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MSP430 Hardware Tools

User's Guide

Literature Number: SLAU278F

May 2009–Revised December 2010

Summary of content (138 pages)

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MSP430 Hardware Tools User's Guide Literature Number: SLAU278F May 2009 – Revised December 2010
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SLAU278F – May 2009 – Revised December 2010 Submit Documentation Feedback © 2009–2010, Texas Instruments Incorporated
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Contents ....................................................................................................................................... 9 Get Started Now! ............................................................................................................... 13 1.1 Flash Emulation Tool (FET) Overview .................................................................................. 14 1.2 Kit Contents, MSP-FET430PIF ...........................................................................
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www.ti.com B.17 B.18 B.19 B.20 B.21 B.22 B.23 B.24 B.25 B.26 B.27 B.28 B.29 MSP-TS430RGC64USB .................................................................................................. 82 MSP-TS430PN80 .......................................................................................................... 86 MSP-TS430PN80A ........................................................................................................ 89 MSP-TS430PN80USB ..................................................
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www.ti.com List of Figures 2-1. Signal Connections for 4-Wire JTAG Communication ................................................................ 25 2-2. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) ............................................... 26 B-1. MSP-TS430PW14 Target Socket Module, Schematic B-2. MSP-TS430PW14 Target Socket Module, PCB B-3. B-4. B-5. B-6. B-7. B-8. B-9. B-10. B-11. B-12. B-13. B-14. B-15. B-16. B-17. B-18. B-19. B-20. B-21. B-22. B-23. B-24. B-25. B-26.
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www.ti.com B-46. MSP-TS430PZ100B Target Socket Module, PCB ................................................................... 103 B-47. MSP-TS430PZ5x100 Target Socket Module, Schematic .......................................................... 105 B-48. MSP-TS430PZ5x100 Target Socket Module, PCB.................................................................. 106 B-49. MSP-TS430PZ100USB Target Socket Module, Schematic ........................................................ 108 B-50.
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www.ti.com List of Tables .................................................................................. 1-1. Flash Emulation Tool (FET) Features 1-2. Individual Kit Contents, MSP-TS430xx ................................................................................. 18 B-1. MSP-TS430PW14 Bill of Materials ...................................................................................... 36 B-2. MSP-TS430L092 Bill of Materials ..............................................................
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List of Tables SLAU278F – May 2009 – Revised December 2010 Submit Documentation Feedback © 2009–2010, Texas Instruments Incorporated
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Preface SLAU278F – May 2009 – Revised December 2010 Read This First About This Manual This manual describes the hardware of the Texas Instruments MSP-FET430 Flash Emulation Tool (FET). The FET is the program development tool for the MSP430 ultra-low-power microcontroller. Both available interface types, the parallel port interface and the USB interface, are described. How to Use This Manual Read and follow the instructions in Chapter 1.
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How to Use This Manual www.ti.
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Information About Cautions and Warnings www.ti.
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Related Documentation From Texas Instruments www.ti.com Related Documentation From Texas Instruments MSP430 development tools documentation: CCS for MSP430 User's Guide, literature number SLAU157 Code Composer Studio v4.
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Chapter 1 SLAU278F – May 2009 – Revised December 2010 Get Started Now! This chapter lists the contents of the FET and provides instruction on installing the hardware. Topic 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 1.10 1.11 1.12 1.13 1.14 1.15 1.16 1.17 1.18 ........................................................................................................................... Flash Emulation Tool (FET) Overview ..................................................................
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Flash Emulation Tool (FET) Overview 1.1 www.ti.com Flash Emulation Tool (FET) Overview TI offers several flash emulation tools according to different requirements. Table 1-1.
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Kit Contents, eZ430-RF2500 www.ti.com 1.5 Kit Contents, eZ430-RF2500 • • • • • 1.6 One eZ430-RF2500T target board One AAA battery pack with expansion board (batteries included) Kit Contents, eZ430-RF2500-SEH • • • • • 1.8 QUICK START GUIDE document eZ430-RF2500 CD-ROM eZ430-RF2500 development tool including one MSP430F2274/CC2500 target board eZ430-RF2500T target board AAA battery pack with expansion board (batteries included) Kit Contents, eZ430-RF2500T • • 1.
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Kit Contents, MSP-FET430xx www.ti.com 1.10 Kit Contents, MSP-FET430xx 'U14, 'U092, 'U24, 'U28, 'U28A, 'U38, 'U23x0, 'U40, 'U40A, 'U48, 'U48B, 'U64, 'U64A, 'U64USB, 'U80, 'U80USB, 'U100, 'U100A, 'U100B, 'U5x100, 'U100USB • One READ ME FIRST document • One MSP430 CD-ROM • One MSP-FET430UIF USB interface module. This is the unit that has a USB B-connector on one end of the case, and a 2×7-pin male connector on the other end of the case. • One USB cable • One 32.
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Kit Contents, FET430Fx137RF900 www.ti.com 1.11 Kit Contents, FET430Fx137RF900 • • • • • • • • • • • • One READ ME FIRST document One legal notice One MSP430 CD-ROM One MSP-FET430UIF interface module Two target socket module MSP-FET430F5137RF900: Two EM430F5137RF900 target socket modules. This is the PCB on which is soldered a CC430F5137 device in a 48-pin RGZ package. A 2×7-pin male connector is also present on the PCB MSP-FET430F6137RF900: Two EM430F6137RF900 target socket modules.
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Kit Contents, MSP-TS430xx www.ti.com Table 1-2. Individual Kit Contents, MSP-TS430xx 18 Target Socket Module Socket Type Supported Devices MSP-TS430PW14 14-pin PW (TSSOP ZIF) MSP430F20xx, 'G2x01, 'G2x11, 'G2x21, 'G2x31 Included Devices Headers / Comment 2 x MSP430F2013IPW Four PCB 1×7-pin headers (two male and two female MSP-TS430L092 14-pin PW (TSSOP ZIF) MSP-TS430L092 2 x MSP430L092IPW Four PCB 1×7-pin headers (two male and two female).
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Kit Contents, EM430Fx137RF900 www.ti.com Table 1-2.
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Hardware Installation, MSP-FET430UIF www.ti.com 1.15 Hardware Installation, MSP-FET430UIF Follow these steps to install the hardware for the MSP-FET430UIF tool: 1. Use the USB cable to connect the USB-FET interface module to a USB port on the PC. The USB FET should be recognized, as the USB device driver should have been installed with the IDE (Code Composer Essentials/Studio or IAR Embedded Workbench).. If the install wizard starts, follow the prompts and point the wizard to the driver files.
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www.ti.com Important MSP430 Documents on the CD-ROM and Web 1.18 Important MSP430 Documents on the CD-ROM and Web The primary sources of MSP430 information are the device-specific data sheet and user's guide. The most up-to-date versions of these documents that are available at the time of production are provided on the CD-ROM included with this tool. The MSP430 web site (www.ti.com/msp430) contains the most recent version of these documents.
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Get Started Now! SLAU278F – May 2009 – Revised December 2010 Submit Documentation Feedback © 2009–2010, Texas Instruments Incorporated
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Chapter 2 SLAU278F – May 2009 – Revised December 2010 Design Considerations for In-Circuit Programming This chapter presents signal requirements for in-circuit programming of the MSP430. Topic 2.1 2.2 2.3 ........................................................................................................................... Page Signal Connections for In-System Programming and Debugging ............................ 24 External Power ..................................................................
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Signal Connections for In-System Programming and Debugging 2.1 www.ti.com Signal Connections for In-System Programming and Debugging MSP-FET430PIF, MSP-FET430UIF, MSP-GANG430, MSP-PRGS430 With the proper connections, the debugger and an FET hardware JTAG interface (such as the MSP-FET430PIF and MSP-FET430UIF) can be used to program and debug code on the target board.
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Signal Connections for In-System Programming and Debugging www.ti.com VCC J1 (see Note A) VCC/AVCC/DVCC J2 (see Note A) R1 47 kW (see Note B) C2 10 µF C3 0.1 µF MSP430Fxxx JTAG VCC TOOL VCC TARGET TEST/VPP RST/NMI 2 1 4 3 6 5 8 7 10 9 12 11 14 13 TDO/TDI TDO/TDI TDI/VPP TDI/VPP TMS TMS TCK TCK GND RST (see Note D) TEST/VPP (see Note C) C1 10 nF/2.
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Signal Connections for In-System Programming and Debugging www.ti.com VCC J1 (see Note A) VCC/AVCC/DVCC J2 (see Note A) R1 47 kW (see Note B) C2 10 µF C3 0.1 µF MSP430Fxxx JTAG VCC TOOL VCC TARGET TEST/VPP 2 1 4 3 6 5 8 7 10 9 12 11 14 13 TDO/TDI RST/NMI/SBWTDIO TCK GND R2 330 W (see Note C) TEST/SBWTCK C1 2.2 nF (see Note B) VSS/AVSS/DVSS A Make either connection J1 in case a local target power supply is used or connection J2 to power target from the debug/programming adapter.
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External Power www.ti.com 2.2 External Power The PC parallel port can source a limited amount of current. Because of the ultra-low-power requirement of the MSP430, a standalone FET does not exceed the available current. However, if additional circuitry is added to the tool, this current limit could be exceeded. In this case, external power can be supplied to the tool via connections provided on the target socket modules.
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Design Considerations for In-Circuit Programming © 2009–2010, Texas Instruments Incorporated SLAU278F – May 2009 – Revised December 2010 Submit Documentation Feedback
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Appendix A SLAU278F – May 2009 – Revised December 2010 Frequently Asked Questions and Known Issues This appendix presents solutions to frequently asked questions regarding the MSP-FET430 hardware. Topic A.1 A.2 ........................................................................................................................... Page Hardware FAQs ................................................................................................. 30 Known Issues ......................................
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Hardware FAQs A.1 www.ti.com Hardware FAQs 1. The state of the device (CPU registers, RAM memory, etc.) is undefined following a reset. Exceptions to the above statement are that the PC is loaded with the word at 0xFFFE (i.e., the reset vector), the status register is cleared, and the peripheral registers (SFRs) are initialized as documented in the device family user's guides. The CCE/CCS debugger and C-SPY reset the device after programming it. 2.
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Hardware FAQs www.ti.com 12. Information memory may not be blank (erased to 0xFF) when the device is delivered from TI. Customers should erase the information memory before its first use. Main memory of packaged devices is blank when the device is delivered from TI. 13. The device current increases by approximately 10 ?A when a device in low-power mode is stopped [using Halt (CCE/CCS) or Esc (C-SPY)] and then the low-power mode is restored [using Run (CCE/CCS) or Go (C-SPY)].
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Known Issues A.2 www.ti.com Known Issues MSP-FET430PIF Some PCs do not supply 5 V through the parallel port Problem Description Device identification problems with modern PCs, because the parallel port often does not deliver 5 V as was common with earlier hardware. 1. When connected to a laptop, the test signal is clamped to 2.5 V. 2. When the external VCC becomes less than 3 V, up to 10 mA is flowing in the adapter via pin 4 (sense). Solution Measure the voltage level of the parallel port.
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Appendix B SLAU278F – May 2009 – Revised December 2010 Hardware This appendix contains information relating to the FET hardware, including schematics, PCB pictorials, and bills of materials. All other tools, such as the eZ430 series, are described in separate product-specific user's guides. Topic ........................................................................................................................... B.1 B.2 B.3 B.4 B.5 B.6 B.7 B.8 B.9 B.10 B.11 B.12 B.13 B.14 B.15 B.16 B.17 B.18 B.
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MSP-TS430PW14 B.1 www.ti.com MSP-TS430PW14 Figure B-1.
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MSP-TS430PW14 www.ti.com Connector J3 External power connector Jumper J5 to 'ext' LED connected to P1.0 Jumpers J7 to J12 Close 1-2 to debug in Spy-Bi-Wire Mode. Close 2-3 to debug in 4-wire JTAG mode. Jumper J4 Open to disconnect LED Orient Pin 1 of MSP430 device Jumper J6 Open to measure current Figure B-2.
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MSP-TS430PW14 www.ti.com Table B-1. MSP-TS430PW14 Bill of Materials Position Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C7 1 10uF/10V, Tantal Size B 511-1463-2-ND 3 C3, C5 1 100nF, SMD0805 4 C8 0 2.2nF, SMD0805 5 D1 1 green LED, SMD0603 475-1056-2-ND 6 J1, J2 0 7-pin header, TH "SAM1029-07NDSAM1213-07-ND" DNP: Headers and receptacles enclosed with kit.
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MSP-TS430L092 www.ti.com B.2 MSP-TS430L092 Figure B-3.
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MSP-TS430L092 www.ti.com Settings of the MSP-TS430L092 Target Socket Figure B-4 shows the PCB layout of the MSP-TS430L092 target socket. The following pinning is recommended: • JP1 is write enable for the EPROM. If this is not set, the EPROM can only be read. • JP2 and JP3 connect device supply with boost converter. They can be opened to measure device current consumption. For default operation, they should be closed. Figure B-4.
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MSP-TS430L092 www.ti.com Table B-2. MSP-TS430L092 Bill of Materials Pos. Ref Des No. No. Per Board 1 C1, C2 2 330nF, SMD0603 2 C5 1 100n, SMD0603 3 C6 1 10u, SMD0805 4 C10 1 100n, SMD0603 5 EEPROM1 1 M95512 SO08 (SO8) 7 J1, J2 2 Description DigiKey Part No. ST Micro M95160R Comment Digikey: 497-8688-1-ND DNP: headers and receptacles enclosed with kit. Keep vias free of solder.
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MSP-TS430L092 Active Cable B.3 www.ti.com MSP-TS430L092 Active Cable Figure B-5.
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MSP-TS430L092 Active Cable www.ti.com Figure B-6 shows the PCB layout for the Active Cable. The following pinning is possible: • JP1 has two jumpers (Jumper 1 and Jumper 2) that can be set as shown in Table B-3. Table B-3. MSP-TS430L092 JP1 Settings • Jumper 1 Jumper 2 Description Off Off The active cable has no power and does not function. Off On The active cable receives power from target socket. For this option, the target socket must have its own power supply.
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MSP-TS430L092 Active Cable www.ti.com Table B-4. MSP-TS430L092 Active Cable Bill of Materials 42 Pos. Ref Des No. Per Board 1 C1, C3, C5, C6 4 100nF, SMD0603 2 C2, C4 2 1uF, SMD0805 3 R1, R10 2 10K, SMD0603 4 R2 1 4K7, SMD0603 5 R5, R6, R7, R9 4 100, SMD0603 6 R8 1 680k, SMD0603 7 R11, R15 2 1K, SMD0603 8 R12 0 SMD0603 DNP 9 R13 0 SMD0603 DNP 10 R14 1 0, SMD0603 11 IC1 1 SN74AUC1G04DBVR 12 IC2, IC3, IC4 3 SN74AUC2G125DCTR Description DigiKey Part No.
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MSP-TS430PW24 www.ti.com B.4 MSP-TS430PW24 Figure B-7.
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MSP-TS430PW24 www.ti.com Connector J5 External power connector Jumper JP1 to "ext" Jumper JP2 Open to measure current Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Orient Pin 1 of MSP430 device D1 LED connected to P1.0 Jumper JP3 Open to disconnect LED Figure B-8.
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MSP-TS430PW24 www.ti.com Table B-5. MSP-TS430PW24 Bill of Materials Position Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C5 1 2.2nF, SMD0805 3 C3, C7 2 10uF/10V, SMD0805 4 C4, C6, C8 3 100nF, SMD0805 478-3351-2-ND 5 D1 1 green LED, SMD0805 P516TR-ND 6 J1, J2 0 12-pin header, TH "SAM1029-07NDSAM1213-07-ND" DNP: Headers and receptacles enclosed with kit. Keep vias free of solder.
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MSP-TS430DW28 B.5 www.ti.com MSP-TS430DW28 Figure B-9.
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MSP-TS430DW28 www.ti.com LED connected to P1.0 Jumper J4 Open to disconnect LED Jumper J5 Open to measure current Connector J3 External power connector Remove R8 and jumper R9 Orient Pin 1 of MSP430 device Figure B-10.
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MSP-TS430DW28 www.ti.com Table B-6. MSP-TS430DW28 Bill of Materials Position Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C5 1 100nF, SMD0805 3 C7 1 10uF/10V Tantal Elko B 4 C8 1 10nF SMD0805 5 D1 1 LED3 T1 3mm yellow RS: 228-4991 6 Q1 0 QUARZ, Crystal Micro Crystal MS1V-T1K 32.768kHz, C(Load) = DNP: Cover holes while soldering 12.5pF 7 J1, J2 2 14-pin header, TH male DNP: Headers and receptacles enclosed with kit. Keep vias free of solder.
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MSP-TS430PW28 www.ti.com B.6 MSP-TS430PW28 Figure B-11.
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MSP-TS430PW28 www.ti.com Jumper JP4 to JP9: Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Jumper JP1 1-2 (int): Power supply via JTAG interface 2-3 (ext): External Power Supply Jumper JP2 Open to measure current Orient Pin 1 of Device Jumper JP3 Open to disconnect LED LED D1 connected to P5.1 Figure B-12.
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MSP-TS430PW28 www.ti.com Table B-7. MSP-TS430PW28 Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C3 1 10uF/10V Tantal Elko B 3 C4 1 100nF, SMD0805 4 C5 0 2.2nF, SMD0805 5 D1 1 LED green SMD0603 6 Q1 0 QUARZ, Crystal 7 J1, J2 7.1 (1) Description (1) DigiKey Part No. Comment DNP: C1, C2 , Cover holes while soldering DNP Micro Crystal MS1V-T1K 32.768kHz, C(Load) = 12.
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MSP-TS430PW28A B.7 www.ti.com MSP-TS430PW28A Figure B-13.
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MSP-TS430PW28A www.ti.com Connector J5 External power connector Jumper JP1 to "ext" Jumper JP2 Open to measure current Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Orient Pin 1 of MSP430 device Jumper JP3 Open to disconnect LED D1 LED connected to P1.0 Figure B-14.
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MSP-TS430PW28A www.ti.com Table B-8. MSP-TS430PW28A Bill of Materials Position Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C5 1 2.
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MSP-TS430DA38 www.ti.com B.8 MSP-TS430DA38 Figure B-15.
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MSP-TS430DA38 www.ti.com Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire Mode, Close 2-3 to debug in 4-wire JTAG Mode LED connected to P1.0 Jumper JP3 Open to disconnect LED Orient pin 1 of MSP430 device Jumper JP2 Open to measure current Connector J3 External power connector Jumper JP1 to 'ext' Figure B-16.
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MSP-TS430DA38 www.ti.com Table B-9. MSP-TS430DA38 Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C7 1 10uF/10V, Tantal Size B 511-1463-2-ND 3 C5 1 100nF, SMD0805 478-3351-2-ND 4 C8 0 2.2nF, SMD0805 5 D1 1 green LED, SMD0603 Description DigiKey Part No. Comment DNP DNP 475-1056-2-ND 6 J1, J2 0 19-pin header, TH "SAM1029-19NDSAM1213-19-ND" DNP: headers and receptacles enclosed with kit.Keep vias free of solder.
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MSP-TS430QFN23x0 B.9 www.ti.com MSP-TS430QFN23x0 Figure B-17.
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MSP-TS430QFN23x0 www.ti.com Connector J5 External power connector Jumper JP1 to 'ext' Jumper JP2 Open to measure current Jumper JP3 Open to disconnect LED LED connected to P1.0 Figure B-18.
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MSP-TS430QFN23x0 www.ti.com Table B-10. MSP-TS430QFN23x0 Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C3 1 10uF/10V, Tantal Size B 511-1463-2-ND 3 C4 1 100nF, SMD0805 478-3351-2-ND 4 C5 1 10nF, SMD0805 478-1383-2-ND 5 D1 1 green LED, SMD0603 475-1056-2-ND DigiKey Part No. Comment DNP 6 J1, J2, J3, J4 0 10-pin header, TH DNP: headers and receptacles enclosed with SAM1034-10-NDSAM1212kit.Keep vias free of 10-ND solder.
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MSP-TS430RSB40 www.ti.com B.10 MSP-TS430RSB40 Figure B-19.
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MSP-TS430RSB40 www.ti.com Connector J5 External power connector Jumper JP1 to "ext" Jumper JP2 Open to measure current Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Orient Pin 1 of MSP430 device Jumper JP3 Open to disconnect LED D1 LED connected to P1.0 Figure B-20.
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MSP-TS430RSB40 www.ti.com Table B-11. MSP-TS430RSB40 Bill of Materials Ref Des No. Per Board Description 1 C1, C2 0 12pF, SMD0805 2 C3, C7, C10, C12 3 10uF/10V, SMD 0805 445-1371-1-ND DNP C12 3 C4, C6, C8, C11 3 100nF, SMD0805 311-1245-2-ND DNP C11 4 C5 1 2.2nF, SMD0805 5 C9 1 470nF, SMD0805 6 D1 1 green LED, SMD0805 Pos. DigiKey Part No. Comment DNP: C1, C2 P516TR-ND 10-pin header, TH DNP: headers and receptacles enclosed with kit. Keep vias free of solder.
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MSP-TS430RHA40A www.ti.com B.11 MSP-TS430RHA40A Figure B-21.
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MSP-TS430RHA40A www.ti.com Connector J5 External power connector Jumper JP1 to "ext" Jumper JP2 Open to measure current Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode D1 LED connected to P1.0 Jumper JP3 Open to disconnect LED Orient Pin 1 of MSP430 device Figure B-22.
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MSP-TS430RHA40A www.ti.com Table B-12. MSP-TS430RHA40A Bill of Materials Position Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 DNP: C1, C2 2 C5 0 2.2nF, SMD0805 DNP C12 3 C3, C7 2 10uF/10V, SMD0805 5 4 C4, C6 2 100nF, SMD0805 5 C9 1 470nF, SMD0805 6 D1 1 green LED, SMD0805 7 J1, J2, J3, J4 4 10-pin header, TH DNP: headers and receptacles enclosed with kit. Keep vias free of solder.
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MSP-TS430DL48 www.ti.com B.12 MSP-TS430DL48 Figure B-23.
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MSP-TS430DL48 www.ti.com Jumper J5 Open to measure current LED connected to P1.0 Connector J3 External power connector Jumper JP1 to ‘ext’ Jumper J4 Open to disconnect LED Orient pin 1 of MSP430 device Figure B-24.
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MSP-TS430DL48 www.ti.com Table B-13. MSP-TS430DL48 Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C4, C7 2 10uF/10V, Tantal Size B 511-1463-2-ND 3 C3, C5 2 100nF, SMD0805 478-3351-2-ND 4 C8 1 10nF, SMD0805 478-1383-2-ND 5 D1 1 yellow LED, TH, 3mm, T1 511-1251-ND Description DigiKey Part No. Comment DNP 6 J1, J2 0 24-pin header, TH DNP: Headers and receptacles enclosed with SAM1034-12-NDSAM1212kit.Keep vias free of 12-ND solder.
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MSP-TS430RGZ48B www.ti.com B.13 MSP-TS430RGZ48B Figure B-25.
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MSP-TS430RGZ48B www.ti.com Connector J5 External power connector Jumper JP1 to "ext" Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Jumper JP1 Open to measure current Orient Pin 1 of MSP430 device Jumper JP2 Open to disconnect LED D1 LED connected to P1.0 Figure B-26.
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MSP-TS430RGZ48B www.ti.com Table B-14. MSP-TS430RGZ48B Bill of Materials Position Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 DNP 2 C3, C4 0 47pF, SMD0805 DNP 3 C6, C7, C12 3 10uF/6.3V, SMD0805 4 C5, C11, C13, C14 4 100nF, SMD0805 5 C8 1 2.2nF, SMD0805 6 C9 1 470nF, SMD0805 478-1403-2-ND 7 D1 1 green LED, SMD0805 P516TR-ND 8 J1, J2, J3, J4 0 12-pin header, TH SAM1029-12-ND (Header) SAM1213-12-ND (Receptacle) DNP: Headers and receptacles enclosed with kit.
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MSP-TS430PM64 www.ti.com B.14 MSP-TS430PM64 NOTE: Connections between the JTAG header and pins XOUT and XIN are no longer required and should not be made. Figure B-27.
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MSP-TS430PM64 www.ti.com Connector J5 External power connection Remove R8 and jumper R9 LED connected to pin 12 Jumper J7 Open to measure current Jumper J6 Open to disconnect LED Orient Pin 1 of MSP430 device Figure B-28.
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MSP-TS430PM64 www.ti.com Table B-15. MSP-TS430PM64 Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 DNP 1.1 C3, C4 0 47pF, SMD0805 DNP: Only recommendation. Check your crystal spec.
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MSP-TS430PM64A www.ti.com B.15 MSP-TS430PM64A Figure B-29.
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MSP-TS430PM64A www.ti.com Jumper JP3 1-2 (int): Power supply via JTAG interface 2-3 (ext): External Power Supply Jumper JP4 to JP9: Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Jumper JP2 Open to measure current Orient Pin 1 of Device Jumper JP1 Open to disconnect LED LED D1 connected to P5.1 Figure B-30.
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MSP-TS430PM64A www.ti.com Table B-16. MSP-TS430PM64A Bill of Materials Pos. Ref Des No. per Board 1 C1, C2, 0 12pF, SMD0805 DNP 2 C3 0 2.2nF, SMD0805 DNP 3 C6, 1 10uF/10V, Tantal Size B 511-1463-2-ND 4 C4, C5 2 100nF, SMD0805 478-3351-2-ND 5 D1 1 green LED, SMD0805 P516TR-ND DigiKey Part No. Comment 6 J1, J2, J3, J4 0 16-pin header, TH DNP: Headers and receptacles enclosed with SAM1029-16-NDSAM1213kit. Keep vias free of 16-ND solder.
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MSP-TS430RGC64B www.ti.com B.16 MSP-TS430RGC64B Figure B-31.
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MSP-TS430RGC64B www.ti.com Connector J5 External power connector Jumper JP3 to "ext" Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode If the system should be supplied via LDOI (J6), close JP4 and set JP3 to external Orient Pin 1 of MSP430 device D1 LED connected to P1.0 Jumper JP2 Open to disconnect LED Figure B-32.
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MSP-TS430RGC64B www.ti.com Table B-17. MSP-TS430RGC64B Bill of Materials Position Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 DNP 2 C3, C4 0 47pF, SMD0805 DNP 3 C6, C7, C10 3 10uF/6.3V, SMD0805 4 C5, C11, C13, C14, C15 5 100nF, SMD0805 5 C8 1 2.2nF, SMD0805 6 C9 1 470nF, SMD0805 7 C16 1 4.
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MSP-TS430RGC64USB www.ti.com B.17 MSP-TS430RGC64USB Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately 0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for example, to run the MCU at 3.0 V, set it to 3.3 V. Figure B-33.
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MSP-TS430RGC64USB www.ti.com Figure B-34.
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MSP-TS430RGC64USB www.ti.com Table B-18. MSP-TS430RGC64USB Bill of Materials Pos. Ref Des No. Per Board 1 C1, C2 0 12pF, SMD0805 1.1 C3, C4 2 47pF, SMD0805 2 C6, C7 2 10uF/6.3V, Tantal Size B 511-1463-2-ND 3 C5, C11, C13, C14 4 100nF, SMD0805 311-1245-2-ND 3.1 C10, C12 0 10uF, SMD0805 4 C8 1 2.2nF, SMD0805 5 C9 1 470nF, SMD0805 478-1403-2-ND 6 D1 1 green LED, SMD0805 P516TR-ND 7 J1, J2, J3, J4 DigiKey Part No.
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MSP-TS430RGC64USB www.ti.com Table B-18. MSP-TS430RGC64USB Bill of Materials (continued) Ref Des No.
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MSP-TS430PN80 www.ti.com B.18 MSP-TS430PN80 NOTE: For MSP430F(G)47x devices: Connect pins 7 and 10 (GND) externally to DVSS (see data sheet). Connect load capacitance on Vref pin 60 when SD16 is used (see data sheet). Figure B-35.
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MSP-TS430PN80 www.ti.com LED connected to pin 12 Connector J5 External power connection Remove R8 and jumper R9 Jumper J6 Open to disconnect LED Orient Pin 1 of MSP430 device Figure B-36.
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MSP-TS430PN80 www.ti.com Table B-19. MSP-TS430PN80 Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 DNP: C1, C2 1.1 C3, C4 0 47pF, SMD0805 DNP: Only recommendation. Check your crystal spec. 2 C6, C7 1 10uF/10V, Tantal Size B 511-1463-2-ND 3 C5 1 100nF, SMD0805 478-3351-2-ND 4 C8 1 10nF, SMD0805 478-1383-2-ND 5 D1 1 green LED, SMD0603 475-1056-2-ND DigiKey Part No.
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MSP-TS430PN80A www.ti.com B.19 MSP-TS430PN80A Figure B-37.
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MSP-TS430PN80A www.ti.com Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Connector J5 External power connector Jumper JP3 to "ext" Orient Pin 1 of MSP430 device If the system should be supplied via LDOI (J6), close JP4 and set JP3 to external Jumper JP2 Open to disconnect LED D1 LED connected to P1.0 Figure B-38.
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MSP-TS430PN80USB www.ti.com Table B-20. MSP-TS430PN80A Bill of Materials Position Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 DNP 2 C3, C4 0 47pF, SMD0805 DNP 3 C6, C7, C10, C12 3 10uF/6.3V, SMD0805 DNP C10 4 C5, C11, C13, C14, C15 5 100nF, SMD0805 5 C8 1 2.2nF, SMD0805 6 C9 1 470nF, SMD0805 7 C16 1 4.
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MSP-TS430PN80USB www.ti.com NOTE: R11 should be populated. Figure B-39.
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MSP-TS430PN80USB www.ti.com Jumper JP3 1-2 (int): Power supply via JTAG debug interface 2-3 (ext): External power supply USB Connector Jumper JP1 Open to measure current Connector J5 External power connector Jumper JP3 to ‘ext’ Jumper JP4 Close for USB bus powered device Jumper JP5 to JP10 Close 1-2 to debug in Spy-BiWire mode. Close 2-3 to debug in 4-wire JTAG mode. BSL invoke button S3 LED connected to P1.0 Jumper JP2 Open to disconnect LED Figure B-40.
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MSP-TS430PN80USB www.ti.com Table B-21. MSP-TS430PN80USB Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 1.1 C3, C4 2 47pF, SMD0805 2 C6, C7 2 10uF/6.3V, Tantal Size B 511-1463-2-ND 3 C5, C11, C13, C14 4 100nF, SMD0805 311-1245-2-ND 3.1 C10, C12 0 10uF, SMD0805 311-1245-2-ND 4 C8 1 2.2nF, SMD0805 5 C9 1 470nF, SMD0805 478-1403-2-ND 6 D1 1 green LED, SMD0805 P516TR-ND 7 J1, J2, J3, J4 7.1 20-pin header, TH DigiKey Part No.
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MSP-TS430PN80USB www.ti.com Table B-21. MSP-TS430PN80USB Bill of Materials (continued) Pos. Ref Des No. per Board 29 C36 1 10p Buerklin: 56D102 30 C38 1 220n Buerklin: 53D2074 31 C39 1 4u7 Buerklin: 53D2086 32 C40 1 0.
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MSP-TS430PZ100 www.ti.com B.21 MSP-TS430PZ100 NOTE: Connections between the JTAG header and pins XOUT and XIN are no longer required and should not be made. Figure B-41.
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MSP-TS430PZ100 www.ti.com Jumper J6 Open to disconnect LED Jumper J7 Open to measure current LED connected to pin 12 Connector J5 External power connection Remove R8 and jumper R9 Orient Pin 1 of MSP430 device Figure B-42.
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MSP-TS430PZ100 www.ti.com Table B-22. MSP-TS430PZ100 Bill of Materials Pos. Ref Des No. per Board 1 C1, C2, 0 12pF, SMD0805 DNP 1b C3, C4 0 47pF, SMD0805 DNP: Only recommendation. Check your crystal spec.
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MSP-TS430PZ100A www.ti.com B.22 MSP-TS430PZ100A Figure B-43.
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MSP-TS430PZ100A www.ti.com Jumper JP3 1-2 (int): Power supply via JTAG interface 2-3 (ext): External Power Supply Jumper JP1 Open to measure current Jumper JP2 Open to disconnect LED LED D1 connected to P5.1 Orient Pin 1 of Device Figure B-44.
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MSP-TS430PZ100A www.ti.com Table B-23. MSP-TS430PZ100A Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 DNP 1b C3, C4 0 47pF, SMD0805 DNP: Only recommendation. Check your crystal spec.
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MSP-TS430PZ100B www.ti.com B.23 MSP-TS430PZ100B Figure B-45.
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MSP-TS430PZ100B www.ti.com Connector J5 External power connector Jumper JP1 to "ext" Jumper JP1 Open to measure current Orient Pin 1 of MSP430 device JP11, JP12, JP13 Connect 1-2 to connect AUXVCCx with DVCC or drive AUXVCCx externally Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode D1 LED connected to P1.0 Jumper JP2 Open to disconnect LED Figure B-46.
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MSP-TS430PZ100B www.ti.com Table B-24. MSP-TS430PZ100B Bill of Materials Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C4, C5, C6 , C7, C8, C9 6 100nF, SMD0805 311-1245-2-ND 3 C10, C26 2 470 nF, SMD0805 478-1403-2-ND 4 C11, C12 1 10 uF / 6.3 V SMD0805 5 C13, C14, C16, C18, C19, C29 6 4.7 uF SMD0805 6 D1 1 green LED, SMD0805 P516TR-ND 7 J1, J2, J3, J4 0 25-pin header, TH SAM1029-25-ND (Header) SAM1213-25-ND (Receptacle) DNP: Headers and receptacles enclosed with kit.
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MSP-TS430PZ5x100 www.ti.com B.24 MSP-TS430PZ5x100 Figure B-47.
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MSP-TS430PZ5x100 www.ti.com Jumper JP3 1-2 (int): Power supply via JTAG debug interface 2-3 (ext): External power supply Connector J5 External power connector Jumper J3 to ‘ext’ Jumper JP1 Open to measure current Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode. Close 2-3 to debug in 4-wire JTAG mode. LED connected to P1.0 Jumper JP2 Open to disconnect LED Figure B-48.
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MSP-TS430PZ100USB www.ti.com Table B-25. MSP-TS430PZ5x100 Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 1b C3, C4 Description DigiKey Part No. Comment 12pF, SMD0805 DNP 47pF, SMD0805 DNP: Only recommendation. Check your crystal spec. 2 C6, C7 2 10uF/10V, Tantal Size B 511-1463-2-ND 3 C5, C10, C11, C12,C13, C14 4 100nF, SMD0805 311-1245-2-ND 4 C8 0 2.
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MSP-TS430PZ100USB www.ti.com Figure B-49.
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MSP-TS430PZ100USB www.ti.com Figure B-50.
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MSP-TS430PZ100USB www.ti.com Table B-26. MSP-TS430PZ100USB Bill of Materials Pos. Ref Des No. Per Board 1 C1, C2 0 12pF, SMD0805 1.1 C3, C4 2 47pF, SMD0805 2 C6, C7 2 10uF/6.3V, Tantal Size B 511-1463-2-ND 3 C5, C11, C13, C14, C19 5 100nF, SMD0805 311-1245-2-ND 3.1 C10, C12, C18,17 0 100nF, SMD0805 311-1245-2-ND 4 C8 1 2.2nF, SMD0805 5 C9 1 470nF, SMD0805 478-1403-2-ND 6 D1 1 green LED, SMD0805 P516TR-ND 7 J1, J2, J3, J4 7.
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MSP-TS430PZ100USB www.ti.com Table B-26. MSP-TS430PZ100USB Bill of Materials (continued) Pos. Ref Des No. Per Board 30 C38 1 220n SMD0603 Buerklin: 53D2074 31 C39 1 4u7 SMD0603 Buerklin: 53D2086 32 C40 1 0.
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(May be addedclose to therespective pins to reduce emissions at 5GHz tole vel required byETSI) Power Management VCC01 = external VCC = DVCC = AVDD_RF / AVCC_RF Vdd Vdda1 = AVCC © 2009–2010, Texas Instruments Incorporated Vdda2 Port connectors CON1 .. CON3 = Port1 ..
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EM430F5137RF900 www.ti.com JTAG connector Jumper JP2 Close EXT for external supply Close INT for JTAG supply Open to measure current jumper JP3 External power connector CON12 Jumper JP1 Spy-Bi-Wire mode VCC GND GND Jumper JP1 Close JTAG position to debug in JTAG mode Open to disconnect LEDs jumper JP5/JP10 LED D2 (red) connected to P3.6 via JP10 Close SBW position to debug in Spy-Bi-Wire mode Push-button S2 connected to P1.7 LED D1 (green) connected to P1.
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EM430F5137RF900 www.ti.com Table B-27. EM430F5137RF900 Bill of Materials Item Reference No. per Board Description Value 1 Q1 1 ( CUSTOMER SUPPLY ) CRYSTAL, SMT, 4P, 26MHz 26M ASX-531(CS) AKER ELECTRONIC 2 C1-C5, C082, C222, C271, C281, C311, C321, C341, C412, C452 14 CAPACITOR, SMT, 0402, CER, 16V, 10%, 0.1uF 0.1uF 0402YC104KAT2 A AVX 3 C071 1 CAPACITOR, SMT, 0603, CERAMIC, 0.47uF, 16V, 10%, X5R 0.47uF 0603YD474KAT2 A AVX 4 R401 1 RES0402, 47.
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EM430F5137RF900 www.ti.com Table B-27. EM430F5137RF900 Bill of Materials (continued) Item Reference No.
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(May beaddedclose to therespective pins to reduce emissions at 5GHz to el vel required by ETSI) Power Management VCC01 = external VCC = AVDD_RF / AVCC_RF = DVCC = AVCC Vdd Vdda1 © 2009–2010, Texas Instruments Incorporated Vdda2 Port connectors CON1 .. CON5 = Port1 .. Port5 of cc430 CON6 = Vdd, GND, Vcore, COM0, LCDCAP CON7 = Vdda1, Vdda2, GND, AGND CON8 = JTAG_BASE (JTAG Port) CON9 = Vdd, GND, AGND SLAU278F – May 2009 – Revised December 2010 Submit Documentation Feedback Hardware 116 www.
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EM430F6137RF900 www.ti.com JTAG connector Jumper JP2 Close EXT for external supply Close INT for JTAG supply Open to measure current jumper JP3 External power connector CON12 Jumper JP1 Spy-Bi-Wire mode VCC GND GND Jumper JP1 Close JTAG position to debug in JTAG mode Open to disconnect LEDs jumper JP5/JP10 LED D2 (red) connected to P3.6 via JP10 Close SBW position to debug in Spy-Bi-Wire mode Push-button S2 connected to P1.7 LED D1 (green) connected to P1.
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EM430F6137RF900 www.ti.com Table B-28. EM430F6137RF900 Bill of Materials Pos. Ref Des No. per Board 1 Q1 1 ( CUSTOMER SUPPLY ) CRYSTAL, SMT, 4P, 26MHz ASX-531(CS) AKER ELECTRONIC 2 C1-C5, C112, C252, C381, C391, C421, C431, C451, C522, C562 14 CAPACITOR, SMT, 0402, CER, 16V, 10%, 0.1uF 0402YC104KAT2A AVX 3 C101 1 CAPACITOR, SMT, 0603, CERAMIC, 0.47uF, 0603YD474KAT2A 16V, 10%, X5R AVX 4 R511 1 RES0402, 47.0K CRCW04024702F100 DALE 09 18 514 6323 HARTING Description Part No.
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EM430F6137RF900 www.ti.com Table B-28. EM430F6137RF900 Bill of Materials (continued) Pos. Ref Des No. per Board 33 U1 1 DUT, SMT, PQFP, RGC-64, 0.5mmLS, 9.15x9.15x1mm, THRM.PAD CC430F6137 TI 34 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH Description Part No.
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MSP-FET430PIF www.ti.com B.28 MSP-FET430PIF Figure B-55.
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MSP-FET430PIF www.ti.com Figure B-56.
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MSP-FET430UIF www.ti.com B.29 MSP-FET430UIF Figure B-57.
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MSP-FET430UIF www.ti.com Figure B-58.
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MSP-FET430UIF www.ti.com Figure B-59.
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MSP-FET430UIF www.ti.com Figure B-60.
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MSP-FET430UIF www.ti.com Figure B-61.
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MSP-FET430UIF www.ti.com B.29.1 MSP-FET430UIF Revision History Revision 1.3 • Initial released hardware version Assembly change on 1.3 (May 2005) • R29, R51, R42, R21, R22, R74: value changed from 330R to 100R Changes 1.3 to 1.4 (Aug 2005) • J5: VBUS and RESET additionally connected • R29, R51, R42, R21, R22, R74: value changed from 330R to 100R • U1, U7: F1612 can reset TUSB3410; R44 = 0R added • TARGET-CON.
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Hardware SLAU278F – May 2009 – Revised December 2010 Submit Documentation Feedback © 2009–2010, Texas Instruments Incorporated
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Appendix C SLAU278F – May 2009 – Revised December 2010 Hardware Installation Guide This section describes the hardware installation process of the following USB debug interfaces on a PC running Windows XP: • MSP-FET430UIF • eZ430-F2013 • eZ430-RF2500 • eZ430-Chronos The installation procedure for other supported versions of Windows is very similar and, therefore, not shown here. Topic C.1 ....................................................................................................................
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Hardware Installation C.1 www.ti.com Hardware Installation 1. Connect the USB Debug Interface with a USB cable to a USB port of the PC. (eZ430-F2013, eZ430-RF2500 and eZ430-Chronos can be connected without a cable.) 2. Windows should now recognize the new hardware as an "MSP430 XXX x.xx.xx" (see Figure C-1). The device name may be different from the one shown here. Figure C-1. Windows XP Hardware Recognition 3. For CCE v3.1 SR1 and CCSv4.
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Hardware Installation www.ti.com 6. Browse to the folder where the driver information files are located (see Figure C-3).
For CCE, the default folder is: C:\Program Files\Texas Instruments\MSP430_USB_DRIVERS_v3.1\
For CCS, the default folder is: C:\Program Files\Texas Instruments\ccs4\emulation\drivers\msp430\
For IAR Embedded Workbench, the default folder is: C:\Program Files\Texas Instruments\IAR Systems\Embedded Workbench 4.0\ 430\drivers\TIUSBFET\WinXP Figure C-3.
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Hardware Installation www.ti.com 8. Note that Windows may show a warning that the driver is not certified by Microsoft. Ignore this warning and click "Continue Anyway" (see Figure C-4). Figure C-4. Windows XP Driver Installation 9. The wizard installs the driver files. 10. The wizard shows a message that it has finished the installation of the software for "MSP-FET430UIF (TI USB FET) Adapter" (or "MSP430 Application UART"). 11. NOTE: This step is for MSP-FET430UIF and eZ430-F2013 only.
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Hardware Installation www.ti.com 13. The USB debug interface is installed and ready to use. The Device Manager lists a new entry as shown in Figure C-5, Figure C-6, or Figure C-7. Figure C-5.
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Hardware Installation www.ti.com Figure C-6.
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Hardware Installation www.ti.com Figure C-7.
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Document Revision History www.ti.com Document Revision History Version SLAU278 Changes/Comments Initial release SLAU278A Updated USB driver installation according to CCE v3.1 SR1 and CCS v4. SLAU278B Added information about MSP-FET430U80USB, MSP-TS430PN80USB, and eZ430-Chronos. SLAU278C Added bills of materials and updated some PCBs in Appendix B. Added information about MSP-TS430DA38, MSP-TS430DL48, MSP-TS430PW14, MSP-TS430PW28.
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EVALUATION BOARD/KIT IMPORTANT NOTICE Texas Instruments (TI) provides the enclosed product(s) under the following conditions: This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use. Persons handling the product(s) must have electronics training and observe good engineering practice standards.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.