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

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 ±  

SLLS410I − JANUARY 2000 − REVISED JANUARY 2004

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

D RS-232 Bus-Pin ESD Protection Exceeds

±15 kV Using Human-Body Model (HBM)

D Meets or Exceeds the Requirements of

TIA/EIA-232-F and ITU v.28 Standards

D Operates With 3-V to 5.5-V V

Supply

D Operates Up To 250 kbit/s

D Two Drivers and Two Receivers

D Low Supply Current . . . 300 µA Typical

D External Capacitors ...4 × 0.1 µF

D Accepts 5-V Logic Input With 3.3-V Supply

D Alternative High-Speed Pin-Compatible

Device (1 Mbit/s)

− SNx5C3232

D Applications

− Battery-Powered Systems, PDAs,

Notebooks, Laptops, Palmtop PCs, and

Hand-Held Equipment

description/ordering information

ORDERING INFORMATION

PACKAGE

†

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

SOIC (D)

Tube of 40 MAX3232CD

MAX3232C

SOIC (D)

Reel of 2500 MAX3232CDR

MAX3232C

SOIC (DW)

Tube of 40 MAX3232CDW

MAX3232C

−0°C to 70°C

SOIC (DW)

Reel of 2000 MAX3232CDWR

MAX3232C

−0°C to 70°C

SSOP (DB)

Tube of 80 MAX3232CDB

MA3232C

SSOP (DB)

Reel of 2000 MAX3232CDBR

MA3232C

TSSOP (PW)

Tube of 90 MAX3232CPW

MA3232C

TSSOP (PW)

Reel of 2000 MAX3232CPWR

MA3232C

SOIC (D)

Tube of 40 MAX3232ID

MAX3232I

SOIC (D)

Reel of 2500 MAX3232IDR

MAX3232I

SOIC (DW)

Tube of 40 MAX3232IDW

MAX3232I

−40°C to 85°C

SOIC (DW)

Reel of 2000 MAX3232IDWR

MAX3232I

−40°C to 85°C

SSOP (DB)

Tube of 80 MAX3232IDB

MB3232I

SSOP (DB)

Reel of 2000 MAX3232IDBR

MB3232I

TSSOP (PW)

Tube of 90 MAX3232IPW

MB3232I

TSSOP (PW)

Reel of 2000 MAX3232IPWR

MB3232I

†

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are

available at www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

D, DB, DW, OR PW PACKAGE

(TOP VIEW)

C1+

V+

C1−

C2+

C2−

V−

DOUT2

RIN2

GND

DOUT1

RIN1

ROUT1

DIN1

DIN2

ROUT2

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Summary of content (21 pages)

PAGE 1
± SLLS410I − JANUARY 2000 − REVISED JANUARY 2004 D RS-232 Bus-Pin ESD Protection Exceeds D D D D D D D D D D, DB, DW, OR PW PACKAGE (TOP VIEW) ±15 kV Using Human-Body Model (HBM) Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates With 3-V to 5.5-V VCC Supply Operates Up To 250 kbit/s Two Drivers and Two Receivers Low Supply Current . . . 300 µA Typical External Capacitors . . . 4 × 0.
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± SLLS410I − JANUARY 2000 − REVISED JANUARY 2004 description/ordering information (continued) The MAX3232 device consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV ESD protection pin to pin (serial-port connection pins, including GND).
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± SLLS410I − JANUARY 2000 − REVISED JANUARY 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V Positive output supply voltage range, V+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.
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± SLLS410I − JANUARY 2000 − REVISED JANUARY 2004 DRIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4) PARAMETER TEST CONDITIONS MIN TYP† VOH VOL High-level output voltage DOUT at RL = 3 kΩ to GND, DIN = GND 5 5.4 Low-level output voltage DOUT at RL = 3 kΩ to GND, DIN = VCC −5 −5.
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± SLLS410I − JANUARY 2000 − REVISED JANUARY 2004 RECEIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4) PARAMETER VOH VOL TEST CONDITIONS High-level output voltage MIN IOH = −1 mA IOL = 1.6 mA Low-level output voltage VIT+ Positive-going input threshold voltage VCC = 3.
PAGE 6
± SLLS410I − JANUARY 2000 − REVISED JANUARY 2004 PARAMETER MEASUREMENT INFORMATION 3V Generator (see Note B) RS-232 Output 50 Ω RL 1.5 V Input 1.5 V 0V CL (see Note A) tPHL tPLH VOH 50% 50% Output VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 2.
PAGE 7
± SLLS410I − JANUARY 2000 − REVISED JANUARY 2004 APPLICATION INFORMATION 1 + CBYPASS − = 0.1µF + C1 − VCC 16 C1+ 2 †+ C3 − 3 4 V+ GND 14 DOUT1 C1− 13 C2+ + C2 15 RIN1 5 kΩ − 5 C2− 12 6 C4 DOUT2 RIN2 − V− 11 ROUT1 DIN1 + 7 10 8 9 DIN2 ROUT2 5 kΩ † C3 can be connected to VCC or GND. NOTES: A. Resistor values shown are nominal. B. Nonpolarized ceramic capacitors are acceptable.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
PAGE 12
PACKAGE MATERIALS INFORMATION www.ti.com 5-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing MAX3232CDR SOIC MAX3232CDRG4 MAX3232CDWR SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 6.5 10.3 2.1 8.0 16.0 Q1 D 16 2500 330.0 16.8 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.
PAGE 13
PACKAGE MATERIALS INFORMATION www.ti.com 5-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) MAX3232CDR SOIC D 16 2500 364.0 364.0 27.0 MAX3232CDRG4 SOIC D 16 2500 333.2 345.9 28.6 MAX3232CDWR SOIC DW 16 2000 366.0 364.0 50.0 MAX3232CDWRG4 SOIC DW 16 2000 367.0 367.0 38.0 MAX3232CPWR TSSOP PW 16 2000 364.0 364.0 27.0 MAX3232CPWRG4 TSSOP PW 16 2000 367.0 367.0 35.
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MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.