Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsPMICsPMIC - LDO voltage regulator Positive, fixed DSBGA 4

GND

OUT

OUTPUT

1.0 PF

INPUT

ENABLE

GND

LP5907

SVA-30180501

LP5907

www.ti.com

SNVS798G –APRIL 2012–REVISED OCTOBER 2013

ULTRA LOW-NOISE, 250-mA LINEAR REGULATOR FOR RF AND ANALOG CIRCUITS -

REQUIRES NO BYPASS CAPACITOR

Check for Samples: LP5907

FEATURES

DESCRIPTION

The LP5907 is a linear regulator capable of supplying

• Stable with 1-µF Ceramic Input and Output

250-mA output current. Designed to meet the

Capacitors

requirements of RF and analog circuits, the LP5907

• No Noise Bypass Capacitor Required

device provides low noise, high PSRR, low quiescent

• Remote Output Capacitor Placement

current, and low line or load transient response

figures. Using new innovative design techniques, the

• Thermal-Overload and Short-Circuit Protection

LP5907 offers class-leading noise performance

• –40°C to +125°C Junction Temperature Range

without a noise bypass capacitor and the ability for

for Operation

remote output capacitor placement.

The device is designed to work with a 1-µF input and

APPLICATIONS

a 1-µF output ceramic capacitor (no bypass capacitor

• Cellular Phones

is required).

• PDA Handsets

The device is available in 4-bump ultra-thin DSBGA,

• Wireless LAN Devices

5-pin SOT-23, and 4-pin X2SON packages. This

device is available between 1.2 V and 4.5 V in 25-mV

steps. Contact Texas Instruments Sales for specific

KEY SPECIFICATIONS

voltage option needs.

• Input Voltage Range: 2.2 V to 5.5 V

• Output Voltage Range: 1.2 V to 4.5 V

Typical Application Circuit

• Output Current: 250 mA

• Low Output Voltage Noise: <10 µV

RMS

• PSRR: 82 dB at 1 kHz

• Output Voltage Tolerance: ±2%

• Virtually Zero IQ (Disabled): <1 µA

• Very Low IQ (Enabled): 12 µA

• Startup Time: 80 µs

• Low Dropout: 120 mV Typical

PACKAGES

• 4-Bump Ultra-Thin DSBGA:

0.35-mm Pitch, 0.65 mm × 0.65 mm × 0.40 mm

• 5-Pin SOT-23:

2.92 mm x 1.6 mm x 1 mm

• 4-Pin X2SON:

1 mm x 1mm x 0.37mm

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (26 pages)

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LP5907 www.ti.com SNVS798G – APRIL 2012 – REVISED OCTOBER 2013 ULTRA LOW-NOISE, 250-mA LINEAR REGULATOR FOR RF AND ANALOG CIRCUITS REQUIRES NO BYPASS CAPACITOR Check for Samples: LP5907 FEATURES DESCRIPTION • The LP5907 is a linear regulator capable of supplying 250-mA output current. Designed to meet the requirements of RF and analog circuits, the LP5907 device provides low noise, high PSRR, low quiescent current, and low line or load transient response figures.
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LP5907 SNVS798G – APRIL 2012 – REVISED OCTOBER 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
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LP5907 www.ti.com SNVS798G – APRIL 2012 – REVISED OCTOBER 2013 ABSOLUTE MAXIMUM RATINGS (1) (2) (3) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN Input voltage –0.3 6 V VOUT Output voltage –0.3 to (VIN + 0.3 V) 6 V VEN Enable input voltage –0.3 to (VIN + 0.
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LP5907 SNVS798G – APRIL 2012 – REVISED OCTOBER 2013 www.ti.com ELECTRICAL CHARACTERISTICS (1) (2) (3) Limits in standard typeface are for TA = 25°C. Limits in boldface type apply over the full operating junction temperature range (–40°C ≤ TJ ≤ +125°C). Unless otherwise noted, specifications apply to LP5907 (all packages) Typical Application Circuit (pg. 1) with: VIN = VOUT (NOM) + 1 V, VEN = 1.2 V, CIN = 1 µF, COUT = 1 µF, IOUT = 1 mA.
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LP5907 www.ti.com SNVS798G – APRIL 2012 – REVISED OCTOBER 2013 ELECTRICAL CHARACTERISTICS(1)(2)(3) (continued) Limits in standard typeface are for TA = 25°C. Limits in boldface type apply over the full operating junction temperature range (–40°C ≤ TJ ≤ +125°C). Unless otherwise noted, specifications apply to LP5907 (all packages) Typical Application Circuit (pg. 1) with: VIN = VOUT (NOM) + 1 V, VEN = 1.2 V, CIN = 1 µF, COUT = 1 µF, IOUT = 1 mA.
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LP5907 SNVS798G – APRIL 2012 – REVISED OCTOBER 2013 www.ti.com BLOCK DIAGRAM IN OUT REFERENCE FILTER + Bandgap Rf VREFC Cf + A special integrated filter For noise suppression 1.
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LP5907 www.ti.com SNVS798G – APRIL 2012 – REVISED OCTOBER 2013 TYPICAL CHARACTERISTICS Unless otherwise noted, these curves apply to the DSBGA package only, VOUT = 2.8 V, VIN = 3.7 V, EN = 1.2 V, CIN = 1 µF, COUT = 1 µF, TA = 25°C. Quiescent Current vs Input Voltage Ground Current vs Output Current 350 14 300 GROUND CURRENT ( A) 16 IQ( A) 12 10 8 6 4 250 200 150 100 VIN = 3.0V VIN = 3.8V VIN = 4.2V VIN = 5.5V 50 2 0 0 2.3 2.8 3.3 3.8 4.3 VIN(V) 4.8 5.3 0 5.8 50 SVA-30180569 Figure 1.
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LP5907 SNVS798G – APRIL 2012 – REVISED OCTOBER 2013 www.ti.com TYPICAL CHARACTERISTICS (continued) Unless otherwise noted, these curves apply to the DSBGA package only, VOUT = 2.8 V, VIN = 3.7 V, EN = 1.2 V, CIN = 1 µF, COUT = 1 µF, TA = 25°C. Line Transient VIN = 3.2 V ↔ 4.2 V, Load = 250 mA Load Transient, Load = 0 mA ↔ 250 mA, -40°C VOUT (AC Coupled) 10 mV/ DIV VIN 1V/DIV VOUT 100 mV/DIV LOAD 200 mA/DIV 10 s/DIV 100 s/DIV SVA-30180511 SVA-30180512 Figure 7. Figure 8.
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LP5907 www.ti.com SNVS798G – APRIL 2012 – REVISED OCTOBER 2013 TYPICAL CHARACTERISTICS (continued) Unless otherwise noted, these curves apply to the DSBGA package only, VOUT = 2.8 V, VIN = 3.7 V, EN = 1.2 V, CIN = 1 µF, COUT = 1 µF, TA = 25°C. Dropout Voltage vs Load Current Noise Density Test DROPOUT VOLTAGE (mV) 140 120 100 80 60 40 Dropout Voltage 20 0 0 50 100 150 200 LOAD CURRENT (mA) 250 SVA-30180573 Figure 13. Figure 14.
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LP5907 SNVS798G – APRIL 2012 – REVISED OCTOBER 2013 www.ti.com APPLICATION INFORMATION Power Dissipation and Device Operation The permissible power dissipation for any package is a measure of the capability of the device to pass heat from the power source, the junctions of the IC, to the ultimate heat sink, the ambient environment. Thus the power dissipation is dependent on the ambient temperature and the thermal resistance across the various interfaces between the die and ambient air.
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LP5907 www.ti.com SNVS798G – APRIL 2012 – REVISED OCTOBER 2013 Capacitor Characteristics The LP5907 is designed to work with ceramic capacitors on the input and output to take advantage of the benefits they offer. For capacitance values in the range of 1 µF to 10 µF, ceramic capacitors are the smallest, least expensive and have the lowest ESR values, thus making them best for eliminating high frequency noise.
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LP5907 SNVS798G – APRIL 2012 – REVISED OCTOBER 2013 www.ti.com DSBGA Light Sensitivity Exposing the DSBGA device to direct light may cause incorrect operation of the device. Light sources such as halogen lamps can affect electrical performance if they are situated in proximity to the device. Light with wavelengths in the red and infrared part of the spectrum have the most detrimental effect; thus, the fluorescent lighting used inside most buildings has very little effect on performance.
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LP5907 www.ti.com SNVS798G – APRIL 2012 – REVISED OCTOBER 2013 Changes from Revision F (March 2013) to Revision G Page • Changed 0.36mm to 0.37mm ............................................................................................................................................... 1 • Changed 200 mA to 250 mA ................................................................................................................................................ 4 • Added X2SON .......................
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PACKAGE OPTION ADDENDUM www.ti.com 17-Dec-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) TBD Call TI Call TI -40 to 125 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 TBD Call TI Call TI -40 to 125 Device Marking (4/5) LP5907MFX-1.2 ACTIVE LP5907MFX-1.2/NOPB ACTIVE LP5907MFX-1.8 ACTIVE LP5907MFX-1.
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PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 17-Dec-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LP5907SNX-3.0/NOPB ACTIVE X2SON DQN 4 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 CK LP5907SNX-3.1/NOPB ACTIVE X2SON DQN 4 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 CL LP5907SNX-3.
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PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 17-Dec-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LP5907UVX-3.0/NOPB ACTIVE DSBGA YKE 4 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125 B LP5907UVX-3.1/NOPB ACTIVE DSBGA YKE 4 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125 X LP5907UVX-3.
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PACKAGE OPTION ADDENDUM www.ti.com 17-Dec-2013 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.
PAGE 18
PACKAGE MATERIALS INFORMATION www.ti.com 6-Jan-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) LP5907MFX-1.2/NOPB SOT-23 DBV 5 3000 178.0 8.4 LP5907MFX-1.8/NOPB SOT-23 DBV 5 3000 178.0 LP5907MFX-2.8/NOPB SOT-23 DBV 5 3000 178.0 LP5907MFX-2.85/NOPB SOT-23 DBV 5 3000 LP5907MFX-3.0/NOPB SOT-23 DBV 5 LP5907MFX-3.1/NOPB SOT-23 DBV LP5907MFX-3.
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PACKAGE MATERIALS INFORMATION www.ti.com 6-Jan-2014 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LP5907SNX-3.3/NOPB X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 LP5907SNX-4.5/NOPB X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 LP5907UVE-1.2/NOPB DSBGA YKE 4 250 178.0 8.4 0.71 0.71 0.51 4.0 8.0 Q1 LP5907UVE-1.8/NOPB DSBGA YKE 4 250 178.0 8.4 0.71 0.
PAGE 20
PACKAGE MATERIALS INFORMATION www.ti.com 6-Jan-2014 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LP5907MFX-1.2/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LP5907MFX-1.8/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LP5907MFX-2.8/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LP5907MFX-2.85/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LP5907MFX-3.0/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LP5907MFX-3.
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MECHANICAL DATA YKE0004 0.400 ±0.045 D E TOP SIDE OF PACKAGE BOTTOM SIDE OF PACKAGE 04XXX (Rev ) D: Max = 0.675 mm, Min =0.615 mm E: Max = 0.675 mm, Min =0.615 mm 4215149/A NOTES: A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994. B. This drawing is subject to change without notice. www.ti.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.