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LP3981

www.ti.com

SNVS159G –OCTOBER 2001–REVISED MAY 2013

LP3981 Micropower, 300mA Ultra Low-Dropout CMOS Voltage Regulator

Check for Samples: LP3981

FEATURES

APPLICATIONS

• Small, Space Saving VSSOP-8

• CDMA Cellular Handsets

• Low Thermal Resistance in WSON-6 Package • Wideband CDMA Cellular Handsets

Gives Excellent Power Capability

• GSM Cellular Handsets

• Logic Controlled Enable

• Portable Information Appliances

• Stable with Ceramic and High Quality

• Tiny 3.3V ± 5% to 2.5V, 300mA Converter

Tantalum Capacitors

• Fast Turn-On DESCRIPTION

The LP3981's performance is optimized for battery

• Thermal Shutdown and Short-Circuit Current

powered systems to deliver ultra low noise, extremely

Limit

low dropout voltage and low quiescent current.

Regulator ground current increases only slightly in

KEY SPECIFICATIONS

dropout, further prolonging the battery life.

• 2.5 to 6.0V Input Range

Power supply rejection is better than 60 dB at low

• 300mA Output

frequencies. This high power supply rejection is

• 60dB PSRR at 1kHz

maintained down to lower input voltage levels

common to battery operated circuits.

• ≤1μA Quiescent Current when Shut Down

• Fast Turn-On Time: 120 μs (Typ.) with C

BYPASS

The device is ideal for mobile phone and similar

battery powered wireless applications. It provides up

= 0.01uF

to 300 mA, from a 2.5V to 6V input, consuming less

• 132mV Typ Dropout with 300mA Load

than 1µA in disable mode.

• 35μVrms Output Noise over 10Hz to 100kHz

The LP3981 is available in VSSOP-8 package. For

• −40 to +125°C Junction Temperature Range for

LP3981 in WSON-6 package, contact TI sales offices.

Operation

Performance is specified for −40°C to +125°C

• 2.5V, 2.7V, 2.8V, 2.83V, 3.0V, 3.03V, and 3.3V

temperature range. The device available in the

Outputs Standard

following output voltages; 2.5V, 2.7V, 2.8V, 2.83V,

3.0V, 3.03V and 3.3V as standard. Other output

options can be made available, please contact your

local TI sales office.

Typical Application Circuit

Note: Pin Numbers in parenthesis indicate WSON-6 package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (21 pages)

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LP3981 www.ti.com SNVS159G – OCTOBER 2001 – REVISED MAY 2013 LP3981 Micropower, 300mA Ultra Low-Dropout CMOS Voltage Regulator Check for Samples: LP3981 FEATURES APPLICATIONS • • • • • • • 1 2 • • • • Small, Space Saving VSSOP-8 Low Thermal Resistance in WSON-6 Package Gives Excellent Power Capability Logic Controlled Enable Stable with Ceramic and High Quality Tantalum Capacitors Fast Turn-On Thermal Shutdown and Short-Circuit Current Limit KEY SPECIFICATIONS • • • • • • • • • 2.5 to 6.
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LP3981 SNVS159G – OCTOBER 2001 – REVISED MAY 2013 www.ti.com Block Diagram PIN DESCRIPTIONS Name VSSOP-8 WSON-6 VEN 7 6 Enable Input Logic, Enable High. Function GND 5 4 Common Ground. Connect to PAD. VOUT 1 1 Output Voltage of the LDO. VIN 2 2 Input Voltage of the LDO. Bypass 6 5 Optional bypass capacitor for noise reduction. VOUT-SENSE 4 3 Output. Voltage Sense Pin. Should be connected to VOUT for proper operation. N.C. 3, 8 GND PAD Common Ground. Connect to pin 4.
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LP3981 www.ti.com SNVS159G – OCTOBER 2001 – REVISED MAY 2013 ORDERING INFORMATION (1) (2) WSON-6 LP3981 Supplied as 1000 Units Tape and Reel LP3981 Supplied as 4500 Units Tape and Reel Package Marking 2.5V LP3981ILD-2.5 LP3981ILDX-2.5 LO1UB 2.7V LP3981ILD-2.7 LP3981ILDX-2.7 LO1VB 2.8V LP3981ILD-2.8 LP3981ILDX-2.8 LO1ZB LP3981ILD-2.83 LP3981ILDX-2.83 L01SB Output Voltage 2.83V Grade STD 3.0V LP3981ILD-3.0 LP3981ILDX-3.0 L017B 3.03V LP3981ILD-3.03 LP3981ILDX-3.03 LO1YB 3.
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LP3981 SNVS159G – OCTOBER 2001 – REVISED MAY 2013 www.ti.com Absolute Maximum Ratings (1) (2) (3) −0.3 to 6.5V VIN, VEN −0.3 to VIN + 0.3, Max 6.5V VOUT, VOUT-SENSE Junction Temperature 150°C Storage Temperature −65°C to +150°C Lead Temp. Pad Temp. Power Dissipation θJA (VSSOP-8) θJA (WSON-6) (4) 210°C/W 50°C/W Maximum Power Dissipation at 25°C VSSOP-8 WSON-6 595mW 2.
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LP3981 www.ti.com SNVS159G – OCTOBER 2001 – REVISED MAY 2013 Electrical Characteristics Unless otherwise specified: VEN = 1.2V, VIN = VOUT + 0.5V, CIN = 2.2 µF, CBP = 0.033 µF, IOUT = 1mA, COUT = 2.2 µF. Typical values and imits appearing in standard typeface are for TJ = 25°C. Limits appearing in boldface type apply over the entire junction temperature range for operation, −40°C to +125°C. (1) (2) Symbol Parameter Conditions Typ Output Voltage Tolerance ΔVOUT VIN = VOUT + 0.5V to 6.
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LP3981 SNVS159G – OCTOBER 2001 – REVISED MAY 2013 www.ti.com Electrical Characteristics Output Capacitor, Recommended Specification Limit Symbol Parameter Conditions Typ COUT Output Capacitor Capacitance 2.2 22 µF ESR 5 500 mΩ Min Max Units Figure 3. Line Transient Response Input Perturbation Figure 4.
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LP3981 www.ti.com SNVS159G – OCTOBER 2001 – REVISED MAY 2013 Typical Performance Characteristics Unless otherwise specified, CIN = COUT = 2.2 µF Ceramic, CBP = 0.033 µF, VIN = VOUT + 0.5V, TA = 25°C, Enable pin is tied to VIN. Output Voltage vs. Temperature (VOUT = 2.83V) Dropout Voltage vs. Temperature (VOUT = 2.85V) Ground Current vs. Load Current (VOUT = 2.
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LP3981 SNVS159G – OCTOBER 2001 – REVISED MAY 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified, CIN = COUT = 2.2 µF Ceramic, CBP = 0.033 µF, VIN = VOUT + 0.5V, TA = 25°C, Enable pin is tied to VIN. 8 Ripple Rejection (VIN = VOUT + 1V) Ripple Rejection (VIN = VOUT + 1V) Load Transient Response (VIN = 3.5V) Load Transient Response (VIN = 3.5V) Line Transient Response (VIN = VOUT + 1V to VOUT + 1.6V) Line Transient Response (VIN = VOUT + 1V to VOUT + 1.
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LP3981 www.ti.com SNVS159G – OCTOBER 2001 – REVISED MAY 2013 Typical Performance Characteristics (continued) Unless otherwise specified, CIN = COUT = 2.2 µF Ceramic, CBP = 0.033 µF, VIN = VOUT + 0.5V, TA = 25°C, Enable pin is tied to VIN. Line Transient Response (VIN = VOUT + 1V to VOUT + 1.6V) Line Transient Response (VIN = VOUT + 1V to VOUT + 1.
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LP3981 SNVS159G – OCTOBER 2001 – REVISED MAY 2013 www.ti.com APPLICATION HINTS POWER DISSIPATION AND DEVICE OPERATION The permissible power dissipation for any package is a measure of the capability of the device to pass heat from the power source, the junctions of the IC, to the ultimate heat sink, the ambient environment. Thus, the power dissipation is dependant on the ambient temperature and the thermal resistance across the various interfaces between the die and ambient air.
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LP3981 www.ti.com SNVS159G – OCTOBER 2001 – REVISED MAY 2013 NOISE BYPASS CAPACITOR Connecting a 0.033µF capacitor between the CBP pin and ground significantly reduces noise on the regulator output. This cap is connected directly to a high impedance node in the bad gap reference circuit. Any significant loading on this node will cause a change on the regulated output voltage. For this reason, DC leakage current through this pin must be kept as low as possible for best output voltage accuracy.
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LP3981 SNVS159G – OCTOBER 2001 – REVISED MAY 2013 www.ti.com REVISION HISTORY Changes from Revision F (May 2013) to Revision G • 12 Page Changed layout of National Data Sheet to TI format ..........................................................................................................
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PACKAGE OPTION ADDENDUM www.ti.com 7-May-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LP3981ILD-2.5 NRND WSON NGC 6 1000 TBD Call TI Call TI -40 to 125 LO1UB LP3981ILD-2.5/NOPB ACTIVE WSON NGC 6 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 LO1UB LP3981ILD-2.
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PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 7-May-2014 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LP3981IMMX-2.5/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LFKB LP3981IMMX-3.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LP3981ILD-2.5 WSON NGC 6 1000 178.0 12.4 4.3 3.3 1.0 8.0 12.0 Q1 LP3981ILD-2.5/NOPB WSON NGC 6 1000 178.0 12.4 4.3 3.3 1.0 8.0 12.0 Q1 LP3981ILD-2.8/NOPB WSON NGC 6 1000 178.0 12.4 4.3 3.3 1.0 8.0 12.0 Q1 LP3981ILD-3.
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PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LP3981IMM-3.3/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LP3981IMMX-2.5/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LP3981IMMX-3.3/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LP3981IMM-3.0/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LP3981IMM-3.03 VSSOP DGK 8 1000 210.0 185.0 35.0 LP3981IMM-3.03/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LP3981IMM-3.3 VSSOP DGK 8 1000 210.0 185.0 35.0 LP3981IMM-3.3/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LP3981IMMX-2.5/NOPB VSSOP DGK 8 3500 367.0 367.0 35.
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MECHANICAL DATA NGC0006D LDC06D (Rev B) www.ti.
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