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 ±  

SLLS590D − SEPTEMBER 2003 − REVISED AUGUST 2004

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

D ESD Protection for RS-232 Bus Pins

− ±15-kV Human-Body Model

D Meets or Exceeds the Requirements of

TIA/EIA-232-F and ITU v.28 Standards

D Operates at 5-V V

Supply

D Operates Up To 200 kbit/s

D Low Supply Current in Shutdown

Mode ...2 µA Typical

D External Capacitors ...4 × 0.1 µF

D Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

D Applications

− Battery-Powered Systems, PDAs,

Notebooks, Laptops, Palmtop PCs, and

Hand-Held Equipment

description/ordering information

The MAX222 consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV ESD

protection pin to pin (serial-port connection pins, including GND). This device meets the requirements of

TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and

the serial-port connector. The charge pump and four small external capacitors allow operation from a single 5-V

supply. This device operates at data signaling rates up to 200 kbit/s and a maximum of 30-V/µs driver output

slew rate. By using SHDN

, all receivers can be disabled.

ORDERING INFORMATION

PACKAGE

†

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

PDIP (N) Tube of 20 MAX222CN MAX222CN

0°C to 70°C

SOIC (DW)

Tube of 20 MAX222CDW

MAX222C

0 C to 70 C

SOIC (DW)

Reel of 1000 MAX222CDWR

MAX222C

PDIP (N) Tube of 20 MAX222IN MAX222IN

−40°C to 85°C

SOIC (DW)

Tube of 20 MAX222IDW

MAX222I

−40 C to 85 C

SOIC (DW)

Reel of 1000 MAX222IDWR

MAX222I

†

Package drawings, standard packing quantities, thermal data, symbolization, and PCB

design guidelines are available at www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

DW OR N PACKAGE

(TOP VIEW)

C1+

V+

C1−

C2+

C2−

V−

DOUT2

RIN2

SHDN

GND

DOUT1

RIN1

ROUT1

DIN1

DIN2

ROUT2

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Summary of content (16 pages)

PAGE 1
± SLLS590D − SEPTEMBER 2003 − REVISED AUGUST 2004 D ESD Protection for RS-232 Bus Pins D D D D D D D DW OR N PACKAGE (TOP VIEW) − ±15-kV Human-Body Model Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates at 5-V VCC Supply Operates Up To 200 kbit/s Low Supply Current in Shutdown Mode . . . 2 µA Typical External Capacitors . . . 4 × 0.
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± SLLS590D − SEPTEMBER 2003 − REVISED AUGUST 2004 Function Tables EACH DRIVER INPUT DIN OUTPUT DOUT L H H L H = high level, L = low level EACH RECEIVER INPUT RIN OUTPUT ROUT L H H L Open H H = high level, L = low level, Open = input disconnected or connected driver off logic diagram (positive logic) 12 15 DIN1 TTC/CMOS Inputs DOUT1 11 DIN2 DOUT2 13 14 ROUT1 TTC/CMOS Outputs RS-232 Outputs 8 RIN1 10 RS-232 Inputs 9
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± SLLS590D − SEPTEMBER 2003 − REVISED AUGUST 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V Input voltage range, VI: Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VCC − 0.
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± SLLS590D − SEPTEMBER 2003 − REVISED AUGUST 2004 DRIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4) PARAMETER VOH VOL IIH TEST CONDITIONS MIN TYP† High-level output voltage DOUT at RL = 3 kΩ to GND, DIN = GND 5 8 Low-level output voltage DOUT at RL = 3 kΩ to GND, DIN = VCC −5 −8 Driver high-level input current
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± SLLS590D − SEPTEMBER 2003 − REVISED AUGUST 2004 RECEIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4) PARAMETER VOH VOL High-level output voltage VIT+ VIT− Positive-going input threshold voltage Vhys ri Input hysteresis (VIT+ − VIT−) TEST CONDITIONS IOH = −1 mA IOL = 3.
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± SLLS590D − SEPTEMBER 2003 − REVISED AUGUST 2004 PARAMETER MEASUREMENT INFORMATION 3V Input Generator (see Note B) 1.5 V RS-232 Output 50 Ω RL 1.5 V 0V tPHL (D) CL (see Note A) tPLH (D) 3V Output −3 V TEST CIRCUIT SR(tr) + t PHL (D) 6V or t VOH 3V −3 V VOL VOLTAGE WAVEFORMS PLH (D) NOTES: A. CL includes probe and jig capacitance. B.
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± SLLS590D − SEPTEMBER 2003 − REVISED AUGUST 2004 APPLICATION INFORMATION 18 1 NC 2 SHDN VCC 17 C1+ + CBYPASS − = 0.1 µF + 3 C1 †+ − C3 0.1 µF, 0.1 µF, − 6.3 V 6.3 V 4 V+ GND 16 15 C1− DOUT1 14 5 RIN1 C2+ 5 kΩ + C2 − 0.1 µF, 6V 6 C2− 13 7 C4 DOUT2 RIN2 − 12 V− ROUT1 DIN1 + 8 11 9 10 DIN2 ROUT2 5 kΩ † C3 can be connected to VCC or GND. NOTES: A. Resistor values shown are nominal. B.
PAGE 8
± SLLS590D − SEPTEMBER 2003 − REVISED AUGUST 2004 APPLICATION INFORMATION capacitor selection The capacitor type used for C1−C4 is not critical for proper operation. The MAX222 requires 0.1-µF capacitors, although capacitors up to 10 µF can be used without harm. Ceramic dielectrics are suggested for the 0.1-µF capacitors.
PAGE 9
± SLLS590D − SEPTEMBER 2003 − REVISED AUGUST 2004 APPLICATION INFORMATION 1.5 VHBM = 2 kV DUT = 10-V, 1-Ω Zener Diode I DUT − A 1 0.5 0 0 50 100 150 200 Time − ns Figure 6. Typical HBM Current Waveform Machine Model The Machine Model (MM) ESD test applies to all pins using a 200-pF capacitor with no discharge resistance.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
PAGE 12
PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant MAX222CDWR SOIC DW 18 2000 330.0 24.4 10.9 12.0 2.7 12.0 24.0 Q1 MAX222IDWR SOIC DW 18 2000 330.0 24.4 10.9 12.0 2.7 12.0 24.
PAGE 13
PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) MAX222CDWR SOIC DW 18 2000 370.0 355.0 55.0 MAX222IDWR SOIC DW 18 2000 370.0 355.0 55.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.