Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsMicrocontrollers, Microprocessors & QuartzesEmbedded microcontroller TVSOP 20 16-Bit 8 MHz I/O number 14

MSP430C11x1, MSP430F11x1A

MIXED SIGNAL MICROCONTROLLER

SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

D Low Supply Voltage Range 1.8 V to 3.6 V

D Ultralow Power Consumption

− Active Mode: 160 μA at 1 MHz, 2.2 V

− Standby Mode: 0.7 μA

− Off Mode (RAM Retention): 0.1 μA

D Wake-Up From Standby Mode in

Less Than 6 μs

D 16-Bit RISC Architecture, 125 ns

Instruction Cycle Time

D Basic Clock Module Configurations:

− Various Internal Resistors

− Single External Resistor

− 32-kHz Crystal

− High-Frequency Crystal

− Resonator

− External Clock Source

D 16-Bit Timer_A With Three

Capture/Compare Registers

D On-Chip Comparator for Analog Signal

Compare Function or Slope

Analog-to-Digital (A/D) Conversion

D Serial Onboard Programming,

No External Programming Voltage Needed,

Programmable Code Protection by

Security Fuse

D Family Members Include

MSP430C1101: 1KB ROM, 128B RAM

MSP430C1111: 2KB ROM, 128B RAM

MSP430C1121: 4KB ROM, 256B RAM

MSP430F1101A: 1KB + 128B Flash Memory

128B RAM

MSP430F1111A: 2KB + 256B Flash Memory

128B RAM

MSP430F1121A: 4KB + 256B Flash Memory

256B RAM

D Available in a 20-Pin Plastic Small-Outline

Wide Body (SOWB) Package, 20-Pin Plastic

Small-Outline Thin Package, 20-Pin TVSOP

(F11x1A only), and 24-Pin QFN

D For Complete Module Descriptions, Refer

to the MSP430x1xx Family User’s Guide,

Literature Number SLAU049

description

The Texas Instruments MSP430 family of ultralow-power microcontrollers consists of several devices featuring

different sets of peripherals targeted for various applications. The architecture, combined with five low-power

modes is optimized to achieve extended battery life in portable measurement applications. The device features

a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code

efficiency. The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less

than 6 μs.

The MSP430x11x1(A) series is an ultralow-power mixed signal microcontroller with a built-in 16-bit timer,

versatile analog comparator and fourteen I/O pins.

Typical applications include sensor systems that capture analog signals, convert them to digital values, and then

process the data for display or for transmission to a host system. Stand alone radio frequency (RF) sensor front

end is another area of application. The I/O port inputs provide single slope A/D conversion capability on resistive

sensors.

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range

from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage

because very small parametric changes could cause the device not to meet its published specifications. These devices have limited

built-in ESD protection.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

Summary of content (44 pages)

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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 D Low Supply Voltage Range 1.8 V to 3.6 V D Ultralow Power Consumption D D D D D − Active Mode: 160 μA at 1 MHz, 2.2 V − Standby Mode: 0.7 μA − Off Mode (RAM Retention): 0.
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 AVAILABLE OPTIONS PACKAGED DEVICES TA 40°C to 85°C −40°C 2 PLASTIC 20-PIN SOWB (DW) PLASTIC 20-PIN TSSOP (PW) MSP430C1101IDW MSP430C1111IDW MSP430C1121IDW MSP430F1101AIDW MSP430F1111AIDW MSP430F1121AIDW MSP430C1101IPW MSP430C1111IPW MSP430C1121IPW MSP430F1101AIPW MSP430F1111AIPW MSP430F1121AIPW POST OFFICE BOX 655303 PLASTIC 20-PIN TVSOP (DGV) MSP430F1101AIDGV MSP430F1111AIDGV MSP430F1121AIDGV
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 RGE PACKAGE (TOP VIEW) 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 P1.7/TA2/TDO/TDI P1.6/TA1/TDI/TCLK P1.5/TA0/TMS P1.4/SMCLK/TCK P1.3/TA2 P1.2/TA1 P1.1/TA0 P1.0/TACLK P2.4/CA1/TA2 P2.3/CA0/TA1 NC VSS XOUT XIN RST/NMI P2.0/ACLK 1 23 22 21 20 2 3 4 5 6 8 9 10 11 18 17 16 15 14 13 P1.5/TA0/TMS P1.4/SMCLK/TCK P1.3/TA2 P1.2/TA1 P1.1/TA0 P1.0/TACLK P2.1/INCLK P2.2/CAOUT/TA0 NC P2.3/CA0/TA1 P2.
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 Terminal Functions TERMINAL NO. NAME DESCRIPTION DW, PW, OR DGV RGE I/O P1.0/TACLK 13 13 I/O General-purpose digital I/O pin/Timer_A, clock signal TACLK input P1.1/TA0 14 14 I/O General-purpose digital I/O pin/Timer_A, capture: CCI0A input, compare: Out0 output/BSL transmit P1.2/TA1 15 15 I/O General-purpose digital I/O pin/Timer_A, capture: CCI1A input, compare: Out1 output P1.
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 short-form description CPU The MSP430 CPU has a 16-bit RISC architecture that is highly transparent to the application. All operations, other than program-flow instructions, are performed as register operations in conjunction with seven addressing modes for source operand and four addressing modes for destination operand.
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 operating modes The MSP430 has one active mode and five software selectable low-power modes of operation. An interrupt event can wake up the device from any of the five low-power modes, service the request, and restore back to the low-power mode on return from the interrupt program. The following six operating modes can be configured by software: D Active mode (AM) − All clocks are active.
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 interrupt vector addresses The interrupt vectors and the power-up starting address are located in the address range of 0FFFFh to 0FFE0h. The vector contains the 16-bit address of the appropriate interrupt handler instruction sequence.
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 special function registers Most interrupt and module enable bits are collected into the lowest address space. Special function register bits not allocated to a functional purpose are not physically present in the device. Simple software access is provided with this arrangement.
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 memory organization MSP430C1101 MSP430C1111 MSP430C1121 Memory Main: interrupt vector Main: code memory Size ROM ROM 1KB ROM 0FFFFh−0FFE0h 0FFFFh−0FC00h 2KB ROM 0FFFFh−0FFE0h 0FFFFh−0F800h 4KB ROM 0FFFFh−0FFE0h 0FFFFh−0F000h Information memory Size Flash Not applicable Not applicable Not applicable Boot memory Size ROM Not applicable Not applicable Not applicable Size 128 Byte 027Fh −
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 flash memory The flash memory can be programmed via the JTAG port, the bootstrap loader, or in-system by the CPU. The CPU can perform single-byte and single-word writes to the flash memory. Features of the flash memory include: D Flash memory has n segments of main memory and two segments of information memory (A and B) of 128 bytes each. Each segment in main memory is 512 bytes in size.
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 peripherals Peripherals are connected to the CPU through data, address, and control buses and can be handled using all instructions. For complete module descriptions, see the MSP430x1xx Family User’s Guide, literature number SLAU049.
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 Timer_A3 Timer_A3 is a 16-bit timer/counter with three capture/compare registers. Timer_A3 can support multiple capture/compares, PWM outputs, and interval timing. Timer_A3 also has extensive interrupt capabilities. Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare registers.
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 peripheral file map PERIPHERALS WITH WORD ACCESS Timer_A Reserved Reserved Reserved Reserved Capture/compare register Capture/compare register Capture/compare register Timer_A register Reserved Reserved Reserved Reserved Capture/compare control Capture/compare control Capture/compare control Timer_A control Timer_A interrupt vector TACCTL2 TACCTL1 TACCTL0 TACTL TAIV 017Eh 017Ch 017Ah 0178h 0176h 0174
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 absolute maximum ratings† Voltage applied at VCC to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 4.1 V Voltage applied to any pin (see Note) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VCC+0.3 V Diode current at any device terminal . . . . . . . . . . . . . . . . . . . . . . .
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) supply current (into VCC) excluding external current PARAMETER TEST CONDITIONS C11x1 I(AM) Active mode F11x1A C11x1 I(CPUOff) Low power mode Low-power (LPM0) F11x1A I(LPM2) Low power mode (LPM2) Low-power C11x1 I(LPM3) MIN 160 200 3V 240 300 TA = −40°C 40 C t
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (continued) Schmitt-trigger inputs − Ports P1 (P1.0 to P1.7) and P2 (P2.0 to P2.5) PARAMETER VIT+ Positive going input threshold voltage Positive-going VIT− Negative going input threshold voltage Negative-going Vhys Input voltage hysteresis (VIT+ − VIT−) VCC MIN 2.
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (continued) outputs − Ports P1 (P1.0 to P1.7) and P2 (P2.0 to P2.5) PARAMETER TEST CONDITIONS I(OHmax) = −1.5 mA VOH High-level output voltage Port 1 and Port 2 (C11x1) Port 1 (F11x1A) I(OHmax) = −6 mA I(OHmax) = −1.
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (continued) outputs − Ports P1 and P2 (continued) TYPICAL LOW-LEVEL OUTPUT CURRENT vs LOW-LEVEL OUTPUT VOLTAGE TYPICAL LOW-LEVEL OUTPUT CURRENT vs LOW-LEVEL OUTPUT VOLTAGE 25 TA = 25°C VCC = 2.2 V P1.
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (continued) optional resistors, individually programmable with ROM code (see Note 1) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT R(opt1) 2.5 5 10 kΩ R(opt2) 3.8 7.7 15 kΩ R(opt3) 7.6 15 31 kΩ R(opt4) 11.
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (continued) Comparator_A (see Note 1) PARAMETER TEST CONDITIONS MIN TYP MAX VCC = 2.2 V 25 40 VCC = 3 V 45 60 I(DD) CAON=1 CARSEL=0 CAON=1, CARSEL=0, CAREF=0 CAON=1, CARSEL=0, CAREF 1/2/3 no load at CAREF=1/2/3, P2.3/CA0/TA1 and P2.4/CA1/TA2 VCC = 2.
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (continued) 650 650 VCC = 2.
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (continued) PUC/POR PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 150 250 μs t(POR_Delay) Internal time delay to release POR VCC threshold at which POR release delay time begins (see Note 1) TA = −40°C 1.4 1.8 VPOR TA = 25°C 1.1 1.5 0.8 1.
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (continued) DCO PARAMETER TEST CONDITIONS VCC MIN TYP MAX 2.2 V 0.08 0.12 0.15 3V 0.08 0.13 0.16 2.2 V 0.14 0.19 0.23 3V 0.14 0.18 0.22 2.2 V 0.22 0.30 0.36 3V 0.22 0.28 0.34 2.2 V 0.37 0.49 0.59 3V 0.37 0.47 0.56 2.2 V 0.61 0.77 0.
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (continued) main DCO characteristics D Individual devices have a minimum and maximum operation frequency. The specified parameters for f(DCOx0) to f(DCOx7) are valid for all devices. D All ranges selected by Rsel(n) overlap with Rsel(n+1): Rsel0 overlaps Rsel1, ...
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (continued) flash memory TEST CONDITIONS PARAMETER VCC(PGM/ VCC Program and erase supply voltage MIN TYP 2.7 MAX UNIT 3.6 V ERASE) fFTG Flash Timing Generator frequency IPGM Supply current from VCC during program 476 kHz 2.7 V/ 3.
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 APPLICATION INFORMATION input/output schematic Port P1, P1.0 to P1.3, input/output with Schmitt trigger VCC P1SEL.x 0 P1DIR.x (See Note 1) 1 Direction Control From Module (See Note 2) 0 P1OUT.x Pad Logic P1.0 − P1.3 1 Module X OUT (See Note 2) (See Note 1) P1IN.x GND EN Module X IN P1IRQ.x D P1IE.x P1IFG.x Q Interrupt Edge Select EN Set Interrupt Flag P1IES.x P1SEL.
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 APPLICATION INFORMATION Port P1, P1.4 to P1.7, input/output with Schmitt trigger and in-system access features VCC P1SEL.x 0 P1DIR.x See Note 1 1 Direction Control From Module See Note 2 0 P1OUT.x Pad Logic P1.4−P1.7 1 Module X OUT See Note 2 See Note 1 GND TST Bus Keeper P1IN.x EN Module X IN D TEST TST P1IRQ.x P1IE.x P1IFG.
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 APPLICATION INFORMATION Port P2, P2.0 to P2.2, input/output with Schmitt trigger P2SEL.x VCC 0 P2DIR.x 0: Input 1 Direction Control From Module See Note 2 Pad Logic 0 P2OUT.x See Note 1 1: Output P2.0 − P2.2 1 Module X OUT See Note 2 See Note 1 GND Bus Keeper P2IN.x EN D Module X IN CAPD.X P2IRQ.x P2IE.x P2IFG.
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 APPLICATION INFORMATION Port P2, P2.3 to P2.4, input/output with Schmitt trigger P2SEL.3 P2DIR.3 VCC 0 Direction Control From Module P2OUT.3 0: Input 1 1: Output 0 Pad Logic See Note 1 See Note 2 P2.3 1 Module X OUT See Note 2 See Note 1 P2IN.3 GND Bus Keeper EN D Module X IN P2IE.3 P2IRQ.3 P2IFG.3 Interrupt Edge Select EN Q Set Interrupt Flag CAPD.
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 APPLICATION INFORMATION Port P2, P2.5, input/output with Schmitt trigger and ROSC function for the Basic Clock module VCC P2SEL.5 0: Input 1: Output 0 P2DIR.5 Pad Logic See Note 1 1 Direction Control From Module See Note 2 0 P2OUT.5 P2.5 1 Module X OUT See Note 2 See Note 1 GND Bus Keeper P2IN.5 EN Module X IN P2IRQ.5 D P2IE.5 P2IFG.
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 APPLICATION INFORMATION Port P2, unbonded bits P2.6 and P2.7 P2SEL.x 0: Input 1: Output 0 P2DIR.x 1 Direction Control From Module 0 P2OUT.x 1 Module X OUT P2IN.x Node Is Reset With PUC EN Bus Keeper Module X IN P2IRQ.x D P2IE.x P2IFG.x Q EN Set Interrupt Flag PUC Interrupt Edge Select P2IES.x P2SEL.x NOTE: x = Bit/identifier, 6 to 7 for port P2 without external pins P2Sel.x P2DIR.
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MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008 JTAG fuse check mode MSP430 devices that have the fuse on the TEST terminal have a fuse check mode that tests the continuity of the fuse the first time the JTAG port is accessed after a power-on reset (POR). When activated, a fuse check current, ITF , of 1 mA at 3 V, 2.5 mA at 5 V can flow from the TEST pin to ground if the fuse is not burned.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 4-Aug-2013 NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.
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PACKAGE MATERIALS INFORMATION www.ti.com 7-Dec-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device MSP430F1101AIDGVR Package Package Pins Type Drawing TVSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DGV 20 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 MSP430F1101IDWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1 MSP430F1111AIDGVR TVSOP DGV 20 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 7-Dec-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) MSP430F1101AIDGVR TVSOP DGV 20 2000 367.0 367.0 35.0 MSP430F1101IDWR SOIC DW 20 2000 367.0 367.0 45.0 MSP430F1111AIDGVR TVSOP DGV 20 2000 367.0 367.0 35.0 MSP430F1111AIDWR SOIC DW 20 2000 367.0 367.0 45.0 MSP430F1121AIDGVR TVSOP DGV 20 2000 367.0 367.0 35.0 MSP430F1121IDWR SOIC DW 20 2000 367.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.