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 ±  

SLLS567E − MAY 2003 − REVISED JANUARY 2004

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

D RS-232 Bus-Pin ESD Protection Exceeds

±15 kV Using Human-Body Model (HBM)

D Meets or Exceeds the Requirements of

TIA/EIA-232-F and ITU v.28 Standards

D Operates at 5-V V

Supply

D Four Drivers and Five Receivers

D Operates Up To 120 kbit/s

D Low Supply Current in Shutdown

Mode ...1 µA Typical

D External Capacitors ...4 × 0.1 µF

D Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

D Applications

− Battery-Powered Systems, PDAs,

Notebooks, Laptops, Palmtop PCs, and

Hand-Held Equipment

description/ordering information

The MAX211 device consists of four line drivers, five line receivers, and a dual charge-pump circuit with

±15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the

requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication

controller and the serial-port connector. The charge pump and four small external capacitors allow operation

from a single 5-V supply. The devices operate at data signaling rates up to 120 kbit/s and a maximum of 30-V/µs

driver output slew rate.

The MAX211 has both shutdown (SHDN) and enable control (EN

). In shutdown mode, the charge pumps are

turned off, V+

is pulled down to V

, V− is pulled to GND, and the transmitter outputs are disabled. This

reduces supply current typically to 1 µA. EN

is used to put the receiver outputs into the high-impedance state

to allow wired-OR connection of two RS-232 ports. It has no effect on the RS-232 drivers or the charge pumps.

ORDERING INFORMATION

PACKAGE

†

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

SOIC (DW)

Tube of 20 MAX211CDW

MAX211C

0°C to 70°C

SOIC (DW)

Reel of 1000 MAX211CDWR

MAX211C

0°C to 70°C

SSOP (DB)

Tube of 50 MAX211CDB

MAX211C

SSOP (DB)

Reel of 2000 MAX211CDBR

MAX211C

SOIC (DW)

Tube of 20 MAX211IDW

MAX211I

−40°C to 85°C

SOIC (DW)

Reel of 1000 MAX211IDWR

MAX211I

−40°C to 85°C

SSOP (DB)

Tube of 50 MAX211IDB

MAX211I

SSOP (DB)

Reel of 2000 MAX211IDBR

MAX211I

†

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are

available at www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

DB OR DW PACKAGE

(TOP VIEW)

DOUT3

DOUT1

DOUT2

RIN2

ROUT2

DIN2

DIN1

ROUT1

RIN1

GND

C1+

V+

C1−

DOUT4

RIN3

ROUT3

SHDN

RIN4

ROUT4

DIN4

DIN3

ROUT5

RIN5

V−

C2−

C2+

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Summary of content (19 pages)

PAGE 1
± SLLS567E − MAY 2003 − REVISED JANUARY 2004 D RS-232 Bus-Pin ESD Protection Exceeds D D D D D D D D DB OR DW PACKAGE (TOP VIEW) ±15 kV Using Human-Body Model (HBM) Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates at 5-V VCC Supply Four Drivers and Five Receivers Operates Up To 120 kbit/s Low Supply Current in Shutdown Mode . . . 1 µA Typical External Capacitors . . . 4 × 0.
PAGE 2
± SLLS567E − MAY 2003 − REVISED JANUARY 2004 Function Tables INPUTS DRIVER RECEIVER DEVICE STATUS L All active All active Normal operation L H All active Z Normal operation H X Z Z Shutdown SHDN EN L X = don’t care, Z = high impedance EACH DRIVER INPUTS DIN SHDN OUTPUT DOUT L L H H L L X H Z DRIVER STATUS Normal operation Powered off X = don’t care, Z = high impedance EACH RECEIVER INPUTS RIN EN OUTPUT RO
PAGE 3
± SLLS567E − MAY 2003 − REVISED JANUARY 2004 logic diagram (positive logic) 7 2 DIN1 DOUT1 6 3 DIN2 TTL/CMOS Inputs DOUT2 20 DIN3 DOUT3 21 28 DIN4 DOUT4 25 8 SHDN 9 ROUT1 RIN1 5 4 ROUT2 RIN2 26 TTL/CMOS Outputs RS-232 Outputs 1 27 ROUT3 RIN3 22 RS-232 Inputs 23 ROUT4 RIN4 19 ROUT5 18 RIN5 24 EN POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3
PAGE 4
± SLLS567E − MAY 2003 − REVISED JANUARY 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V Positive charge pump voltage range, V+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC − 0.
PAGE 5
± SLLS567E − MAY 2003 − REVISED JANUARY 2004 DRIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4) PARAMETER VOH VOL IIH TEST CONDITIONS MIN TYP† High-level output voltage DOUT at RL = 3 kΩ to GND 5 9 Low-level output voltage DOUT at RL = 3 kΩ to GND −5 −9 Driver high-level input current DIN = VCC Control high-
PAGE 6
± SLLS567E − MAY 2003 − REVISED JANUARY 2004 RECEIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 6) PARAMETER TEST CONDITIONS VOH VOL High-level output voltage IOH = −1 mA IOL = 1.
PAGE 7
± SLLS567E − MAY 2003 − REVISED JANUARY 2004 PARAMETER MEASUREMENT INFORMATION ISHDN 0.1 µF + − 5.5 V 0.1 µF + − VCC C1+ 0.1 µF V+ + − V− 0.1 µF − + C1− C2+ 0.1 µF + − C2− VCC 400 kΩ 5.5 V DOUT DIN 3 kΩ D1 to D4 RIN ROUT +5.5 V EN 0-V or 5.5-V Drive 5 kΩ R1 to R5 5.5 V SHDN GND Figure 1.
PAGE 8
± SLLS567E − MAY 2003 − REVISED JANUARY 2004 PARAMETER MEASUREMENT INFORMATION 0V SHDN 3V Input Generator (see Note B) 1.5 V RS-232 Output 50 Ω RL 1.5 V 0V tPHL (D) CL (see Note A) tPLH (D) 3V Output −3 V TEST CIRCUIT SR(tr) + t PHL (D) 6V or t VOH 3V −3 V VOL VOLTAGE WAVEFORMS PLH (D) NOTES: A. CL includes probe and jig capacitance. B.
PAGE 9
± SLLS567E − MAY 2003 − REVISED JANUARY 2004 PARAMETER MEASUREMENT INFORMATION 3V 0V SHDN VCC S1 GND 1.5 V 0V tPZH (S1 at GND) tPHZ (S1 at GND) RL 3 V or 0 V 1.5 V Input Output Output VOH VOH − 0.1 V CL (see Note A) EN Generator (see Note B) 3.5 V tPZL (S1 at VCC) tPLZ (S1 at VCC) 50 Ω VOL + 0.1 V 0.8 V VOL Output TEST CIRCUIT NOTES: A. B. C. D. VOLTAGE WAVEFORMS CL includes probe and jig capacitance.
PAGE 10
± SLLS567E − MAY 2003 − REVISED JANUARY 2004 APPLICATION INFORMATION DOUT3 DOUT1 DOUT2 RIN2 1 28 2 27 3 RIN3 5 kΩ 4 26 5 kΩ ROUT2 DOUT4 25 24 5 23 5V ROUT3 SHDN EN RIN4 5 kΩ 400 kΩ DIN2 6 22 ROUT4 5V 5V 400 kΩ DIN1 ROUT1 RIN1 GND 7 400 kΩ 21 8 9 5V 10 5 kΩ 400 kΩ 20 CBYPASS − DIN4 DIN3 = 0.1µF + 11 VCC C3 † = 0.1 µF 6.3 V − 18 + 12 13 C1 = 0.1 µF 6.3 V 19 VCC C1+ C4 = 0.
PAGE 11
± SLLS567E − MAY 2003 − REVISED JANUARY 2004 APPLICATION INFORMATION capacitor selection The capacitor type used for C1−C4 is not critical for proper operation. The MAX211 requires 0.1-µF capacitors, although capacitors up to 10 µF can be used without harm. Ceramic dielectrics are suggested for the 0.1-µF capacitors.
PAGE 12
± SLLS567E − MAY 2003 − REVISED JANUARY 2004 APPLICATION INFORMATION 1.5 VHBM = 2 kV DUT = 10 V, 1-Ω Zener Diode I DUT − A 1.0 0.5 0.0 0 50 100 150 200 Time − ns Figure 8. Typical HBM Current Waveform Machine Model The Machine Model (MM) ESD test applies to all pins, using a 200-pF capacitor with no discharge resistance.
PAGE 13
PACKAGE OPTION ADDENDUM www.ti.
PAGE 14
PACKAGE OPTION ADDENDUM www.ti.com 28-May-2007 ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
PAGE 15
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device MAX211CDBR Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SSOP DB 28 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 MAX211CDWR SOIC DW 28 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 MAX211IDBR SSOP DB 28 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.
PAGE 16
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) MAX211CDBR SSOP DB 28 2000 367.0 367.0 38.0 MAX211CDWR SOIC DW 28 1000 367.0 367.0 55.0 MAX211IDBR SSOP DB 28 2000 367.0 367.0 38.0 MAX211IDWR SOIC DW 28 1000 367.0 367.0 55.
PAGE 17
PAGE 18
MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters.
PAGE 19
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.