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C2+

GND

C2−

V−

DOUT1

DOUT2

DOUT3

RIN1

RIN2

DOUT4

RIN3

DOUT5

SHDN

C1+

V+

C1−

DIN1

DIN2

DIN3

ROUT1

ROUT2

DIN4

ROUT3

DIN5

ROUT1B

MBAUD

DB, DW, OR PW PACKAGE

(TOP VIEW)

QFN PACKAGE

(TOP VIEW)

C1–

DIN1

IN2

DIN3

ROUT1

ROUT2

DIN4

ROUT3

DOUT1

DOUT2

DOUT3

RIN1

RIN2

DOUT4

RIN3

V−

C2–

GND

C2+

C1+

V+

DOUT5

SHDN

MBAUD

ROUT1B

DIN5

3132 30 29 28 27 26 25

109 11 12 13 14 15 16

MAX3237E

www.ti.com

SLLS709B –MAY 2006–REVISED JANUARY 2010

3-V TO 5.5-V MULTICHANNEL RS-232

1-MBit/s LINE DRIVER/RECEIVER

Check for Samples: MAX3237E

FEATURES

• Meets or Exceeds the Requirements of • ESD Protection for RS-232 I/O Pins

TIA/EIA-232-F and ITU v.28 Standards

– ±15 kV – Human-Body Model (HBM)

• Operates With 3-V to 5.5-V V

Supply

– ±8 kV – IEC61000-4-2, Contact Discharge

• Operates From 250 kbits/s to 1 Mbit/s

– ±15 kV – IEC61000-4-2, Air-Gap Discharge

• Low Standby Current . . . 1 mA Typical

APPLICATIONS

• External Capacitors . . . 4 × 0.1 mF

• Battery-Powered, Hand-Held, and Portable

• Accepts 5-V Logic Input With 3.3-V Supply

Equipment

• Designed to Be Interchangeable With Maxim

• PDAs and Palmtop PCs

MAX3237E

• Notebooks, Sub-Notebooks, and Laptops

• Latch-Up Performance Exceeds 100 mA Per

• Digital Cameras

JESD 78, Class II

• Mobile Phones and Wireless Devices

DESCRIPTION

The MAX3237E consists of five line drivers, three line receivers, and a dual charge-pump circuit with ±15-kV

ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of

TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the

serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to

5.5-V supply. This device operates at data signaling rates of 250 kbit/s in normal operating mode

(MBAUD = GND) and 1Mbit/s when MBAUD = V

. The driver output slew rate is a maximum of 30 V/ms.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (20 pages)

PAGE 1
MAX3237E www.ti.com SLLS709B – MAY 2006 – REVISED JANUARY 2010 3-V TO 5.5-V MULTICHANNEL RS-232 1-MBit/s LINE DRIVER/RECEIVER Check for Samples: MAX3237E FEATURES 1 • • • • • • • Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates With 3-V to 5.5-V VCC Supply Operates From 250 kbits/s to 1 Mbit/s Low Standby Current . . . 1 mA Typical External Capacitors . . . 4 × 0.1 mF Accepts 5-V Logic Input With 3.
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MAX3237E SLLS709B – MAY 2006 – REVISED JANUARY 2010 www.ti.com The MAX3237E transmitters are disabled and the outputs are forced into high-impedance state when the device is in shutdown mode (SHDN = GND) and the supply current falls to less than 1 mA. Also, during shutdown, the onboard charge pump is disabled; V+ is lowered to VCC, and V– is raised toward GND. Receiver outputs also can be placed in the high-impedance state by setting enable (EN) high.
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MAX3237E www.ti.
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MAX3237E SLLS709B – MAY 2006 – REVISED JANUARY 2010 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range (2) –0.3 6 V V+ Positive-output supply voltage range (2) –0.3 7 V V– Negative-output supply voltage range (2) 0.3 –7 V 13 V V+ – V– Supply voltage difference VI Input voltage range VO Output voltage range (2) Package thermal impedance Tstg Storage temperature range (1) (2) (3) –0.
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MAX3237E www.ti.com SLLS709B – MAY 2006 – REVISED JANUARY 2010 DRIVER SECTION ELECTRICAL CHARACTERISTICS (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5) PARAMETER MIN TYP (2) TEST CONDITIONS VOH High-level output voltage DOUT at RL = 3 kΩ to GND, DIN = GND 5 5.4 VOL Low-level output voltage DOUT at RL = 3 kΩ to GND, DIN = VCC –5 –5.
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MAX3237E SLLS709B – MAY 2006 – REVISED JANUARY 2010 www.ti.com RECEIVER SECTION ELECTRICAL CHARACTERISTICS (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5) PARAMETER VOH High-level output voltage IOH = –1 mA VOL Low-level output voltage IOL = 1 mA TYP (2) VCC – 0.6 VCC – 0.1 MAX VCC = 3.
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MAX3237E www.ti.com SLLS709B – MAY 2006 – REVISED JANUARY 2010 PARAMETER MEASUREMENT INFORMATION 3V Generator (see Note B) Input RS-232 Output 50 Ω RL tTHL CL (see Note A) 3V SHDN = VCC TEST CIRCUIT 0V tTLH 3V 3V Output −3 V −3 V 6V SR(tr) + t THL or tTLH VOH VOL VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 1.
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MAX3237E SLLS709B – MAY 2006 – REVISED JANUARY 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) 3V Input VCC 3 V or 0 V 1.5 V GND S1 −3 V tPZH (S1 at GND) tPHZ (S1 at GND) RL 3 V or 0 V 1.5 V VOH Output 50% Output CL (see Note A) EN Generator (see Note B) 50 Ω 0.3 V tPZL (S1 at VCC) tPLZ (S1 at VCC) 0.3 V Output 50% VOL TEST CIRCUIT NOTES: A. B. C. D. VOLTAGE WAVEFORMS CL includes probe and jig capacitance.
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MAX3237E www.ti.com SLLS709B – MAY 2006 – REVISED JANUARY 2010 APPLICATION INFORMATION CBYPASS = 0.1 µF + − 1 2 + C2 V+ 28 27 + GND C3† − − 3 4 − + C1+ C2+ C2− VCC V− C1− C4 DOUT1 DOUT2 DOUT3 RIN1 + − 26 C1 25 5 24 6 23 7 22 8 21 DIN1 DIN2 DIN3 ROUT1 5 kΩ RS-232 Port RIN2 9 20 ROUT2 Logic I/Os 5 kΩ DOUT4 RIN3 10 19 11 18 DIN4 ROUT3 5 kΩ DOUT5 12 17 16 EN SHDN 13 14 15 DIN5 ROUT1B MBAUD † C3 can be connected to VCC or GND. NOTES: A.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 31-Oct-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.
PAGE 13
PACKAGE MATERIALS INFORMATION www.ti.com 12-Aug-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device MAX3237ECDBR Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SSOP DB 28 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 MAX3237ECDWR SOIC DW 28 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 MAX3237ECPWR TSSOP PW 28 2000 330.0 16.4 6.9 10.2 1.8 12.0 16.
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PACKAGE MATERIALS INFORMATION www.ti.com 12-Aug-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) MAX3237ECDBR SSOP DB 28 2000 367.0 367.0 38.0 MAX3237ECDWR SOIC DW 28 1000 367.0 367.0 55.0 MAX3237ECPWR TSSOP PW 28 2000 367.0 367.0 38.0 MAX3237EIDBR SSOP DB 28 2000 367.0 367.0 38.0 MAX3237EIPWR TSSOP PW 28 2000 367.0 367.0 38.
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MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.