Datasheet

FUNCTION TABLES
SN65HVD233-EP
SLLS944 – NOVEMBER 2008 ............................................................................................................................................................................................ www.ti.com
Table 2. Thermal Characteristics
PARAMETERS TEST CONDITIONS VALUE UNIT
Low-K
(2)
board, no air flow 185
θ
JA
Junction-to-ambient thermal resistance
(1)
° C/W
High-K
(3)
board, no air flow 101
θ
JB
Junction-to-board thermal resistance High-K
(3)
board, no air flow 82.8 ° C/W
θ
JC
Junction-to-case thermal resistance 26.5 ° C/W
R
L
= 60 Ω , R
S
at 0 V, input to D a 1-MHz 50% duty
P
(AVG)
Average power dissipation 36.4 mW
cycle square wave V
CC
at 3.3 V, T
A
= 25 ° C
T
(SD)
Thermal shutdown junction temperature 170 ° C
(1) See TI literature number SZZA003 for an explanation of this parameter.
(2) JESD51-3 low effective thermal conductivity test board for leaded surface mount packages.
(3) JESD51-7 high effective thermal conductivity test board for leaded surface mount packages.
DRIVER
(1)
INPUTS OUTPUTS
D LBK/AB R
s
CANH CANL BUS STATE
X X > 0.75 V
CC
Z Z Recessive
L L or open H L Dominant
≤ 0.33 V
CC
H or open X Z Z Recessive
X H ≤ 0.33 V
CC
Z Z Recessive
(1) H = high level; L = low level; Z = high impedance; X = irrelevant; ? = indeterminate
RECEIVER
(1)
INPUTS OUTPUT
BUS STATE V
ID
= V
(CANH)
– V
(CANL)
LBK D R
Dominant V
ID
≥ 0.9 V L or open X L
Recessive V
ID
≤ 0.5 V or open L or open H or open H
? 0.5 V < V
ID
< 0.9 V L or open H or open ?
X X L L
H
X X H H
(1) H = high level; L = low level; Z = high impedance; X = irrelevant; ? = indeterminate
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