Datasheet


      
 ±  
SLLS409K − JANUARY 2000 − REVISED MARCH 2004
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D RS-232 Bus-Pin ESD Protection Exceeds
±15 kV Using Human-Body Model (HBM)
D Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
D Operates With 3-V to 5.5-V V
CC
Supply
D Operates Up To 250 kbit/s
D Two Drivers and Two Receivers
D Low Standby Current...1 µA Typical
D External Capacitors ...4 × 0.1 µF
D Accepts 5-V Logic Input With 3.3-V Supply
D Alternative High-Speed Pin-Compatible
Device (1 Mbit/s)
− SNx5C3223
D Applications
Battery-Powered Systems, PDAs,
Notebooks, Laptops, Palmtop PCs, and
Hand-Held Equipment
description/ordering information
The MAX3223 consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV ESD
protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of
TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and
the serial-port connector. The charge pump and four small external capacitors allow operation from a single
3-V to 5.5-V supply. The device operates at data signaling rates up to 250 kbit/s and a maximum of 30-V/µs
driver output slew rate.
ORDERING INFORMATION
T
A
PACKAGE
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
SOIC (DW)
Tube of 25 MAX3223CDW
MAX3223C
SOIC (DW)
Reel of 2000 MAX3223CDWR
MAX3223C
−0°C to 70°C
SSOP (DB)
Tube of 70 MAX3223CDB
MA3223C
−0°C to 70°C SSOP (DB)
Reel of 2000 MAX3223CDBR
MA3223C
TSSOP (PW)
Tube of 70 MAX3223CPW
MA3223C
TSSOP (PW)
Reel of 2000 MAX3223CPWR
MA3223C
SOIC (DW)
Tube of 25 MAX3223IDW
MAX3223I
SOIC (DW)
Reel of 2000 MAX3223IDWR
MAX3223I
−40°C to 85°C
SSOP (DB)
Tube of 70 MAX3223IDB
MB3223I
−40°C to 85°C SSOP (DB)
Reel of 2000 MAX3223IDBR
MB3223I
TSSOP (PW)
Tube of 70 MAX3223IPW
MB3223I
TSSOP (PW)
Reel of 2000 MAX3223IPWR
MB3223I
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Copyright 2004, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DB, DW, OR PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
EN
C1+
V+
C1−
C2+
C2−
V−
DOUT2
RIN2
ROUT2
FORCEOFF
V
CC
GND
DOUT1
RIN1
ROUT1
FORCEON
DIN1
DIN2
INVALID
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