Datasheet

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      
 ±   
SLLS349J − JUNE 1999 − REVISED MARCH 2004
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D RS-232 Bus-Pin ESD Protection Exceeds
±15 kV Using Human-Body Model (HBM)
D Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
D Operates With 3-V to 5.5-V V
CC
Supply
D Operates Up To 250 kbit/s
D Five Drivers and Three Receivers
D Low Standby Current...1 µA Typical
D External Capacitors ...4 × 0.1 µF
D Accepts 5-V Logic Input With 3.3-V Supply
D Always-Active Noninverting Receiver
Output (ROUT1B)
D Alternative High-Speed Pin-Compatible
Device (1 Mbit/s)
− SNx5C3238
D Applications
− Battery-Powered Systems, PDAs,
Notebooks, Subnotebooks, Laptops,
Palmtop PCs, Hand-Held Equipment,
Modems, and Printers
description/ordering information
The MAX3238 consists of five line drivers, three line receivers, and a dual charge-pump circuit with ±15-kV ESD
(HBM) protection pin to pin (serial-port connection pins, including GND). The device meets the requirements
of TIA/EIA-232-F and provides the electrical interface between notebook and subnotebook computer
applications. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V
supply. In addition, the device includes an always-active noninverting output (ROUT1B), which allows
applications using the ring indicator to transmit data while the device is powered down. These devices operate
at data signaling rates up to 250 kbit/s and a maximum of 30-V/µs driver output slew rate.
ORDERING INFORMATION
T
A
PACKAGE
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
SSOP (DB)
Tube of 50 MAX3238CDB
MAX3238C
−0°C to 70°C
SSOP (DB)
Reel of 2000 MAX3238CDBR
MAX3238C
−0°C to 70°C
TSSOP (PW)
Tube of 50 MAX3238CPW
MA3238C
TSSOP (PW)
Reel of 2000 MAX3238CPWR
MA3238C
SSOP (DB)
Tube of 50 MAX3238IDB
MAX3238I
−40°C to 85°C
SSOP (DB)
Reel of 2000 MAX3238IDBR
MAX3238I
−40°C to 85°C
TSSOP (PW)
Tube of 50 MAX3238IPW
MB3238I
TSSOP (PW)
Reel of 2000 MAX3238IPWR
MB3238I
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Copyright 2004, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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C2+
GND
C2−
V−
DOUT1
DOUT2
DOUT3
RIN1
RIN2
DOUT4
RIN3
DOUT5
FORCEON
FORCEOFF
C1+
V+
V
CC
C1−
DIN1
DIN2
DIN3
ROUT1
ROUT2
DIN4
ROUT3
DIN5
ROUT1B
INVALID
DB OR PW PACKAGE
(TOP VIEW)
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