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SN74AHC244-EP

OCTAL BUFFER/DRIVER

WITH 3-STATE OUTPUTS

SCLS486A – MAY 2003 – REVISED JUNE 2003

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

Controlled Baseline

– One Assembly/Test Site, One Fabrication

Site

Extended Temperature Performance of

–55°C to 125°C

Enhanced Diminishing Manufacturing

Sources (DMS) Support

Enhanced Product-Change Notification

Qualification Pedigree

†

EPIC (Enhanced-Performance Implanted

CMOS) Process

Operating Range 2-V to 5.5-V V

Latch-Up Performance Exceeds 250 mA Per

JESD 17

ESD Protection Exceeds 1500 V Per

MIL-STD-833, Method 3015; Exceeds 150 V

Using Machine Model (C = 200 pF, R = 0)

†

Component qualification in accordance with JEDEC and industry

standards to ensure reliable operation over an extended

temperature range. This includes, but is not limited to, Highly

Accelerated Stress Test (HAST) or biased 85/85, temperature

cycle, autoclave or unbiased HAST, electromigration, bond

intermetallic life, and mold compound life. Such qualification

testing should not be viewed as justifying use of this component

beyond specified performance and environmental limits.

description/ordering information

This octal buffer/driver is designed specifically to improve the performance and density of 3-state

memory-address drivers, clock drivers, and bus-oriented receivers and transmitters.

The SN74AHC244 is organized as two 4-bit buffers/line drivers with separate output-enable (OE

) inputs. When

is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the

high-impedance state.

To ensure the high-impedance state during power up or power down, OE

should be tied to V

through a pullup

resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

ORDERING INFORMATION

PACKAGE

‡

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

55°Cto125°C

SOIC – D Tape and reel SN74AHC244MDWREP AHC244MEP

–

55°C

125°C

TSSOP – PW Tape and reel SN74AHC244MPWREP AHC244EP

‡

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines

are available at www.ti.com/sc/package.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

EPIC is a trademark of Texas Instruments.

1OE

1A1

2Y4

1A2

2Y3

1A3

2Y2

1A4

2Y1

GND

2OE

1Y1

2A4

1Y2

2A3

1Y3

2A2

1Y4

2A1

DW OR PW PACKAGE

(TOP VIEW)

Summary of content (11 pages)

PAGE 1
SN74AHC244-EP OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS SCLS486A – MAY 2003 – REVISED JUNE 2003 D D D D D D D D D DW OR PW PACKAGE (TOP VIEW) Controlled Baseline – One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of –55°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree† EPIC (Enhanced-Performance Implanted CMOS) Process Operating Range 2-V to 5.
PAGE 2
SN74AHC244-EP OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS SCLS486A – MAY 2003 – REVISED JUNE 2003 FUNCTION TABLE (each 4-bit buffer/driver) INPUTS OE A OUTPUT Y L H H L L L H X Z logic symbol† 1OE 1A1 1A2 1A3 1A4 1 EN 2OE 18 2 4 16 6 14 12 8 1Y1 2A1 1Y2 2A2 1Y3 2A3 1Y4 2A4 19 EN 11 9 13 7 15 5 17 3 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
PAGE 3
SN74AHC244-EP OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS SCLS486A – MAY 2003 – REVISED JUNE 2003 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.
PAGE 4
SN74AHC244-EP OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS SCLS486A – MAY 2003 – REVISED JUNE 2003 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) MIN TA = 25°C TYP MAX MIN 2V 1.9 2 1.9 3V 2.9 3 2.9 4.5 V 4.4 4.5 4.4 IOH = –4 mA 3V 2.58 2.48 IOH = –8 mA 4.5 V 3.94 3.8 PARAMETER TEST CONDITIONS IOH = –50 mA VOH IOL = 50 mA VOL IOL = 4 mA II IOZ ICC Ci Co IOL = 8 mA VI = 5.
PAGE 5
SN74AHC244-EP OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS SCLS486A – MAY 2003 – REVISED JUNE 2003 switching characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) LOAD CAPACITANCE tPLH tPHL A Y CL = 15 pF tPZH tPZL OE Y CL = 15 pF tPHZ tPLZ OE Y CL = 15 pF tPLH tPHL A Y CL = 50 pF tPZH tPZL OE Y CL = 50 pF tPHZ tPLZ OE Y CL = 50 pF MIN TA = 25°C TYP MAX MIN MAX 3.9 5.
PAGE 6
SN74AHC244-EP OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS SCLS486A – MAY 2003 – REVISED JUNE 2003 PARAMETER MEASUREMENT INFORMATION From Output Under Test RL = 1 kΩ From Output Under Test Test Point VCC Open S1 TEST GND CL (see Note A) CL (see Note A) S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Drain Open VCC GND VCC LOAD CIRCUIT FOR 3-STATE AND OPEN-DRAIN OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS VCC 50% VCC Timing Input tw tsu VCC Input 50% VCC 50% VCC 0V th VCC 50% VCC Data Input 50% V
PAGE 7
PACKAGE OPTION ADDENDUM www.ti.
PAGE 8
PACKAGE OPTION ADDENDUM www.ti.com 24-Jan-2013 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
PAGE 9
PACKAGE MATERIALS INFORMATION www.ti.com 4-Mar-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74AHC244MDWREP SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1 SN74AHC244MPWREP TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.
PAGE 10
PACKAGE MATERIALS INFORMATION www.ti.com 4-Mar-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74AHC244MDWREP SOIC DW 20 2000 367.0 367.0 45.0 SN74AHC244MPWREP TSSOP PW 20 2000 367.0 367.0 38.
PAGE 11
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.