Datasheet

SN54ABT126, SN74ABT126
QUADRUPLE BUS BUFFER GATES
WITH 3-STATE OUTPUTS
SCBS183H − FEBRUARY 1991 − REVISED MAY 2003
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D Typical V
OLP
(Output Ground Bounce)
<1 V at V
CC
= 5 V, T
A
= 25°C
D High-Impedance State During Power Up
and Power Down
D High-Drive Outputs (−32-mA I
OH
, 64-mA I
OL
)
D I
off
and Power-Up 3-State Support Hot
Insertion
D Latch-Up Performance Exceeds 500 mA Per
JESD 17
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
SN54ABT126 ...J PACKAGE
SN74ABT126 . . . D, DB, N, NS,
OR PW PACKAGE
(TOP VIEW)
SN54ABT126 . . . FK PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1OE
1A
1Y
2OE
2A
2Y
GND
V
CC
4OE
4A
4Y
3OE
3A
3Y
3212019
910111213
4
5
6
7
8
18
17
16
15
14
4A
NC
4Y
NC
3OE
1Y
NC
2OE
NC
2A
1A
1OE
NC
3Y
3A
V
4OE
2Y
GND
NC
CC
NC − No internal connection
SN74ABT126 . . . RGY PACKAGE
(TOP VIEW)
114
78
2
3
4
5
6
13
12
11
10
9
4OE
4A
4Y
3OE
3A
1A
1Y
2OE
2A
2Y
1OE
3Y
V
GND
CC
description/ordering information
The ’ABT126 bus buffer gates feature independent line drivers with 3-state outputs. Each output is disabled
when the associated output-enable (OE) input is low.
When V
CC
is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 2.1 V, OE should be tied to GND through a pulldown
resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
ORDERING INFORMATION
T
A
PACKAGE
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
QFN − RGY Tape and reel SN74ABT126RGYR AB126
PDIP − N Tube SN74ABT126N SN74ABT126N
SOIC D
Tube SN74ABT126D
ABT126
40°Cto85°C
SOIC − D
Tape and reel SN74ABT126DR
ABT126
−40°C to 85°C
SOP − NS Tape and reel SN74ABT126NSR ABT126
SSOP − DB Tape and reel SN74ABT126DBR AB126
TSSOP PW
Tube SN74ABT126PW
AB126
TSSOP − PW
Tape and reel SN74ABT126PWR
AB126
55°C to 125°C
CDIP − J Tube SNJ54ABT126J SNJ54ABT126J
−55°C to 125°C
LCCC − FK Tube SNJ54ABT126FK SNJ54ABT126FK
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Copyright © 2003, Texas Instruments Incorporated
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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