Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLogic ICsLogic IC - Buffer, driver TSSOP 20

 

 

  

SCBS099J − JANUARY 1991 − REVISED APRIL 2005

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

D State-of-the-Art EPIC-ΙΙB BiCMOS Design

Significantly Reduces Power Dissipation

D Latch-Up Performance Exceeds 500 mA Per

JEDEC Standard JESD-17

D ESD Protection Exceeds 2000 V Per

MIL-STD-883, Method 3015; Exceeds 200 V

Using Machine Model (C = 200 pF, R = 0)

D Typical V

OLP

(Output Ground Bounce) < 1 V

at V

= 5 V, T

= 25°C

D High-Drive Outputs (−32-mA I

, 64-mA I

)

D Package Options Include Plastic

Small-Outline (DW), Shrink Small-Outline

(DB), and Thin Shrink Small-Outline (PW)

Packages, Ceramic Chip Carriers (FK),

Plastic (N) and Ceramic (J) DIPs, and

Ceramic Flat (W) Package

description

These octal buffers and line drivers are designed

specifically to improve both the performance and

density of 3-state memory address drivers, clock

drivers, and bus-oriented receivers and

transmitters. Together with the SN54ABT240,

SN74ABT240A, SN54ABT241, and

SN74ABT241A, these devices provide the choice

of selected combinations of inverting and

noninverting outputs, symmetrical active-low

output-enable (OE

) inputs, and complementary

OE and OE

inputs.

The SN54ABT244 and SN74ABT244A are organized as two 4-bit buffers/line drivers with separate OE

inputs.

When OE

is low, the devices pass noninverted data from the A inputs to the Y outputs. When OE is high, the

outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE

should be tied to V

through a pullup

resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN54ABT244 is characterized for operation over the full military temperature range of −55°C to 125°C. The

SN74ABT244A is characterized for operation from −40°C to 85°C.

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#'$#1  "** (""!'#'$,

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

EPIC-ΙΙB is a trademark of Texas Instruments.

1OE

1A1

2Y4

1A2

2Y3

1A3

2Y2

1A4

2Y1

GND

2OE

1Y1

2A4

1Y2

2A3

1Y3

2A2

1Y4

2A1

SN54ABT244 ...J OR W PACKAGE

SN74ABT244A . . . DB, DW, N, OR PW PACKAGE

(TOP VIEW)

3212019

910111213

1Y1

2A4

1Y2

2A3

1Y3

1A2

2Y3

1A3

2Y2

1A4

SN54ABT244...FK PACKAGE

(TOP VIEW)

2Y4

1A1

1OE

1Y4

2A2 2OE

2Y1

GND

2A1

Summary of content (33 pages)

PAGE 1
SCBS099J − JANUARY 1991 − REVISED APRIL 2005 D D D D 1OE 1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 GND 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 description 1A2 2Y3 1A3 2Y2 1A4 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 1Y1 2A4 1Y2 2A3 1Y3 2Y1 GND 2A1 1Y4 2A2 These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, cloc
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SCBS099J − JANUARY 1991 − REVISED APRIL 2005 FUNCTION TABLE (each buffer) INPUTS OE A OUTPUT Y L H H L L L H X Z logic symbol† 1OE 1A1 1A2 1A3 1A4 1 19 EN 2OE 18 2 4 16 6 14 12 8 1Y1 2A1 1Y2 2A2 1Y3 2A3 1Y4 2A4 EN 11 9 13 7 15 5 17 3 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
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SCBS099J − JANUARY 1991 − REVISED APRIL 2005 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.
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SCBS099J − JANUARY 1991 − REVISED APRIL 2005 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH TEST CONDITIONS VCC = 4.5 V, VCC = 4.5 V, II = −18 mA IOH = −3 mA VCC = 5 V, VCC = 4.5 V VOL VCC = 4.5 V Vhys II Ioff ICEX IO‡ Co SN54ABT244 MIN −1.2 MAX SN74ABT244A MIN −1.2 2.5 2.5 IOH = −3 mA IOH = −24 mA 3 3 3 2 2 IOH = −32 mA IOL = 48 mA 2* VCC = 5.
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SCBS099J − JANUARY 1991 − REVISED APRIL 2005 switching characteristics over recommended ranges of supply voltage and operating free-air temperature, CL = 50 pF (unless otherwise noted) (see Figure 1) SN54ABT244 PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A Y tPZH tPZL OE Y tPHZ tPLZ OE Y VCC = 5 V, TA = 25°C MIN MAX MIN TYP MAX 1 2.6 4.1 1 5.3 1 2.9 4.2 1 5 1.1 3.1 4.6 0.8 5.7 2.1 4.1 5.6 1.2 7.9 2.1 4.
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SCBS099J − JANUARY 1991 − REVISED APRIL 2005 PARAMETER MEASUREMENT INFORMATION 500 Ω From Output Under Test S1 7V Open GND CL = 50 pF (see Note A) 500 Ω TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 7V Open 3V LOAD CIRCUIT Timing Input 1.5 V 0V tw tsu 3V th 3V Input 1.5 V 1.5 V 0V Data Input 1.5 V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION 3V 1.5 V Input 1.5 V 0V VOH 1.5 V Output 1.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SNJ54ABT244FK ACTIVE LCCC FK 20 1 TBD SNJ54ABT244J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type SNJ54ABT244W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs.
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PACKAGE MATERIALS INFORMATION www.ti.com 5-Aug-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74ABT244ADBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74ABT244ADWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74ABT244ANSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.
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PACKAGE MATERIALS INFORMATION www.ti.com 5-Aug-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74ABT244ADBR SN74ABT244ADWR SSOP DB 20 2000 346.0 346.0 33.0 SOIC DW 20 2000 346.0 346.0 41.0 SN74ABT244ANSR SO NS 20 2000 346.0 346.0 41.0 SN74ABT244APWR TSSOP PW 20 2000 346.0 346.0 33.
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MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters.
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MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.
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MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined.
PAGE 22
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74ABT244ADBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74ABT244ADWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74ABT244ANSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74ABT244ADBR SN74ABT244ADWR SSOP DB 20 2000 367.0 367.0 38.0 SOIC DW 20 2000 367.0 367.0 45.0 SN74ABT244ANSR SO NS 20 2000 367.0 367.0 45.0 SN74ABT244APWR TSSOP PW 20 2000 367.0 367.0 38.
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MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters.
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