Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLogic ICsLogic IC - Latch Transparent D latch Three-state PDIP 20

 

   

  

SCAS552C − NOVEMBER 1995 − REVISED OCTOBER 2003

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

D 2-V to 6-V V

Operation

D Inputs Accept Voltages to 6 V

D Max t

of 9 ns at 5 V

D 3-State Inverting Outputs Drive Bus Lines

Directly

D Full Parallel Access for Loading

D Flow-Through Architecture to Optimize

PCB Layout

description/ordering information

The ’AC563 devices are octal D-type transparent

latches with 3-state outputs. When the

latch-enable (LE) input is high, the Q

outputs

follow the complements of the data (D) inputs.

When LE is taken low, the Q

outputs are latched

at the inverse logic levels set up at the D inputs.

A buffered output-enable (OE

) input can be used

to place the eight outputs in either a normal logic

state (high or low logic levels) or the

high-impedance state. In the high-impedance

state, the outputs neither load nor drive the bus

lines significantly. The high-impedance state and

increased drive provide the capability to drive bus

lines without need for interface or pullup

components.

does not affect internal operations of the

latches. Old data can be retained or new data can

be entered while the outputs are in the

high-impedance state.

ORDERING INFORMATION

PACKAGE

†

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

PDIP − N Tube SN74AC563N SN74AC563N

SOIC − DW

Tube SN74AC563DW

AC563

SOIC − DW

Tape and reel SN74AC563DWR

AC563

−40°C to 85°C

SOP − NS Tape and reel SN74AC563NSR AC563

−40 C to 85 C

SSOP − DB Tape and reel SN74AC563DBR AC563

TSSOP − PW

Tube SN74AC563PW

AC563

TSSOP − PW

Tape and reel SN74AC563PWR

AC563

CDIP − J Tube SNJ54AC563J SNJ54AC563J

−55°C to 125°C

CFP − W Tube SNJ54AC563W SNJ54AC563W

−55 C to 125 C

LCCC − FK Tube SNJ54AC563FK SNJ54AC563FK

†

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are

available at www.ti.com/sc/package.

GND

SN54AC563 ...J OR W PACKAGE

SN74AC563 . . . DB, DW, N, NS, OR PW PACKAGE

(TOP VIEW)

3 2 1 20 19

910111213

CLK

SN54AC563 . . . FK PACKAGE

(TOP VIEW)

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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications o

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Summary of content (23 pages)

PAGE 1
SCAS552C − NOVEMBER 1995 − REVISED OCTOBER 2003 D D SN54AC563 . . . J OR W PACKAGE SN74AC563 . . .
PAGE 2
SCAS552C − NOVEMBER 1995 − REVISED OCTOBER 2003 description/ordering information (continued) To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
PAGE 3
SCAS552C − NOVEMBER 1995 − REVISED OCTOBER 2003 recommended operating conditions (see Note 3) SN54AC563 VCC VIH Supply voltage VCC = 3 V VCC = 4.5 V High-level input voltage VCC = 5.5 V VCC = 3 V VIL VI VO IOH IOL ∆t/∆v MIN MAX 2 6 Input voltage Low-level output current 2 6 3.15 3.15 3.85 3.85 0 High-level output current MAX 2.1 0 Output voltage MIN 2.1 VCC = 4.5 V VCC = 5.
PAGE 4
SCAS552C − NOVEMBER 1995 − REVISED OCTOBER 2003 timing requirements over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1) TA = 25°C MIN MAX tw tsu Pulse duration, LE high th Hold time, data after LE↓ Setup time, data before LE↓ SN54AC563 MIN SN74AC563 MAX MIN MAX UNIT 6 8 7 ns 2.
PAGE 5
SCAS552C − NOVEMBER 1995 − REVISED OCTOBER 2003 PARAMETER MEASUREMENT INFORMATION 2 × VCC S1 500 Ω From Output Under Test CL = 50 pF (see Note A) Open 500 Ω TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 2 × VCC Open LOAD CIRCUIT VCC 50% VCC Timing Input 0V tw tsu VCC 50% VCC Input th 50% VCC VCC 50% VCC Data Input 50% VCC 0V 0V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS Output Control (low-level enabling) VCC 50% VCC Input
PAGE 6
PACKAGE OPTION ADDENDUM www.ti.
PAGE 7
PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.
PAGE 8
PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74AC563DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74AC563PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.
PAGE 9
PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74AC563DBR SSOP DB 20 2000 346.0 346.0 33.0 SN74AC563PWR TSSOP PW 20 2000 346.0 346.0 33.
PAGE 10
MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters.
PAGE 11
MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters.
PAGE 12
PAGE 13
PAGE 14
PACKAGE OPTION ADDENDUM www.ti.
PAGE 15
PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.
PAGE 16
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74AC563DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74AC563PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.
PAGE 17
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74AC563DBR SSOP DB 20 2000 367.0 367.0 38.0 SN74AC563PWR TSSOP PW 20 2000 367.0 367.0 38.
PAGE 18
PAGE 19
PAGE 20
PAGE 21
PAGE 22
MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters.
PAGE 23
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