Datasheet

SN54ACT241, SN74ACT241
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCAS516C − JUNE 1995 − REVISED OCTOBER 2002
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D 4.5-V to 5.5-V V
CC
Operation
D Inputs Accept Voltages to 5.5 V
D Max t
pd
of 8.5 ns at 5 V
D Inputs Are TTL Compatible
SN54ACT241 ...J OR W PACKAGE
SN74ACT241 . . . DB, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
3 2 1 20 19
9 10 11 12 13
4
5
6
7
8
18
17
16
15
14
1Y1
2A4
1Y2
2A3
1Y3
1A2
2Y3
1A3
2Y2
1A4
SN54ACT241...FK PACKAGE
(TOP VIEW)
2Y4
1A1
1OE
1Y4
2A2 2OE
2Y1
GND
2A1
V
CC
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
V
CC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
description/ordering information
These octal buffers and line drivers are designed specifically to improve the performance and density of 3-state
memory address drivers, clock drivers, and bus-oriented receivers and transmitters.
The ’ACT241 devices are organized as two 4-bit buffers/drivers with separate complementary output-enable
(1OE and 2OE) inputs. When 1OE is low or 2OE is high, the device passes noninverted data from the A inputs
to the Y outputs. When 1OE
is high or 2OE is low, the outputs are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE
should be tied to V
CC
through a pullup
resistor and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is
determined by the current-sinking or the current-sourcing capability of the driver.
ORDERING INFORMATION
T
A
PACKAGE
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
PDIP − N Tube SN74ACT241N SN74ACT241N
SOIC DW
Tube SN74ACT241DW
ACT241
40°Cto85°C
SOIC − DW
Tape and reel SN74ACT241DWR
ACT241
−40°C to 85°C
SOP − NS Tape and reel SN74ACT241NSR ACT241
SSOP − DB Tape and reel SN74ACT241DBR AD241
TSSOP − PW Tape and reel SN74ACT241PWR AD241
CDIP − J Tube SNJ54ACT241J SNJ54ACT241J
−55°C to 125°C
CFP − W Tube SNJ54ACT241W SNJ54ACT241W
LCCC − FK Tube SNJ54ACT241FK SNJ54ACT241FK
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Copyright © 2002, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.

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