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MSP-TS430RGZ48B

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Table B-14. MSP-TS430RGZ48B Bill of Materials

No. per

Position Ref Des Description DigiKey Part No. Comment

Board

1 C1, C2 0 12pF, SMD0805 DNP

2 C3, C4 0 47pF, SMD0805 DNP

C6, C7,

3 3 10uF/6.3V, SMD0805

C12

C5, C11,

4 4 100nF, SMD0805 311-1245-2-ND

C13, C14

5 C8 1 2.2nF, SMD0805

6 C9 1 470nF, SMD0805 478-1403-2-ND

7 D1 1 green LED, SMD0805 P516TR-ND

SAM1029-12-ND

DNP: Headers and receptacles

J1, J2, J3, (Header)

8 0 12-pin header, TH enclosed with kit. Keep vias free of

J4 SAM1213-12-ND

solder:

(Receptacle)

9 J5 1 3-pin header, male, TH

JP3, JP5,

place jumpers on pins 2-3 on JP5,

JP6, JP7,

10 7 3-pin header, male, TH SAM1035-03-ND JP6, JP7, JP8, JP9, JP10 place

JP8, JP9,

jumpers on pins 1-2 on JP3,

JP10

11 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header

12 9 Jumper 15-38-1024-ND See Pos. 10and Pos. 11

14-pin connector, male,

13 JTAG 1 HRP14H-ND

10-pin connector, male,

14 BOOTST 0 "DNP Keep vias free of solder"

Micro Crystal MS3V-T1R

15 Q1 0 Crystal 32.768kHz, C(Load) = DNP: Q1 Keep vias free of solder

12.5pF

Q2: 4MHz Buerklin:

16 Q2 0 Crystal DNP: Q2 Keep vias free of solder

78D134

http://www.ettinger.de/Ar

Insulating

17 0 Insulating disk to Q2 t_Detail.cfm?ART_ART

disk to Q2

NUM=70.08.121

18 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

R1, R2,

R4, R6,

19 R8, 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12

R9,R10,

R11, R12

20 R5 1 47k Ω, SMD0805 541-47000ATR-ND

Socket:

21 U1 1 QFN11T048- Manuf.: Yamaichi

008_A101121_RGZ48

22 PCB 1 81 x 76 mm 2 layers

Adhesive about 6mm width, 2mm e.g., 3M Bumpons Part

23 4 Apply to corners at bottom side

plastic feet height No. SJ-5302

24 MSP430 2 MSP430F5342IRGZ DNP: enclosed with kit, supplied by TI

Hardware SLAU278F–May 2009–Revised December 2010

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