Datasheet

MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008
14
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings
†
Voltage applied at V
CC
to V
SS
−0.3 V to 4.1 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage applied to any pin (see Note) −0.3 V to V
CC
+0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Diode current at any device terminal ±2 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, T
stg
(unprogrammed device) −55°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, T
stg
(programmed device) −40°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE: All voltages referenced to V
SS
. The JTAG fuse-blow voltage, V
FB
, is allowed to exceed the absolute maximum rating. The voltage is applied
to the TEST pin when blowing the JTAG fuse.
recommended operating conditions
MIN NOM MAX UNITS
MSP430C11x1
18
36
Supply voltage during program execution V (see Note 1)
MSP430C11x1 1.8 3.6
V
Supply voltage during program execution, V
CC
(see Note 1)
MSP430F11x1A 1.8 3.6
V
Supply voltage during program/erase flash memory, V
CC
MSP430F11x1A 2.7 3.6 V
Supply voltage, V
SS
0 V
Operating free-air temperature range, T
A
MSP430x11x1(A) −40 85 °C
LFXT1 t l f f
LF mode selected, XTS=0 Watch crystal 32768 Hz
LFXT1 crystal frequency, f
(LFXT1)
(see Notes 1 and 2)
XT1 mode selected XTS 1
Ceramic resonator 450 8000
kHz
(
see
N
o
t
es
1
an
d
2)
XT1 mode selected, XTS=1
Crystal 1000 8000
kHz
Processor frequency f (MCLK signal)
V
CC
= 1.8 V,
MSP430x11x1(A)
dc 4.15
MHz
Processor frequency f
(system)
(MCLK signal)
V
CC
= 3.6 V,
MSP430x11x1(A)
dc 8
MHz
NOTES: 1. In LF mode, the LFXT1 oscillator requires a watch crystal. A 5.1MΩ resistor from XOUT to V
SS
is recommended when
V
CC
< 2.5 V. In XT1 mode, the LFXT1 and XT2 oscillators accept a ceramic resonator or crystal up to 4.15MHz at V
CC
≥ 2.2 V. In
XT1 mode, the LFXT1 and XT2 oscillators accept a ceramic resonator or crystal up to 8 MHz at V
CC
≥ 2.8 V.
2. In LF mode, the LFXT1 oscillator requires a watch crystal. In XT1 mode, LFXT1 accepts a ceramic resonator or a crystal.
1.8 V 3.6 V2.7 V 3 V
4.15 MHz
8.0 MHz
Supply Voltage − V
Supply voltage range, ’F11x1A,
during flash memory programming
Supply voltage range,
’x11x1(A), during
program execution
NOTE: Minimum processor frequency is defined by system clock. Flash
program or erase operations require a minimum V
CC
of 2.7 V.
f
SYSTEM
(MHz)
Figure 1. Frequency vs Supply Voltage