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MSP430 Hardware Tools

User's Guide

Literature Number: SLAU278Q

May 2009–Revised February 2014

Summary of content (156 pages)

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MSP430 Hardware Tools User's Guide Literature Number: SLAU278Q May 2009 – Revised February 2014
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Contents ....................................................................................................................................... 7 Get Started Now! ............................................................................................................... 10 1.1 Flash Emulation Tool (FET) Overview .................................................................................. 11 1.2 Kit Contents, MSP-FET430PIF ...........................................................................
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www.ti.com B.17 B.18 B.19 B.20 B.21 B.22 B.23 B.24 B.25 B.26 B.27 B.28 B.29 B.30 B.31 B.32 B.33 B.34 B.35 MSP-TS430PM64A ....................................................................................................... 79 MSP-TS430RGC64B ..................................................................................................... 82 MSP-TS430RGC64C ..................................................................................................... 85 MSP-TS430RGC64USB ......................
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www.ti.com List of Figures 2-1. Signal Connections for 4-Wire JTAG Communication ................................................................ 21 2-2. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F2xx, MSP430G2xx, and MSP430F4xx Devices ............................................................................. 22 2-3. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F5xx and MSP430F6xx Devices .........................................
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www.ti.com B-44. MSP-TS430PN80A Target Socket Module, PCB ..................................................................... B-45. MSP-TS430PN80USB Target Socket Module, Schematic .......................................................... 97 99 B-46. MSP-TS430PN80USB Target Socket Module, PCB ................................................................ 100 B-47. MSP-TS430PZ100 Target Socket Module, Schematic 103 B-48. .............................................................
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www.ti.com List of Tables 1-1. Flash Emulation Tool (FET) Features and Device Compatibility .................................................... 11 1-2. Individual Kit Contents, MSP-TS430xx ................................................................................. 14 B-1. MSP-TS430D8 Bill of Materials .......................................................................................... 33 B-2. MSP-TS430PW14 Bill of Materials ............................................................
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Preface SLAU278Q – May 2009 – Revised February 2014 Read This First About This Manual This manual describes the hardware of the Texas Instruments MSP-FET430 Flash Emulation Tool (FET). The FET is the program development tool for the MSP430™ ultra-low-power microcontroller. Both available interface types, the parallel port interface and the USB interface, are described. How to Use This Manual Read and follow the instructions in Chapter 1.
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Information About Cautions and Warnings www.ti.com Information About Cautions and Warnings This document may contain cautions and warnings. CAUTION This is an example of a caution statement. A caution statement describes a situation that could potentially damage your software or equipment. WARNING This is an example of a warning statement. A warning statement describes a situation that could potentially cause harm to you. The information in a caution or a warning is provided for your protection.
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If You Need Assistance www.ti.com MSP430FR57xx Family User's Guide (literature number SLAU272) MSP430FR58xx and MSP430FR59xx Family User's Guide (literature number SLAU367) If You Need Assistance Support for the MSP430 devices and the FET development tools is provided by the Texas Instruments Product Information Center (PIC). Contact information for the PIC can be found on the TI web site at www.ti.com/support.
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Chapter 1 SLAU278Q – May 2009 – Revised February 2014 Get Started Now! This chapter lists the contents of the FET and provides instruction on installing the hardware. Topic 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 1.10 1.11 1.12 1.13 1.14 1.15 1.16 1.17 1.18 10 ........................................................................................................................... Flash Emulation Tool (FET) Overview ..................................................................
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Flash Emulation Tool (FET) Overview www.ti.com 1.1 Flash Emulation Tool (FET) Overview TI offers several flash emulation tools according to different requirements.
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Kit Contents, MSP-FET430PIF 1.2 www.ti.com Kit Contents, MSP-FET430PIF • • • • One One One One READ ME FIRST document MSP-FET430PIF interface module 25-conductor cable 14-conductor cable NOTE: This part is obsolete and is not recommended to use in new design. 1.3 Kit Contents, eZ430-F2013 • • 1.4 Kit Contents, eZ430-T2012 • 1.
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Kit Contents, eZ430-Chronos-xxx www.ti.com 1.
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Kit Contents, FET430F6137RF900 www.ti.com 1.11 Kit Contents, FET430F6137RF900 • • • • • • • • • • • One READ ME FIRST document One legal notice One MSP-FET430UIF interface module Two EM430F6137RF900 target socket modules. This is the PCB on which is soldered a CC430F6137 device in a 64-pin RGC package. A 2×7-pin male connector is also present on the PCB. Two CC430EM battery packs Four AAA batteries Two 868-MHz or 915-MHz antennas Two 32.
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Kit Contents, MSP-TS430xx www.ti.com Table 1-2.
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Kit Contents, EM430Fx1x7RF900 www.ti.com Table 1-2.
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Hardware Installation, MSP-FET430UIF www.ti.com 1.15 Hardware Installation, MSP-FET430UIF Follow these steps to install the hardware for the MSP-FET430UIF tool: 1. Install the IDE (CCS or IAR) you plan to use before connecting USB-FET interface to PC. The IDE installation installs drivers automatically. 2. Use the USB cable to connect the USB-FET interface module to a USB port on the PC. The USB FET should be recognized, as the USB device driver is installed automatically.
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Important MSP430 Documents on the Web www.ti.com 1.18 Important MSP430 Documents on the Web The primary sources of MSP430 information are the device-specific data sheet and user's guide. The MSP430 web site (www.ti.com/msp430) contains the most recent version of these documents. PDF documents describing the CCS tools (CCS IDE, the assembler, the C compiler, the linker, and the librarian) are in the msp430\documentation folder.
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Chapter 2 SLAU278Q – May 2009 – Revised February 2014 Design Considerations for In-Circuit Programming This chapter presents signal requirements for in-circuit programming of the MSP430. Topic 2.1 2.2 2.3 ........................................................................................................................... Page Signal Connections for In-System Programming and Debugging ............................ 20 External Power ...................................................................
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Signal Connections for In-System Programming and Debugging 2.1 www.ti.com Signal Connections for In-System Programming and Debugging MSP-FET430PIF, MSP-FET430UIF, MSP-GANG, MSP-GANG430, MSP-PRGS430 With the proper connections, the debugger and an FET hardware JTAG interface (such as the MSPFET430PIF and MSP-FET430UIF) can be used to program and debug code on the target board.
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Signal Connections for In-System Programming and Debugging www.ti.com VCC Important to connect MSP430Fxxx J1 (see Note A) VCC/AVCC/DVCC J2 (see Note A) R1 47 kW (see Note B) C2 10 µF C3 0.1 µF JTAG VCC TOOL VCC TARGET TEST/VPP RST/NMI 2 1 4 3 6 5 8 7 10 9 12 11 14 13 TDO/TDI TDO/TDI TDI/VPP TDI/VPP TMS TMS TCK TCK GND RST (see Note D) TEST/VPP (see Note C) C1 10 nF/2.2 nF (see Notes B and E) VSS/AVSS/DVSS A If a local target power supply is used, make connection J1.
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Signal Connections for In-System Programming and Debugging www.ti.com VCC Important to connect MSP430Fxxx J1 (see Note A) VCC/AVCC/DVCC J2 (see Note A) R1 47 kΩ See Note B C2 10 µF C3 0.1 µF JTAG VCC TOOL VCC TARGET TEST/VPP 2 1 4 3 6 5 8 7 10 9 12 11 14 13 TDO/TDI RST/NMI/SBWTDIO TCK GND R2 330Ω TEST/SBWTCK C1 2.2 nF See Note B VSS/AVSS/DVSS A If a local target power supply is used, make connection J1. If power from the debug or programming adapter is used, make connection J2.
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Signal Connections for In-System Programming and Debugging www.ti.com VCC Important to connect MSP430Fxxx J1 (see Note A) VCC/AVCC/DVCC J2 (see Note A) R1 47 kΩ See Note B C2 10 µF C3 0.1 µF JTAG VCC TOOL VCC TARGET 2 1 4 3 6 5 8 7 10 9 12 11 14 13 TDO/TDI RST/NMI/SBWTDIO TCK GND TEST/SBWTCK C1 2.2 nF See Note B VSS/AVSS/DVSS A Make connection J1 if a local target power supply is used, or make connection J2 if the target is powered from the debug or programming adapter.
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External Power 2.2 www.ti.com External Power The MSP-FET430UIF can supply targets with up to 60 mA through pin 2 of the 14-pin connector. Note that the target should not consume more than 60 mA, even as a peak current, as it may violate the USB specification. For example, if the target board has a capacitor on VCC more than 10 µF, it may cause inrush current during capacitor charging that may exceed 60 mA.
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Appendix A SLAU278Q – May 2009 – Revised February 2014 Frequently Asked Questions and Known Issues This appendix presents solutions to frequently asked questions regarding the MSP-FET430 hardware. Topic A.1 A.2 ........................................................................................................................... Page Hardware FAQs ................................................................................................. 26 Known Issues .......................................
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Hardware FAQs A.1 www.ti.com Hardware FAQs 1. MSP430F22xx Target Socket Module (MSP-TS430DA38) – Important Information Due to the large capacitive coupling introduced by the device socket between the adjacent signals XIN/P2.6 (socket pin 6) and RST/SBWTDIO (socket pin 7), in-system debugging can disturb the LFXT1 low-frequency crystal oscillator operation (ACLK). This behavior applies only to the Spy-Bi-Wire (2-wire) JTAG configuration and only to the period while a debug session is active.
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Hardware FAQs www.ti.com 11. Information memory may not be blank (erased to 0xFF) when the device is delivered from TI. Customers should erase the information memory before its first use. Main memory of packaged devices is blank when the device is delivered from TI. 12. The device current is higher then expected. The device current measurement may not be accurate with the debugger connected to the device. For accurate measurement, disconnect the debugger.
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Known Issues A.2 www.ti.com Known Issues MSP-FET430UIF Current detection algorithm of the UIF firmware Problem Description If high current is detected, the ICC monitor algorithm stays in a loop of frequently switching on and off the target power supply. This power switching puts some MSP430 devices such as the MSP430F5438 in a state that requires a power cycle to return the device to JTAG control.
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Appendix B SLAU278Q – May 2009 – Revised February 2014 Hardware This appendix contains information relating to the FET hardware, including schematics, PCB pictorials, and bills of materials (BOMs). All other tools, such as the eZ430 series, are described in separate productspecific user's guides.
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Appendix B Topic www.ti.com ........................................................................................................................... B.1 B.2 B.3 B.4 B.5 B.6 B.7 B.8 B.9 B.10 B.11 B.12 B.13 B.14 B.15 B.16 B.17 B.18 B.19 B.20 B.21 B.22 B.23 B.24 B.25 B.26 B.27 B.28 B.29 B.30 B.31 B.32 B.33 B.34 B.35 30 Hardware Page MSP-TS430D8 ................................................................................................... 31 MSP-TS430PW14 .........................................
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MSP-TS430D8 B.1 MSP-TS430D8 www.ti.com Vcc J5 3 2 1 14 12 10 8 6 4 2 SBW 13 11 9 7 5 3 1 GND SBWTCK RST/SBWTDIO TST/SBWTCK to measure supply current J6 J4 R2 330R 1 2 3 4 TST/SBWTCK FE4L J1 VCC430 P1.2 P1.5 P1.6 U1 RST/SBWTDIO R5 47K MSP-TS430D8 DVCC P1.2/TA1/A2 P1.5/TA0/A5/SCLK P1.6/TA1/A6/SDO/SCL DNP GND C8 2.2nF 1 2 3 4 Socket: YA MAICHI Type: IC369-0082 DVSS TST/SBWTCK RST/SBWTDIO P1.7/A7/SDI/SDA 8 7 6 5 GND GND TST/SBWTCK RST/SBWTDIO P1.
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MSP-TS430D8 www.ti.com 14 pin connector for debugging only in Spy-Bi-Wire mode (4 Wire JTAG not available) D1 LED connected to P1.2 Connector J5 External power connector Jumper JP3 to "ext" Jumper JP2 Open to disconnect LED Orient Pin 1 of MSP430 device Figure B-2.
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MSP-TS430D8 www.ti.com Table B-1. MSP-TS430D8 Bill of Materials Position No. per Board Ref Des Description DigiKey Part No. Comment 1 J4, J6 2 2-pin header, male, TH SAM1035-02-ND place jumper on header 2 J5 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2 3 SBW 1 10-pin connector, male, TH HRP10H-ND 4 J3 1 3-pin header, male, TH SAM1035-03-ND 5 C8 1 2.
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Vcc J5 3 2 1 14 12 10 8 6 4 2 JTAG 13 11 9 7 5 3 1 GND RST/NMI SBWTCK TMS TDI TDO/SBWTDIO J7 3 2 1 TEST/SBWTCK JTAG -> SBW -> XIN XOUT to measure supply current J6 Q1 DNP J4 R2 330R 1 2 3 4 5 6 7 TEST/SBWTCK J1 J8 3 2 1 C8 2.2nF 1 2 3 4 5 6 7 J9 3 2 1 P1.7/TDO 3 2 1 J10 GND XIN XOUT TEST/SBWTCK RST/SBWTDIO P1.7/TDO P1.6/TDI Socket: ENPLAS Type: OTS-14-065 14 13 12 11 10 9 8 P1.6/TDI 14 13 12 11 10 9 8 J2 3 2 1 J11 VCC P1.
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MSP-TS430PW14 www.ti.com Connector J3 External power connector Jumper J5 to 'ext' LED connected to P1.0 Jumpers J7 to J12 Close 1-2 to debug in Spy-Bi-Wire Mode. Close 2-3 to debug in 4-wire JTAG mode. Jumper J4 Open to disconnect LED Orient Pin 1 of MSP430 device Jumper J6 Open to measure current Figure B-4.
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MSP-TS430PW14 www.ti.com Table B-2. MSP-TS430PW14 Bill of Materials Position Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 511-1463-2-ND 478-3351-2-ND 2 C7 1 10uF, 10V, Tantal Size B 3 C3, C5 1 100nF, SMD0805 4 C8 0 2.2nF, SMD0805 5 D1 1 green LED, SMD0603 6 J1, J2 0 DigiKey Part No. Comment DNP DNP: C3 DNP 475-1056-2-ND DNP: Headers and receptacles enclosed with kit.
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MSP-TS430L092 www.ti.com B.3 MSP-TS430L092 Figure B-5.
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MSP-TS430L092 www.ti.com Settings of the MSP-TS430L092 Target Socket Figure B-6 shows the PCB layout of the MSP-TS430L092 target socket. The following pinning is recommended: • JP1 is write enable for the EPROM. If this is not set, the EPROM can only be read. • JP2 and JP3 connect device supply with boost converter. They can be opened to measure device current consumption. For default operation, they should be closed. Figure B-6.
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MSP-TS430L092 www.ti.com Table B-3. MSP-TS430L092 Bill of Materials Pos. Ref Des No. No. Per Board 1 C1, C2 2 330nF, SMD0603 2 C5 1 100n, SMD0603 3 C6 1 10u, SMD0805 4 C10 1 100n, SMD0603 5 EEPROM1 1 M95512 SO08 (SO8) 7 J1, J2 Description 2 DigiKey Part No. ST Micro M95160R Comment Digikey: 497-8688-1-ND DNP: headers and receptacles enclosed with kit. Keep vias free of solder.
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MSP-TS430L092 Active Cable B.4 www.ti.com MSP-TS430L092 Active Cable Figure B-7.
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MSP-TS430L092 Active Cable www.ti.com Figure B-8 shows the PCB layout for the Active Cable. The following pinning is possible: • JP1 has two jumpers (Jumper 1 and Jumper 2) that can be set as shown in Table B-4. Table B-4. MSP-TS430L092 JP1 Settings • Jumper 1 Jumper 2 Description Off Off The active cable has no power and does not function. Off On The active cable receives power from target socket. For this option, the target socket must have its own power supply.
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MSP-TS430L092 Active Cable www.ti.com Table B-5. MSP-TS430L092 Active Cable Bill of Materials 42 Pos. Ref Des No. Per Board 1 C1, C3, C5, C6 4 100nF, SMD0603 2 C2, C4 2 1uF, SMD0805 3 R1, R10 2 10K, SMD0603 4 R2 1 4K7, SMD0603 5 R5, R6, R7, R9 4 100, SMD0603 6 R8 1 680k, SMD0603 7 R11, R15 2 1K, SMD0603 8 R12 0 SMD0603 DNP 9 R13 0 SMD0603 DNP 10 R14 1 0, SMD0603 11 IC1 1 SN74AUC1G04DBVR 12 IC2, IC3, IC4 3 SN74AUC2G125DCTR Description DigiKey Part No.
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MSP-TS430PW24 www.ti.com B.5 MSP-TS430PW24 Figure B-9.
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MSP-TS430PW24 www.ti.com Connector J5 External power connector Jumper JP1 to "ext" Jumper JP2 Open to measure current Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Orient Pin 1 of MSP430 device D1 LED connected to P1.0 Jumper JP3 Open to disconnect LED Figure B-10.
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MSP-TS430PW24 www.ti.com Table B-6. MSP-TS430PW24 Bill of Materials Position Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C5 1 2.2nF, SMD0805 3 C3, C7 2 10uF, 10V, SMD0805 4 C4, C6, C8 3 100nF, SMD0805 478-3351-2-ND 5 D1 1 green LED, SMD0805 P516TR-ND 6 J1, J2 0 12-pin header, TH "SAM1029-07NDSAM1213-07-ND" DNP: Headers and receptacles enclosed with kit. Keep vias free of solder.
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If external supply voltage: - R9 GND C2 R8 0R R2 0R 2 Q1 560R R3 R1 - 12pF C1 12pF LED3 D1 14 12 10 8 6 4 2 JTAG ML14 13 11 9 7 5 3 1 J5 JP1Q 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1 C8 TDO TDI TMS TCK P1.3 P1.2 P1.1 P1.0 P2.4 P2.3 P3.7 P3.6 P3.5 P3.4 10nF RST/NMI C5 C7 100nF 10uF/10V J4 JP1Q SMD-Footprint F123 TST/VPP 1 VCC430 2 3 P2.5 4 GND 5 XOUT 6 XIN RST/NMI 7 8 P2.0 9 P2.1 10 P2.2 11 P3.0 12 P3.1 13 P3.2 14 P3.
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MSP-TS430DW28 www.ti.com LED connected to P1.0 Jumper J4 Open to disconnect LED Jumper J5 Open to measure current Connector J3 External power connector Remove R8 and jumper R9 Orient Pin 1 of MSP430 device Figure B-12.
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MSP-TS430DW28 www.ti.com Table B-7. MSP-TS430DW28 Bill of Materials Position Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C5 1 100nF, SMD0805 3 C7 1 10uF, 10V Tantal Elko B 4 C8 1 10nF SMD0805 5 D1 1 LED3 T1 3mm yellow RS: 228-4991 6 Q1 0 QUARZ, Crystal Micro Crystal MS1V-T1K 32.768kHz, C(Load) = DNP: Cover holes while soldering 12.5pF 7 J1, J2 2 Description DigiKey Part No.
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MSP-TS430PW28 B.7 MSP-TS430PW28 www.ti.com Vcc int ext 3 2 1 VCC430 C2 12pF DNP C4 14 12 10 8 6 4 2 JTAG 13 11 9 7 5 3 1 VCC P1.0 GND JTAG -> SBW -> XOUT/P2.7 R6 0R DNP TEST/SBWTCK 100nF R5 0R XIN/P2.6 DNP Q1 R1 330R JP3 RST/NMI TCK/SBWTCK TMS TDI TDO/SBWTDIO 3 2 1 R7 330R JP5 TEST/SBWTCK1 VCC430 2 3 P2.5 4 GND XOUT/P2.75 XIN/P2.6 6 RST/SBWTDIO7 8 P2.0 9 P2.1 10 P2.2 11 P3.0 12 P3.1 13 P3.2 14 P3.3 TEST/SBWTCK 3 2 1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 U1 R4 47k TST VCC P2.
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MSP-TS430PW28 www.ti.com Jumper JP4 to JP9: Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Jumper JP1 1-2 (int): Power supply via JTAG interface 2-3 (ext): External Power Supply Jumper JP2 Open to measure current Orient Pin 1 of Device Jumper JP3 Open to disconnect LED LED D1 connected to P5.1 Figure B-14.
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MSP-TS430PW28 www.ti.com Table B-8. MSP-TS430PW28 Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C3 1 10uF, 10V Tantal Elko B 3 C4 1 100nF, SMD0805 4 C5 0 2.2nF, SMD0805 5 D1 1 LED green SMD0603 6 Q1 0 QUARZ, Crystal 7 J1, J2 2 Description (1) DigiKey Part No. Comment DNP: C1, C2 , Cover holes while soldering DNP Micro Crystal MS1V-T1K 32.768kHz, C(Load) = 12.
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MSP-TS430PW28A B.8 www.ti.com MSP-TS430PW28A JTAG Mode selection: 4-wire JTAG: Set jumpers J4 to J9 to position 2-3 2-wire "SpyBiWire": Set jumpers J4 to J9 to position 2-1 Figure B-15.
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MSP-TS430PW28A www.ti.com Connector J5 External power connector Jumper JP1 to "ext" Jumper JP2 Open to measure current Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Orient Pin 1 of MSP430 device Jumper JP3 Open to disconnect LED D1 LED connected to P1.0 Figure B-16.
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MSP-TS430PW28A www.ti.com Table B-9. MSP-TS430PW28A Bill of Materials Position Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C5 1 2.
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MSP-TS430DA38 B.9 MSP-TS430DA38 www.ti.com Vcc int ext 3 2 1 14 12 10 8 6 4 2 JTAG VCC430 C2 12pF DNP C1 12pF DNP D1 yellow 13 11 9 7 5 3 1 C5 100nF GND RST/NMI TCK/SBWTCK TMS TDI TDO/SBWTDIO VCC 3 2 1 JP4 J1 TEST/SBWTCK JTAG -> SBW -> P1.0 P2.7/XOUT Q1 DNP P2.6/XIN R3 560R JP3 R1 330R 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 P1.7/TDO 38 P1.6/TDI 37 P1.5/TMS 36 P1.4/TCK 35 34 P1.3 33 P1.2 32 P1.1 31 P1.0 30 P2.4 29 P2.3 28 P3.7 27 P3.6 26 P3.5 25 P3.4 24 P4.
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MSP-TS430DA38 www.ti.com Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire Mode, Close 2-3 to debug in 4-wire JTAG Mode LED connected to P1.0 Jumper JP3 Open to disconnect LED Orient pin 1 of MSP430 device Jumper JP2 Open to measure current Connector J3 External power connector Jumper JP1 to 'ext' Figure B-18.
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MSP-TS430DA38 www.ti.com Table B-10. MSP-TS430DA38 Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND 3 C5 1 100nF, SMD0805 478-3351-2-ND 4 C8 0 2.2nF, SMD0805 5 D1 1 green LED, SMD0603 6 J1, J2 0 Description DigiKey Part No. Comment DNP DNP 475-1056-2-ND DNP: headers and receptacles enclosed with kit.Keep vias free of solder.
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MSP-TS430QFN23x0 www.ti.com B.10 MSP-TS430QFN23x0 Figure B-19.
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MSP-TS430QFN23x0 www.ti.com Connector J5 External power connector Jumper JP1 to 'ext' Jumper JP2 Open to measure current Jumper JP3 Open to disconnect LED LED connected to P1.0 Figure B-20.
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MSP-TS430QFN23x0 www.ti.com Table B-11. MSP-TS430QFN23x0 Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C3 1 10uF, 10V, Tantal Size B 511-1463-2-ND 3 C4 1 100nF, SMD0805 478-3351-2-ND 4 C5 1 10nF, SMD0805 478-1383-2-ND 5 D1 1 green LED, SMD0603 475-1056-2-ND 6 J1, J2, J3, J4 DigiKey Part No. Comment DNP DNP: headers and receptacles enclosed with kit.Keep vias free of solder.
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MSP-TS430RSB40 www.ti.com B.11 MSP-TS430RSB40 Figure B-21.
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MSP-TS430RSB40 www.ti.com Connector J5 External power connector Jumper JP1 to "ext" Jumper JP2 Open to measure current Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Orient Pin 1 of MSP430 device Jumper JP3 Open to disconnect LED D1 LED connected to P1.0 Figure B-22.
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MSP-TS430RSB40 www.ti.com Table B-12. MSP-TS430RSB40 Bill of Materials Ref Des No. Per Board Description 1 C1, C2 0 12pF, SMD0805 2 C3, C7, C10, C12 3 10uF, 10V, SMD 0805 445-1371-1-ND DNP C12 3 C4, C6, C8, C11 3 100nF, SMD0805 311-1245-2-ND DNP C11 4 C5 1 2.2nF, SMD0805 5 C9 1 470nF, SMD0805 6 D1 1 green LED, SMD0805 Pos. 7 J1, J2, J3, J4 4 DigiKey Part No. Comment DNP: C1, C2 P516TR-ND DNP: headers and receptacles enclosed with kit. Keep vias free of solder.
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MSP-TS430RHA40A www.ti.com B.12 MSP-TS430RHA40A Figure B-23.
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MSP-TS430RHA40A www.ti.com Connector J5 External power connector Jumper JP1 to "ext" Jumper JP2 Open to measure current Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode D1 LED connected to P1.0 Jumper JP3 Open to disconnect LED Orient Pin 1 of MSP430 device Figure B-24.
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MSP-TS430RHA40A www.ti.com Table B-13. MSP-TS430RHA40A Bill of Materials Position Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 DNP: C1, C2 2 C5 0 2.2nF, SMD0805 DNP C12 3 C3, C7 2 10uF, 10V, SMD0805 5 4 C4, C6 2 100nF, SMD0805 5 C9 1 470nF, SMD0805 6 D1 1 green LED, SMD0805 7 J1, J2, J3, J4 4 Description DigiKey Part No. Comment DNP C11 478-3351-2-ND P516TR-ND DNP: headers and receptacles enclosed with kit. Keep vias free of solder.
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MSP-TS430DL48 www.ti.com B.13 MSP-TS430DL48 ext int 3 2 1 JP1 2 1 + C7 10uF/10V 560R R3 12pF C1 12pF C2 GND D1 LED3 2 14 12 10 8 6 4 2 13 11 9 7 5 3 1 C8 10nF TCK TMS TDI TDO GND 1 3 5 7 9 11 13 15 17 19 21 23 2 4 6 8 10 12 14 16 18 20 22 24 R5 47K R4 0R J1 RST/NMI R12 0R VCC C3 100nF P5.4 P5.3 P5.2 COM0 P2.0 P2.1 P2.2 P2.3 P2.4 P2.5 P2.6 P2.7 S5 P5.7 P5.6 P5.5 P5.0 P5.1 LCDCAP LCDREF P1.0 P1.1 P1.2 P1.3 C4 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 P1.
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MSP-TS430DL48 www.ti.com Jumper J5 Open to measure current LED connected to P1.0 Connector J3 External power connector Jumper JP1 to ‘ext’ Jumper J4 Open to disconnect LED Orient pin 1 of MSP430 device Figure B-26.
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MSP-TS430DL48 www.ti.com Table B-14. MSP-TS430DL48 Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C4, C7 2 10uF, 10V, Tantal Size B 511-1463-2-ND 3 C3, C5 2 100nF, SMD0805 478-3351-2-ND 4 C8 1 10nF, SMD0805 478-1383-2-ND 5 D1 1 yellow LED, TH, 3mm, T1 511-1251-ND 6 J1, J2 0 Description DigiKey Part No. Comment DNP DNP: Headers and receptacles enclosed with kit.Keep vias free of solder.
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MSP-TS430RGZ48B www.ti.com B.14 MSP-TS430RGZ48B Figure B-27.
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MSP-TS430RGZ48B www.ti.com Connector J5 External power connector Jumper JP1 to "ext" Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Jumper JP1 Open to measure current Orient Pin 1 of MSP430 device Jumper JP2 Open to disconnect LED D1 LED connected to P1.0 Figure B-28.
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MSP-TS430RGZ48B www.ti.com Table B-15. MSP-TS430RGZ48B Bill of Materials Position Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 DNP 2 C3, C4 0 47pF, SMD0805 DNP 3 C6, C7, C12 3 10uF, 6.3V, SMD0805 4 C5, C11, C13, C14 4 100nF, SMD0805 5 C8 1 2.2nF, SMD0805 6 C9 1 470nF, SMD0805 478-1403-2-ND 7 D1 1 green LED, SMD0805 P516TR-ND 8 J1, J2, J3, J4 0 12-pin header, TH SAM1029-12-ND (Header) SAM1213-12ND (Receptacle) DNP: Headers and receptacles enclosed with kit.
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MSP-TS430RGZ48C www.ti.com B.15 MSP-TS430RGZ48C Vcc ext int J1 3 2 1 VCC 14 12 10 8 6 4 2 JTAG 13 11 9 7 5 3 1 GND TEST/SBWTCK1 RST/NMI JP3 3 2 1 TCK/SBWTCK TMS TDI TDO/SBWTDIO JTAG -> R7 0R TEST/SBWTCK JP4 3 2 1 47k R4 JP5 3 2 PJ.0/TDO 1 DVSS 12 P4.6 11 P4.5 10 P4.4 9 P1.7 8 P1.6 7 P3.7 6 P3.6 5 P3.5 4 P3.4 3 P2.2 2 P2.1 1 DNP 36 35 34 33 32 31 30 29 28 27 26 25 DNP C9 JP7 GND 9 7 5 3 1 JP8 GND J2 Ext_PWR 3 2 PJ.
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MSP-TS430RGZ48C www.ti.com Figure B-30. MSP-TS430RGZ48C Target Socket Module, PCB Table B-16. MSP-TS430RGZ48C Revision History Revision 74 Hardware Comments 1.2 Initial release 1.3 LFOSC pins swapped at SV1 (9-10). HFOSC pins swapped at SV1 (6-7). BOOTST pin 4 now directly connected to the device RST/SBWTDIO pin.
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MSP-TS430RGZ48C www.ti.com Table B-17. MSP-TS430RGZ48C Bill of Materials Pos 1 Ref Des SV1, SV2, SV3, SV4 Number Per Board 4 Description DigiKey Part Number 12-pin header, TH Comment DNP: headers and receptacles enclosed with kit. Keep vias free of solder. SAM1029-12-ND : Header : Receptacle 1.1 SV1, SV2, SV3, SV4 4 12-pin receptable, TH DNP: headers and receptacles enclosed with kit. Keep vias free of solder.
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12pF C2 not assembled R9 12pF C1 R3 R4 2 13 11 9 7 5 3 1 J1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 100nF 1 0R R2 DVCC 2 3 4 5 6 7 XIN XOUT 10 11 12 13 14 15 16 10nF 47K VCC TCK TMS TDI TDO C8 R5 U2 MSP64PM Socket: Yamaichi IC51-0644-807 RST/NMI 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 C3 12pF not assembled C4 12pF 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 J3 10 8 6 4 2 BOOTST 9 7 5 3 1 ML10 not assembled J5 TITLE: MSP-TS430PM64 Document Number: PWR3 GND 1 2 3 For B
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MSP-TS430PM64 www.ti.com Connector J5 External power connection Remove R8 and jumper R9 LED connected to pin 12 Jumper J7 Open to measure current Jumper J6 Open to disconnect LED Orient Pin 1 of MSP430 device Figure B-32.
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MSP-TS430PM64 www.ti.com Table B-18. MSP-TS430PM64 Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 DNP 1.1 C3, C4 0 47pF, SMD0805 DNP: Only recommendation. Check your crystal spec. 2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND 3 C5 1 100nF, SMD0805 478-3351-2-ND 4 C8 1 10nF, SMD0805 478-1383-2-ND 5 C9 1 470nF, SMD0805 478-1403-2-ND 6 D1 1 green LED, SMD0805 P516TR-ND 7 J1, J2, J3, J4 DigiKey Part No.
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MSP-TS430PM64A www.ti.com B.17 MSP-TS430PM64A Vcc 3 2 ext 1 int JP3 2 1 JP2 14 12 10 8 6 4 2 R2 0R JTAG C5 100nF 13 11 9 7 5 3 1 DNP GND J4 R6 330R 3 TEST/SBWTCK 2 A 1 JP5 RST/NMI VCC TCK/SBWTCK TMS TDI TDO/SBWTDIO 3 2 1 JP4 AVCC AVSS Socket: Yamaichi IC51-0644-807 DNP GND R4 47k C3 2.2nF VCC430 RST/SBWTDIO B P1.0 P1.1 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 3 2 P7.0/TDO 1 C JP6 J3 3 2 1 JP7 P7.
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MSP-TS430PM64A www.ti.com Jumper JP3 1-2 (int): Power supply via JTAG interface 2-3 (ext): External Power Supply Jumper JP4 to JP9: Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Jumper JP2 Open to measure current Orient Pin 1 of Device Jumper JP1 Open to disconnect LED LED D1 connected to P5.1 Figure B-34.
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MSP-TS430PM64A www.ti.com Table B-19. MSP-TS430PM64A Bill of Materials Pos. Ref Des No. per Board 1 C1, C2, 0 12pF, SMD0805 DNP 2 C3 0 2.2nF, SMD0805 DNP 3 C6, 1 10uF, 10V, Tantal Size B 511-1463-2-ND 4 C4, C5 2 100nF, SMD0805 478-3351-2-ND 5 D1 1 green LED, SMD0805 P516TR-ND 6 J1, J2, J3, J4 Description 0 DigiKey Part No. Comment DNP: Headers and receptacles enclosed with kit. Keep vias free of solder.
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MSP-TS430RGC64B www.ti.com B.18 MSP-TS430RGC64B Figure B-35.
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MSP-TS430RGC64B www.ti.com Connector J5 External power connector Jumper JP3 to "ext" Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode If the system should be supplied via LDOI (J6), close JP4 and set JP3 to external Orient Pin 1 of MSP430 device D1 LED connected to P1.0 Jumper JP2 Open to disconnect LED Figure B-36.
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MSP-TS430RGC64B www.ti.com Table B-20. MSP-TS430RGC64B Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 DNP 2 C3, C4 0 47pF, SMD0805 DNP 3 C6, C7, C10 3 10uF, 6.3V, SMD0805 4 C5, C11, C13, C14, C15 5 100nF, SMD0805 5 C8 1 2.2nF, SMD0805 6 C9 1 470nF, SMD0805 7 C16 1 4.
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MSP-TS430RGC64C www.ti.com B.19 MSP-TS430RGC64C The MSP-TS430RGC64C target board has been designed with the option to operate with the target device DVIO input voltage supplied via header J6 (see Figure B-37). This development platform does not supply the 1.8-V DVIO rail on board and it MUST be provided by external power supply for proper device operation. For correct JTAG connection, programming, and debug operation, it is important to follow this procedure: 1.
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A 13 11 9 7 5 3 1 RST/NMI GND TCK TMS TDI TDO TCK 2 3 1 2 3 JP8 4 THERMAL_4 tbd C4 5 S.G. 9 7 5 3 1 J6 1 2 3 6 J5 0R DVCC 1 2 Size: 0R 1.1 MSP430 Tools TI Friesing Revision: Mentor Pads Logic V9 6 R11 PINHEAD_1X2 JP4 PINHEAD_1X3 GND GND BSL CN-ML10 0 1 8 6 4 2 BOOTST C16 GND C15 4.7uF 1 MSP-TS430RGC64C 100nF GND Comment: PINHEAD_1X3 3 2 1 DVIO Power Circle P1.2/TA0.1 P1.1/TA0.
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MSP-TS430RGC64C www.ti.com Connector J6 External power connector to supply DVIO Jumper JP4 For F524x devices, close. For F522x, F523x and F525x devices, close only if one power supply is used for VCC and DVIO, and if VCC is not higher then 1.98 V. Otherwise. supply DVIO over J6. Do not close if VCC > 1.98 V, as it may damage the chip. Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode. Close 2-3 to debug in 4-wire JTAG mode.
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MSP-TS430RGC64C www.ti.com Table B-21. MSP-TS430RGC64C Bill of Materials Item Qty Reference 1 0 C1, C2 12pF CAP, SMD, Ceramic, 0805 DNP C1 C2 2 0 C3, C4 tbd CAP, SMD, Ceramic, 0805 DNP C3 C4 4 3 C5, C7, C10 10uF CAP, SMD, Ceramic, 0805 5 5 C8 C6 C13-15 100nF CAP, SMD, Ceramic, 0805 5 5 C8 2.2nF CAP, SMD, Ceramic, 0805 6 1 C9 470nF CAP, SMD, Ceramic, 0805 7 1 C16 4.
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MSP-TS430RGC64USB www.ti.com B.20 MSP-TS430RGC64USB Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately 0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for example, to run the MCU at 3.0 V, set it to 3.3 V. Figure B-39.
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MSP-TS430RGC64USB www.ti.com Figure B-40.
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MSP-TS430RGC64USB www.ti.com Table B-22. MSP-TS430RGC64USB Bill of Materials Pos. Ref Des No. Per Board 1 C1, C2 0 12pF, SMD0805 1.1 C3, C4 2 47pF, SMD0805 2 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND 3 C5, C11, C13, C14 4 100nF, SMD0805 311-1245-2-ND 3.1 C10, C12 0 10uF, SMD0805 4 C8 1 2.2nF, SMD0805 5 C9 1 470nF, SMD0805 478-1403-2-ND 6 D1 1 green LED, SMD0805 P516TR-ND 7 J1, J2, J3, J4 Description 4 DigiKey Part No.
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MSP-TS430RGC64USB www.ti.com Table B-22. MSP-TS430RGC64USB Bill of Materials (continued) Ref Des No.
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MSP-TS430PN80 www.ti.com B.21 MSP-TS430PN80 NOTE: For MSP430F47x and MSP430FG47x devices: Connect pins 7 and 10 (GND) externally to DVSS (see data sheet). Connect load capacitance on Vref pin 60 when SD16 is used (see data sheet). For use of BSL: connect pin 1 of BOOST to pin 58 of U1 and pin 3 of BOOST to pin 57 of U1. Figure B-41.
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MSP-TS430PN80 www.ti.com LED connected to pin 12 Connector J5 External power connection Remove R8 and jumper R9 Jumper J6 Open to disconnect LED Orient Pin 1 of MSP430 device Figure B-42.
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MSP-TS430PN80 www.ti.com Table B-23. MSP-TS430PN80 Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 DNP: C1, C2 1.1 C3, C4 0 47pF, SMD0805 DNP: Only recommendation. Check your crystal spec. 2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND 3 C5 1 100nF, SMD0805 478-3351-2-ND 4 C8 1 10nF, SMD0805 478-1383-2-ND 5 D1 1 green LED, SMD0603 475-1056-2-ND 6 J1, J2, J3, J4 Description 0 DigiKey Part No.
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MSP-TS430PN80A www.ti.com B.22 MSP-TS430PN80A Figure B-43.
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MSP-TS430PN80A www.ti.com Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Connector J5 External power connector Jumper JP3 to "ext" Orient Pin 1 of MSP430 device If the system should be supplied via LDOI (J6), close JP4 and set JP3 to external Jumper JP2 Open to disconnect LED D1 LED connected to P1.0 Figure B-44.
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MSP-TS430PN80A www.ti.com Table B-24. MSP-TS430PN80A Bill of Materials Position Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 DNP 2 C3, C4 0 47pF, SMD0805 DNP 3 C6, C7, C10, C12 3 10uF, 6.3V, SMD0805 DNP C10 4 C5, C11, C13, C14, C15 5 100nF, SMD0805 5 C8 1 2.2nF, SMD0805 6 C9 1 470nF, SMD0805 7 C16 1 4.
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MSP-TS430PN80USB www.ti.com B.23 MSP-TS430PN80USB Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately 0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for example, to run the MCU at 3.0 V, set it to 3.3 V. NOTE: R11 should be populated. Figure B-45.
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MSP-TS430PN80USB www.ti.com Jumper JP3 1-2 (int): Power supply via JTAG debug interface 2-3 (ext): External power supply USB Connector Connector J5 External power connector Jumper JP3 to ‘ext’ Jumper JP1 Open to measure current Jumper JP4 Close for USB bus powered device Jumper JP5 to JP10 Close 1-2 to debug in Spy-BiWire mode. Close 2-3 to debug in 4-wire JTAG mode. BSL invoke button S3 LED connected to P1.0 Jumper JP2 Open to disconnect LED Figure B-46.
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MSP-TS430PN80USB www.ti.com Table B-25. MSP-TS430PN80USB Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 1.1 C3, C4 2 47pF, SMD0805 2 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND 3 C5, C11, C13, C14 4 100nF, SMD0805 311-1245-2-ND 3.1 C10, C12 0 10uF, SMD0805 311-1245-2-ND 4 C8 1 2.2nF, SMD0805 5 C9 1 470nF, SMD0805 478-1403-2-ND 6 D1 1 green LED, SMD0805 P516TR-ND 7 J1, J2, J3, J4 4 20-pin header, TH SAM1029-20-ND 7.
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MSP-TS430PN80USB www.ti.com Table B-25. MSP-TS430PN80USB Bill of Materials (continued) 102 Pos. Ref Des No. per Board 28 C35 1 10p Buerklin: 56D102 29 C36 1 10p Buerklin: 56D102 30 C38 1 220n Buerklin: 53D2074 31 C39 1 4u7 Buerklin: 53D2086 32 C40 1 0.
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MSP-TS430PZ100 www.ti.com B.24 MSP-TS430PZ100 NOTE: Connections between the JTAG header and pins XOUT and XIN are no longer required and should not be made. Figure B-47.
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MSP-TS430PZ100 www.ti.com Jumper J7 Open to measure current Jumper J6 Open to disconnect LED LED connected to pin 12 Connector J5 External power connection Remove R8 and jumper R9 Orient Pin 1 of MSP430 device Figure B-48.
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MSP-TS430PZ100 www.ti.com Table B-26. MSP-TS430PZ100 Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 DNP 1b C3, C4 0 47pF, SMD0805 DNP: Only recommendation. Check your crystal spec. 2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND 3 C5 1 100nF, SMD0805 478-3351-2-ND 4 C8 1 10nF, SMD0805 478-1383-2-ND 5 C9 1 470nF, SMD0805 478-1403-2-ND 6 D1 1 yellow LED, TH, 3mm, T1 511-1251-ND Description DigiKey Part No.
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MSP-TS430PZ100A www.ti.com B.25 MSP-TS430PZ100A Figure B-49.
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MSP-TS430PZ100A www.ti.com Jumper JP3 1-2 (int): Power supply via JTAG interface 2-3 (ext): External Power Supply Jumper JP1 Open to measure current Jumper JP2 Open to disconnect LED LED D1 connected to P5.1 Orient Pin 1 of Device Figure B-50.
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MSP-TS430PZ100A www.ti.com Table B-27. MSP-TS430PZ100A Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 DNP 1b C3, C4 0 47pF, SMD0805 DNP: Only recommendation. Check your crystal spec. 2 C7, C9 2 10uF, 10V, Tantal Size B 511-1463-2-ND 3 C5, C11, C14 3 100nF, SMD0805 311-1245-2-ND 4 C8 1 10nF, SMD0805 478-1358-1-ND 5 C6 0 470nF, SMD0805 478-1403-2-ND 6 D1 1 green LED, SMD0805 67-1553-1-ND 7 J1, J2, J3, J4 DigiKey Part No.
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MSP-TS430PZ100B www.ti.com B.26 MSP-TS430PZ100B Figure B-51.
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MSP-TS430PZ100B www.ti.com Connector J5 External power connector Jumper JP1 to "ext" Jumper JP1 Open to measure current Orient Pin 1 of MSP430 device JP11, JP12, JP13 Connect 1-2 to connect AUXVCCx with DVCC or drive AUXVCCx externally Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode D1 LED connected to P1.0 Jumper JP2 Open to disconnect LED Figure B-52.
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MSP-TS430PZ100B www.ti.com Table B-28. MSP-TS430PZ100B Bill of Materials Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C4, C5, C6 , C7, C8, C9 6 100nF, SMD0805 311-1245-2-ND 3 C10, C26 2 470 nF, SMD0805 478-1403-2-ND 4 C11, C12 1 10 uF / 6.3 V SMD0805 5 C13, C14, C16, C18, C19, C29 6 4.7 uF SMD0805 6 D1 1 green LED, SMD0805 P516TR-ND 7 J1, J2, J3, J4 0 25-pin header, TH SAM1029-25-ND (Header) SAM1213-25ND (Receptacle) DNP: Headers and receptacles enclosed with kit.
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BOOTST 10 8 6 4 2 R10 R11 JTAG DNP DNP 13 11 9 7 5 3 1 0R 0R LDOO C18 100nF C19 100nF GND 1 JP5 2 3 DNP GND JP6 R9 XT2IN R12 XT2OUT TDO 1 RST 2 RST/NMI 3 1 JP4 2 LDOI/LDOO Interface GND R7 330R VCC GND TEST/SBWTCK TCK 1 J6 2 3 Note: If the system should be supplied via LDOI (J6) close JP4 and set JP3 to external LDOI GND RST/NMI TCK TMS TDI TDO RST R5 47K TEST/SBWTCK 2.
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MSP-TS430PZ100C www.ti.
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MSP-TS430PZ100C www.ti.com Table B-29. MSP-TS430PZ100C Bill of Materials Pos. Ref Des Number Per Board 1 C1, C2 0 12pF, SMD0805 DNP: C1, C2 1.1 C3, C4 2 47pF, SMD0805 DNP: C3, C4 2 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND 3 C5, C11, C13, C14, C19, C20 6 100nF, SMD0805 311-1245-2-ND 3.1 C10, C12, C18,17 0 100nF, SMD0805 311-1245-2-ND 4 C8 1 2.
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MSP-TS430PZ5x100 www.ti.com B.28 MSP-TS430PZ5x100 Figure B-55.
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MSP-TS430PZ5x100 www.ti.com Jumper JP3 1-2 (int): Power supply via JTAG debug interface 2-3 (ext): External power supply Connector J5 External power connector Jumper J3 to ‘ext’ Jumper JP1 Open to measure current Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode. Close 2-3 to debug in 4-wire JTAG mode. LED connected to P1.0 Jumper JP2 Open to disconnect LED Figure B-56.
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MSP-TS430PZ5x100 www.ti.com Table B-30. MSP-TS430PZ5x100 Bill of Materials Pos. Ref Des No. Per Board 1 C1, C2 0 1b C3, C4 Description DigiKey Part No. 12pF, SMD0805 DNP 47pF, SMD0805 DNP: Only recommendation. Check your crystal spec. 2 C6, C7 2 10uF, 10V, Tantal Size B 511-1463-2-ND 3 C5, C10, C11, C12, C13, C14 4 100nF, SMD0805 311-1245-2-ND 4 C8 0 2.
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MSP-TS430PZ100USB www.ti.com B.29 MSP-TS430PZ100USB Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately 0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for example, to run the MCU at 3.0 V, set it to 3.3 V. Figure B-57.
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MSP-TS430PZ100USB www.ti.com Figure B-58.
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MSP-TS430PZ100USB www.ti.com Table B-31. MSP-TS430PZ100USB Bill of Materials Pos. Ref Des No. Per Board 1 C1, C2 0 12pF, SMD0805 1.1 C3, C4 2 47pF, SMD0805 2 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND 3 C5, C11, C13, C14, C19 5 100nF, SMD0805 311-1245-2-ND 3.1 C10, C12, C18, C17 0 100nF, SMD0805 311-1245-2-ND 4 C8 1 2.2nF, SMD0805 5 C9 1 470nF, SMD0805 478-1403-2-ND 6 D1 1 green LED, SMD0805 P516TR-ND 7 J1, J2, J3, J4 7.
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MSP-TS430PZ100USB www.ti.com Table B-31. MSP-TS430PZ100USB Bill of Materials (continued) Pos. Ref Des No. Per Board 30 C38 1 220n SMD0603 Buerklin: 53D2074 31 C39 1 4u7 SMD0603 Buerklin: 53D2086 32 C40 1 0.
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VCC C D 1 JP5 2 3 TDO 1 RST 2 RST/NMI 3 JP6 PJ.3 TCK E 1 JP7 2 3 VASYS1/2 GND E PJ.2 TMS IC1 1 JP8 2 3 PJ.1 TDI VASYS1/2 GND MSP430F677XIPEU# F 1 JP9 2 3 PJ.0 TDO JP10 1 2 3 ~RST/NMI/SBWTDIO PJ.3/TCK PJ.2/TMS PJ.1/TDI/TCLK PJ.0/TDO TEST/SBWTCK P2.3/PM_TA1.0 P2.2/PM_TA0.2 P2.1/PM_TA0.1 P2.0/PM_TA0.0 P11.5/TACLK/RTCCLK P11.4/CBOUT P11.3/TA2.1 P11.2/TA1.1 P11.1/TA3.1/CB3 P11.0/S0 P10.7/S1 P10.6/S2 P10.5/S3 P10.4/S4 P10.3/S5 P10.2/S6 P10.1/S7 P10.0/S8 P9.7/S9 P9.6/S10 P9.5/S11 P9.4/S12 P9.
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MSP-TS430PEU128 www.ti.com JP11, JP12, JP13 Connect 1-2 to connect AUXVCCx with DVCC or drive AUXVCCx externally JP4 95 C7 C4 C16 1234 C19 C13 C8 2 1 3 2 1 3 2 1 3 2 1 3 2 1 3 2 1 JP6 JP7 JP8 JP9 JP5 AUXVCC DVCC 3 JTAG 4 1 1234 C26 C10 C15 C17 C5 C11 C18 C6 C9 2 3 10 JP2 R3 D1 P1.0 Jumper JP2 Open to disconnect LED R5 C3 105 RST/NMI TCK TMS TDI TDO TEST/SBWTCK GND 5 D1 LED connected to P1.
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MSP-TS430PEU128 www.ti.com Table B-32. MSP-TS430PEU128 Bill of Materials 124 Pos. Ref Des No. Per Board 1 PCB 1 2 D1 3 JP1, JP2, JP4 4 JP5, JP6, JP7, JP8, JP9, JP10 6 5 JP11, JP12, JP13 6 JP3 7 JP1, JP2, JP3, JP4, JP5, JP6, JP7, JP8, JP9, JP10, JP11, JP12, JP13 13 8 R1, R2, R4, R6, R8 9 R10, R11 10 C3 11 C13, C14, C16, C17, C18, C19, C29 7 12 C11 13 C12 14 Description DigiKey Part No. Comment 94x119.4mm, 4 layers MSP-TS430PEU128 4 layers, green solder mask Rev. 1.
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EM430F5137RF900 www.ti.com B.31 EM430F5137RF900 (May be addedclose to therespective pins to reduce emissions at 5GHz tole vel required byETSI) Power Management VCC01 = external VCC = AVDD_RF / AVCC_RF = DVCC Vdda1 = AVCC Copyright © 2009–2014, Texas Instruments Incorporated 125 Hardware SLAU278Q – May 2009 – Revised February 2014 Submit Documentation Feedback Vdd Vdda2 Port connectors CON1 .. CON3 = Port1 ..
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EM430F5137RF900 www.ti.com JTAG connector Jumper JP2 Close EXT for external supply Close INT for JTAG supply Open to measure current jumper JP3 External power connector CON12 Jumper JP1 Spy-Bi-Wire mode VCC GND GND Jumper JP1 Close JTAG position to debug in JTAG mode Open to disconnect LEDs jumper JP5/JP10 LED D2 (red) connected to P3.6 via JP10 LED D1 (green) connected to P1.0 via JP5 Close SBW position to debug in Spy-Bi-Wire mode Push-button S2 connected to P1.
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EM430F5137RF900 www.ti.com Table B-33. EM430F5137RF900 Bill of Materials Item Reference No. per Board 1 Q1 1 ( CUSTOMER SUPPLY ) CRYSTAL, SMT, 4P, 26MHz 26M 2 C1-C5, C082, C222, C271, C281, C311, C321, C341, C412, C452 14 CAPACITOR, SMT, 0402, CER, 16V, 10%, 0.1uF 3 C071 1 CAPACITOR, SMT, 0603, CERAMIC, 0.47uF, 16V, 10%, X5R 4 R401 1 RES0402, 47.0K 5 CON11 1 HEADER, THU, MALE, 14P, 2X7, 25.4x9.2x9.45mm 09 18 514 6323 HARTING 6 CON10 0 HEADER, THU, MALE, 10P, 2X5, 20.32x9.2x9.
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EM430F5137RF900 www.ti.com Table B-33. EM430F5137RF900 Bill of Materials (continued) Item Reference No. per Board 30 R1 1 RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%, 1/16W 0Ω ERJ-2GE0R00X PANASONIC 31 C041 0 UNINSTALLED CAP CERAMIC 4.7UF 6.3V X5R 0603 4.7uF ECJ-1VB0J475K Panasonic 32 X1 1 SMA STRIGHT JACK, SMT 32K10A-40ML5 ROSENBERGER 33 Q2 0 Crystal, SMT, 32.768 kHz MS3V-T1R Micro Crystal U1 1 DUT, SMT, PQFP, RGZ-48, 0.5mmLS, 7.15x7.15x1mm, THRM.
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EM430F6137RF900 www.ti.com B.32 EM430F6137RF900 (May beaddedclose to therespective pins to reduce emissions at 5GHz to el vel required by ETSI) Power Management VCC01 = external VCC = AVCC = AVDD_RF / AVCC_RF = DVCC Vdda1 Copyright © 2009–2014, Texas Instruments Incorporated 129 Hardware SLAU278Q – May 2009 – Revised February 2014 Submit Documentation Feedback Vdd Vdda2 Port connectors CON1 .. CON5 = Port1 ..
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EM430F6137RF900 www.ti.com JTAG connector Jumper JP2 Close EXT for external supply Close INT for JTAG supply Open to measure current jumper JP3 External power connector CON12 Jumper JP1 Spy-Bi-Wire mode VCC GND GND Jumper JP1 Close JTAG position to debug in JTAG mode Open to disconnect LEDs jumper JP5/JP10 LED D2 (red) connected to P3.6 via JP10 Close SBW position to debug in Spy-Bi-Wire mode Push-button S2 connected to P1.7 LED D1 (green) connected to P1.
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EM430F6137RF900 www.ti.com Table B-34. EM430F6137RF900 Bill of Materials Pos. Ref Des No. per Board 1 Q1 1 ( CUSTOMER SUPPLY ) CRYSTAL, SMT, 4P, 26MHz ASX-531(CS) AKER ELECTRONIC 2 C1-C5, C112, C252, C381, C391, C421, C431, C451, C522, C562 14 CAPACITOR, SMT, 0402, CER, 16V, 10%, 0.1uF 0402YC104KAT2A AVX 3 C101 1 CAPACITOR, SMT, 0603, CERAMIC, 0.47uF, 0603YD474KAT2A 16V, 10%, X5R AVX 4 R511 1 RES0402, 47.0K CRCW04024702F100 DALE 09 18 514 6323 HARTING Description Part No.
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EM430F6137RF900 www.ti.com Table B-34. EM430F6137RF900 Bill of Materials (continued) 132 Pos. Ref Des No. per Board 33 U1 1 DUT, SMT, PQFP, RGC-64, 0.5mmLS, 9.15x9.15x1mm, THRM.PAD CC430F6137 TI 34 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH Description Part No.
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EM430F6147RF900 www.ti.com B.33 EM430F6147RF900 Figure B-65.
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EM430F6147RF900 www.ti.com Figure B-66. EM430F6147RF900 Target Board, PCB The battery pack which comes with the EM430F6147RF900 kit may be connected to CON12. Ensure correct battery insertion regarding the polarity as indicated in battery holder.
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EM430F6147RF900 www.ti.com Table B-35. EM430F6147RF900 Bill of Materials Pos. Ref Des No. per Board 1 Q1 1 ( CUSTOMER SUPPLY ) CRYSTAL, SMT, 4P, 26MHz ASX-531(CS) AKER ELECTRONIC 2 C1-5 C112 C252 C381 C391 C421 C431 C451 C522 C562 14 CAPACITOR, SMT, 0402, CER, 16V, 10%, 0.1uF 0402YC104KAT2A AVX 3 C101 1 CAPACITOR, SMT, 0603, CERAMIC, 0.47uF, 0603YD474KAT2A 16V, 10%, X5R AVX 4 R511 1 RES0402, 47.0K CRCW04024702F100 DALE 09 18 514 6323 HARTING Description Part No.
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EM430F6147RF900 www.ti.com Table B-35. EM430F6147RF900 Bill of Materials (continued) Pos. Ref Des No. per Board 31 U1 1 DUT, SMT, PQFP, RGC-64, 0.5mmLS, 9.15x9.15x1mm, THRM.
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MSP-FET430PIF www.ti.com B.34 MSP-FET430PIF Figure B-67.
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MSP-FET430PIF www.ti.com Figure B-68.
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MSP-FET430UIF www.ti.com B.35 MSP-FET430UIF Figure B-69.
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MSP-FET430UIF www.ti.com Figure B-70.
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MSP-FET430UIF www.ti.com Figure B-71.
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MSP-FET430UIF www.ti.com Figure B-72.
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MSP-FET430UIF www.ti.com Figure B-73.
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MSP-FET430UIF www.ti.com B.35.1 MSP-FET430UIF Revision History Revision 1.3 • Initial released hardware version Assembly change on 1.3 (May 2005) • R29, R51, R42, R21, R22, R74: value changed from 330R to 100R Changes 1.3 to 1.4 (Aug 2005) • J5: VBUS and RESET additionally connected • R29, R51, R42, R21, R22, R74: value changed from 330R to 100R • U1, U7: F1612 can reset TUSB3410; R44 = 0R added • TARGET-CON.
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Appendix C SLAU278Q – May 2009 – Revised February 2014 Hardware Installation Guide This section describes the hardware installation process of the following USB debug interfaces on a PC running Windows XP: • MSP-FET430UIF • eZ430-F2013 • eZ430-RF2500 • eZ430-Chronos • eZ430-RF2780 • eZ430-RF2560 • MSP-WDSxx "Metawatch" • LaunchPad (MSP-EXP430G2) • MSP-EXP430FR5739 • MSP-EXP430F5529 The installation procedure for other supported versions of Windows is very similar and, therefore, not shown here. Topic C.
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Hardware Installation C.1 www.ti.com Hardware Installation Table C-1 shows the USB VIDs and PIDs used in MSP430 tools. Table C-1. USB VIDs and PIDs Used in MSP430 Tools USB VID USB PID INF File Name eZ430-F2013 Tool 0x0451 0xF430 usbuart3410.inf eZ430-RF2500 0x0451 0xF432 430CDC.inf eZ430-RF2780 0x0451 0xF432 430CDC.inf eZ430-RF2560 0x0451 0xF432 430CDC.inf MSP-WDSxx "Metawatch" 0x0451 0xF432 430CDC.inf eZ430-Chronos 0x0451 0xF432 430CDC.
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Hardware Installation www.ti.com 4. Browse to the folder where the driver information files are located (see Figure C-2). For CCS, the default folder is: c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_CDC, or c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_FET_XP_XX, or c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_eZ-RF depending of firmware version of the tool. For IAR Embedded Workbench, the default folder is: \Embedded Workbench x.
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Hardware Installation www.ti.com 6. The wizard installs the driver files. 7. The wizard shows a message that it has finished the installation of the software USB Debug Interface. 8. The USB debug interface is installed and ready to use. The Device Manager lists a new entry as shown in Figure C-3, Figure C-4, or Figure C-5. Figure C-3.
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Hardware Installation www.ti.com Figure C-4.
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Hardware Installation www.ti.com Figure C-5.
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Document Revision History www.ti.com Document Revision History Version SLAU278 Changes Initial release SLAU278A Updated USB driver installation according to CCE v3.1 SR1 and CCS v4. SLAU278B Added information about MSP-FET430U80USB, MSP-TS430PN80USB, and eZ430-Chronos. SLAU278C Added bills of materials and updated some PCBs in Appendix B. Added information about MSP-TS430DA38, MSP-TS430DL48, MSP-TS430PW14, MSP-TS430PW28.
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EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions: The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims arising from the handling or use of the goods.
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FCC Interference Statement for Class B EVM devices This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
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【Important Notice for Users of EVMs for RF Products in Japan】】 This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product: 1. 2. 3. Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.
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EVALUATION BOARD/KIT/MODULE (EVM) WARNINGS, RESTRICTIONS AND DISCLAIMERS For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finished electrical equipment and not intended for consumer use.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.