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OPA564

www.ti.com

SBOS372E –OCTOBER 2008– REVISED JANUARY 2011

1.5A, 24V, 17MHz

POWER OPERATIONAL AMPLIFIER

Check for Samples: OPA564

FEATURES

DESCRIPTION

• HIGH OUTPUT CURRENT: 1.5A

• WIDE POWER-SUPPLY RANGE:

The OPA564 is a low-cost, high-current operational

amplifier that is ideal for driving up to 1.5A into

– Single Supply: +7V to +24V

reactive loads. The high slew rate provides 1.3MHz

– Dual Supply: ±3.5V to ±12V

full-power bandwidth and excellent linearity. These

• LARGE OUTPUT SWING: 20V

at 1.5A

monolithic integrated circuits provide high reliability in

demanding powerline communications and motor

• FULLY PROTECTED:

control applications.

– THERMAL SHUTDOWN

The OPA564 operates from a single supply of 7V to

– ADJUSTABLE CURRENT LIMIT

24V, or dual power supplies of ±3.5V to ±12V. In

• DIAGNOSTIC FLAGS:

single-supply operation, the input common-mode

– OVER-CURRENT

range extends to the negative supply. At maximum

output current, a wide output swing provides a 20V

– THERMAL SHUTDOWN

OUT

= 1.5A) capability with a nominal 24V supply.

• OUTPUT ENABLE/SHUTDOWN CONTROL

The OPA564 is internally protected against

• HIGH SPEED:

over-temperature conditions and current overloads. It

– GAIN-BANDWIDTH PRODUCT: 17MHz

is designed to provide an accurate, user-selected

– FULL-POWER BANDWIDTH AT 10V

current limit. Two flag outputs are provided; one

1.3MHz indicates current limit and the second shows a

thermal over-temperature condition. It also has an

– SLEW RATE: 40V/ms

Enable/Shutdown pin that can be forced low to shut

• DIODE FOR JUNCTION TEMPERATURE

down the output, effectively disconnecting the load.

MONITORING

The OPA564 is housed in a thermally-enhanced,

• HSOP-20 PowerPAD™ PACKAGE

surface-mount PowerPAD™ package (HSOP-20) with

(Bottom- and Top-Side Thermal Pad Versions)

the choice of the thermal pad on either the top side or

the bottom side of the package. Operation for both

APPLICATIONS

versions is specified over the industrial temperature

• POWERLINE COMMUNICATIONS

range, –40°C to +85°C.

• VALVE, ACTUATOR DRIVER

OPA564 RELATED PRODUCTS

• V

COM

DRIVER

FEATURES DEVICE

• MOTOR DRIVER

Zerø-Drift PGA with 2-Channel Input

PGA112

• AUDIO POWER AMPLIFIER

Mux and SPI

• POWER-SUPPLY OUTPUT AMPLIFIER

Zerø-Drift Operational Amplifier,

OPA365

50MHz, RRI/O, Single-Supply

• TEST EQUIPMENT AMPLIFIER

Quad Operational Amplifier, JFET

• TRANSDUCER EXCITATION

TL074

Input , Low Noise

• LASER DIODE DRIVER

Power Operational Amplifier, 1.2A,

OPA561

• GENERAL-PURPOSE LINEAR POWER

15V, 17MHz, 50V/ms

BOOSTER

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2PowerPAD is a trademark of Texas Instruments, Inc.

3All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (37 pages)

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OPA564 SBOS372E – OCTOBER 2008 – REVISED JANUARY 2011 www.ti.com 1.5A, 24V, 17MHz POWER OPERATIONAL AMPLIFIER Check for Samples: OPA564 FEATURES 1 • • 23 • • • • • • • HIGH OUTPUT CURRENT: 1.5A WIDE POWER-SUPPLY RANGE: – Single Supply: +7V to +24V – Dual Supply: ±3.5V to ±12V LARGE OUTPUT SWING: 20VPP at 1.
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OPA564 SBOS372E – OCTOBER 2008 – REVISED JANUARY 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure.
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OPA564 SBOS372E – OCTOBER 2008 – REVISED JANUARY 2011 www.ti.com ELECTRICAL CHARACTERISTICS Boldface limits apply over the specified temperature range: TA = –40°C to +85°C. At TCASE = +25°C, VS = ±12V, RLOAD = 20kΩ to GND, RSET = 7.5kΩ, and E/S pin enabled, unless otherwise noted. OPA564 PARAMETERS CONDITIONS MIN TYP MAX ±2 ±20 UNIT OFFSET VOLTAGE Input Offset Voltage VOS vs Temperature dVOS/dT vs Power Supply PSRR VCM = 0V ±10 VCM = 0V, VS = ±3.
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OPA564 SBOS372E – OCTOBER 2008 – REVISED JANUARY 2011 www.ti.com ELECTRICAL CHARACTERISTICS (continued) Boldface limits apply over the specified temperature range: TA = –40°C to +85°C. At TCASE = +25°C, VS = ±12V, RLOAD = 20kΩ to GND, RSET = 7.5kΩ, and E/S pin enabled, unless otherwise noted. OPA564 PARAMETERS CONDITIONS MIN TYP MAX UNIT OUTPUT, continued Maximum Continuous Current, dc IOUT Output Impedance, closed loop RO f = 100kHz Output Impedance, open loop ZO G = +2, f = 100kHz Ω ±0.
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OPA564 SBOS372E – OCTOBER 2008 – REVISED JANUARY 2011 www.ti.com ELECTRICAL CHARACTERISTICS (continued) Boldface limits apply over the specified temperature range: TA = –40°C to +85°C. At TCASE = +25°C, VS = ±12V, RLOAD = 20kΩ to GND, RSET = 7.5kΩ, and E/S pin enabled, unless otherwise noted.
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OPA564 SBOS372E – OCTOBER 2008 – REVISED JANUARY 2011 www.ti.
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OPA564 SBOS372E – OCTOBER 2008 – REVISED JANUARY 2011 www.ti.
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OPA564 SBOS372E – OCTOBER 2008 – REVISED JANUARY 2011 www.ti.com TYPICAL CHARACTERISTICS At TCASE = +25°C, VS = ±12V, RLOAD = 20kΩ to GND, RSET = 7.5kΩ, and E/S pin enabled, unless otherwise noted. QUIESCENT CURRENT vs SUPPLY VOLTAGE OUTPUT VOLTAGE SWING vs OUTPUT CURRENT 50 46 Output Voltage (V) Quiescent Current (mA) 48 44 42 RSET = 7.5kW 40 38 RSET = 40kW 36 RSET = 100kW 34 32 30 6 8 10 12 14 16 18 20 22 14 12 10 8 6 4 2 0 -2 -4 -6 -8 -10 -12 -14 24 RSET = 7.
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OPA564 SBOS372E – OCTOBER 2008 – REVISED JANUARY 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) At TCASE = +25°C, VS = ±12V, RLOAD = 20kΩ to GND, RSET = 7.5kΩ, and E/S pin enabled, unless otherwise noted. IQ vs TEMPERATURE OFFSET VOLTAGE vs TEMPERATURE 50 20 RSET = 7.5kW 15 Offset Voltage (mV) Quiescent Current (mA) 45 40 35 30 25 10 5 0 -5 -10 -15 -20 20 -75 -50 -25 0 25 50 75 100 125 -75 -50 -25 Temperature (°C) 0 Figure 7.
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OPA564 SBOS372E – OCTOBER 2008 – REVISED JANUARY 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) At TCASE = +25°C, VS = ±12V, RLOAD = 20kΩ to GND, RSET = 7.5kΩ, and E/S pin enabled, unless otherwise noted.
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OPA564 SBOS372E – OCTOBER 2008 – REVISED JANUARY 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) At TCASE = +25°C, VS = ±12V, RLOAD = 20kΩ to GND, RSET = 7.5kΩ, and E/S pin enabled, unless otherwise noted. TOTAL HARMONIC DISTORTION + NOISE vs AMPLITUDE TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY 1 Total Harmonic Distortion + Noise (%) Total Harmonic Distortion + Noise (%) 1 RLOAD = 10W 0.1 RLOAD = 5W 0.01 0.001 VS = ±12V f = 1kHz G = +10 0.0001 0.
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OPA564 SBOS372E – OCTOBER 2008 – REVISED JANUARY 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) At TCASE = +25°C, VS = ±12V, RLOAD = 20kΩ to GND, RSET = 7.5kΩ, and E/S pin enabled, unless otherwise noted. INPUT BIAS CURRENT vs COMMON-MODE VOLTAGE CLOSED-LOOP OUTPUT IMPEDANCE (No Load) Impedance (W) 1k 50 IOUT = 0A dc Gain = 1V/V 40 Input Bias Current (pA) 10k 100 10 1 30 20 10 0.1 0 0.
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OPA564 SBOS372E – OCTOBER 2008 – REVISED JANUARY 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) At TCASE = +25°C, VS = ±12V, RLOAD = 20kΩ to GND, RSET = 7.5kΩ, and E/S pin enabled, unless otherwise noted. OUTPUT CURRENT LIMIT vs RSET (SINKING CURRENT) 1.8 1.8 1.6 1.6 1.4 1.4 Output Current Limit (A) Output Current Limit (A) OUTPUT CURRENT LIMIT vs RSET (SOURCING CURRENT) 1.2 1.0 0.8 0.6 Mean Mean -3s Mean +3s Calculated Value 0.4 0.2 1.2 1.0 0.8 0.
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OPA564 SBOS372E – OCTOBER 2008 – REVISED JANUARY 2011 www.ti.com APPLICATION INFORMATION Figure 35 shows the OPA564 connected as a basic noninverting amplifier. However, the OPA564 can be used in virtually any op amp configuration. Power-supply terminals should be bypassed with low series impedance capacitors. The technique of using ceramic and tantalum capacitors in parallel is recommended. Power-supply wiring should have low series impedance.
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OPA564 SBOS372E – OCTOBER 2008 – REVISED JANUARY 2011 www.ti.com ADJUSTABLE CURRENT LIMIT Setting the Current Limit The OPA564 provides over-current protection to the load through its accurate, user-adjustable current limit (ISET pin). The current limit value, ILIM, can be set from 0.4A to 1.5A by controlling the current through the ISET pin. Setting the current limit does not require special power resistors. The output current does not flow through the ISET pin.
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OPA564 SBOS372E – OCTOBER 2008 – REVISED JANUARY 2011 www.ti.com ENABLE/SHUTDOWN (E/S) PIN The output of the OPA564 shuts down when the E/S pin is forced low. For normal operation (output enabled), the E/S pin must be pulled high (at least 2V above V–). To enable the OPA564 permanently, the E/S pin can be left unconnected. The E/S pin has an internal 100kΩ pull-up resistor. When the output is shut down, the output impedance of the OPA564 is 6GΩ || 120pF.
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OPA564 SBOS372E – OCTOBER 2008 – REVISED JANUARY 2011 www.ti.com Figure 39 shows the amplifier in a follower configuration. The load is connected midway between the supplies, V+ and V–. When the device shuts down in this situation, the load pulls VOUT to ground. Little or no current then flows through the input of the OPA564. V+ V+ 1.6kW -IN V+ VV+ VOUT I1 100W I2 6GW 120pF V1.6kW +IN V- V- Figure 39.
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OPA564 SBOS372E – OCTOBER 2008 – REVISED JANUARY 2011 www.ti.com Now consider Figure 40. Here, the load is connected to V–. When the device shuts down, current flows from the positive input +IN through the first 1.6kΩ resistor through an input protection diode, then through the second 1.6kΩ resistor, and finally through the 100Ω resistor to V–. This current flow produces a voltage across the inputs which is much greater than 0.5V, which damages the OPA564.
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OPA564 SBOS372E – OCTOBER 2008 – REVISED JANUARY 2011 www.ti.com The solution is to place external protection diodes across the OPA564 input. Figure 41 illustrates this configuration. NOTE This configuration protects the input during shutdown. V+ V+ External protection diodes required; use Skyworks Solutions Inc. # SMS3922-004LF or equivalent 1.6kW -IN V+ VV+ VOUT I1 100W I2 6GW 120pF V1.6kW +IN V- V- Figure 41.
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OPA564 SBOS372E – OCTOBER 2008 – REVISED JANUARY 2011 www.ti.com Ensuring Microcontroller Compatibility within the optocoupler. A high logic level causes the OPA564 to be enabled, and a low logic level shuts the OPA564 down. In the configuration of Figure 38(b), with the logic signal applied on the anode side, a high level causes the OPA564 to shut down, and a low level enables the op amp. Not all microcontrollers output the same logic state after power-up or reset.
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OPA564 SBOS372E – OCTOBER 2008 – REVISED JANUARY 2011 www.ti.com CURRENT LIMIT FLAG The OPA564 features a current limit flag (IFLAG) that can be monitored to determine if the load current is operating within or exceeding the current limit set by the user. The output signal of IFLAG is compatible with standard CMOS logic and is referenced to the negative supply pin (V–). A voltage level of + 0.8V or less with respect to V– indicates that the amplifier is operating within the limits set by the user.
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OPA564 SBOS372E – OCTOBER 2008 – REVISED JANUARY 2011 www.ti.com Power dissipation depends on power supply, signal, and load conditions. For dc signals, power dissipation is equal to the product of output current (IOUT) and the voltage across the conducting output transistor [(V+) – VOUT when sourcing; VOUT – (V–) when sinking]. Dissipation with ac signals is lower. Application Bulletin AB-039, Power Amplifier Stress and Power Handling Limitations (SBOA022, available for download from www.ti.
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OPA564 SBOS372E – OCTOBER 2008 – REVISED JANUARY 2011 www.ti.com For applications with limited board size, refer to Figure 47 for the approximate thermal resistance relative to heatsink area. Increasing heatsink area beyond 2in2 provides little improvement in thermal resistance. To achieve the 33°C/W shown in the Electrical Characteristics, a 2oz copper plane size of 9in2 was used.
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OPA564 SBOS372E – OCTOBER 2008 – REVISED JANUARY 2011 www.ti.com Leadframe (Copper Alloy) IC (Silicon) Die Attach (Epoxy) Die Pad External Heatspreader Die Attach Chip Thermal Paste Power Transistor Leadframe Die Pad Exposed at Base of the Package Board Mold Compound (Epoxy) (b) DWD PowerPAD cross-section view (a) DWP PowerPAD cross-section view Figure 49. Cross-Section Views Bottom-Side PowerPAD Assembly Process 1. The PowerPAD must be connected to the most negative supply of the device, V–. 2.
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OPA564 SBOS372E – OCTOBER 2008 – REVISED JANUARY 2011 www.ti.com APPLICATIONS CIRCUITS R2 1kW The high output current and low supply of the OPA564 make it a good candidate for driving laser diodes and thermoelectric coolers. Figure 51 shows an improved Howland current pump circuit. VDIG +5V 47mF 0.1mF POWERLINE COMMUNICATION R1 20kW OPA564 Powerline communication (PLC) applications require some form of signal transmission over an existing ac power line.
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OPA564 SBOS372E – OCTOBER 2008 – REVISED JANUARY 2011 www.ti.com PROGRAMMABLE POWER SUPPLY For more information on this circuit, see the Application Bulletin DC Motor Speed Controller: Control a DC Motor without Tachometer Feedback (SBOA043), available for download at the TI web site. Figure 53 shows the OPA333 used to control ISET in order to adjust the current limit of the OPA564. Figure 54 shows a basic motor speed driver but does not include any control over the motor speed.
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OPA564 SBOS372E – OCTOBER 2008 – REVISED JANUARY 2011 www.ti.com Note (4) +12V C2 47mF C1 0.1mF (2) Z1 R1 1kW R2 10kW VIN VDIG (3) S1 (1) OPA564 R3 5kW RSET C2 47mF C1 0.1mF RM = 12W (3) RM S2 dc Motor EMF (2) Z2 -12V Note (4) RS 1W (1) IFLAG and TFLAG connections are not shown. (2) Z1, Z2 = zener diodes (IN5246 or equivalent). Select Z1 and Z2 diodes that are capable of the maximum anticipated surge current. (3) S1, S2 = Schottky diodes (STPS1L40 or equivalent).
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OPA564 SBOS372E – OCTOBER 2008 – REVISED JANUARY 2011 www.ti.com V+ VDIG +5V -IN VOUT OPA564 0.1mF +IN TSENSE V- 10kW (typ) 1 50W 2 50pF 3 V+ D+ 10kW (typ) 10kW (typ) 8 SCL TMP411 7 SDA D- 10kW (typ) SMBus Controller 6 ALERT/THERM2 4 Over-Temperature Fault THERM GND 5 Figure 57. Temperature Measurement Using TSENSE and TMP411 +3.3V R46 10k R47 10k +3.3V C2 5 30k C11 R49 10k R13 C6 C5 82pF R7 2.67k 4 R10 1 6.8k 100nF +3.3V 0.1uF GND U1 0.
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OPA564 SBOS372E – OCTOBER 2008 – REVISED JANUARY 2011 www.ti.com REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (November, 2010) to Revision E Page • Changed RCL to RSET throughout document ......................................................................................................................... 1 • Updated Absolute Maximum Ratings table, signal input terminals specifications; added new footnote ..
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE MATERIALS INFORMATION www.ti.com 3-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device OPA564AIDWPR Package Package Pins Type Drawing SO Power PAD DWP 20 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2000 330.0 24.4 Pack Materials-Page 1 10.8 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 13.3 2.7 12.0 24.
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PACKAGE MATERIALS INFORMATION www.ti.com 3-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) OPA564AIDWPR SO PowerPAD DWP 20 2000 367.0 367.0 45.
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