32 –0.
PAGE 3
LP358, LP2904 ULTRA-LOW-POWER DUAL OPERATIONAL AMPLIFIERS www.ti.
PAGE 4
PACKAGE OPTION ADDENDUM www.ti.
PAGE 5
PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.
PAGE 6
PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LP2904DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LP358DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.
PAGE 7
PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LP2904DR SOIC D 8 2500 340.5 338.1 20.6 LP358DR SOIC D 8 2500 340.5 338.1 20.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.