Datasheet

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FEATURES

1OE

1A1

2Y4

1A2

2Y3

1A3

2Y2

1A4

2Y1

GND

2OE

1Y1

2A4

1Y2

2A3

1Y3

2A2

1Y4

2A1

DGV, DW, NS, OR PW PACKAGE

(TOP VIEW)

RGY PACKAGE

(TOP VIEW)

1 20

10 11

2OE

1Y1

2A4

1Y2

2A3

1Y3

2A2

1Y4

1A1

2Y4

1A2

2Y3

1A3

2Y2

1A4

2Y1

1OE

2A1

GND

DESCRIPTION/ORDERING INFORMATION

SN74ALVC244

OCTAL BUFFER/DRIVER

WITH 3-STATE OUTPUTS

SCES188G – FEBRUARY 1999 – REVISED OCTOBER 2004

• ESD Protection Exceeds JESD 22

• Operates From 1.65 V to 3.6 V – 2000-V Human-Body Model (A114-A)

• Max t

of 2.8 ns at 3.3 V – 200-V Machine Model (A115-A)

• ± 24-mA Output Drive at 3.3 V – 1000-V Charged-Device Model (C101)

• Latch-Up Performance Exceeds 250 mA Per

JESD 17

This octal buffer/line driver is designed for 1.65-V to 3.6-V V

operation.

The SN74ALVC244 is organized as two 4-bit line drivers with separate output-enable ( OE) inputs. When OE is

low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the

high-impedance state.

To ensure the high-impedance state during power up or power down, OE should be tied to V

through a pullup

resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

ORDERING INFORMATION

PACKAGE

(1)

ORDERABLE PART NUMBER TOP-SIDE MARKING

QFN - RGY Tape and reel SN74ALVC244RGYR VA244

Tube SN74ALVC244DW

SOIC - DW ALVC244

Tape and reel SN74ALVC244DWR

-40 ° C to 85 ° C SOP - NS Tape and reel SN74ALVC244NSR ALVC244

Tube SN74ALVC244PW

TSSOP - PW VA244

Tape and reel SN74ALVC244PWR

TVSOP - DGV Tape and reel SN74ALVC244DGVR VA244

(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (18 pages)

PAGE 1
SN74ALVC244 OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES188G – FEBRUARY 1999 – REVISED OCTOBER 2004 • FEATURES Operates From 1.65 V to 3.6 V Max tpd of 2.8 ns at 3.3 V ±24-mA Output Drive at 3.
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SN74ALVC244 OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.
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SN74ALVC244 OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES188G – FEBRUARY 1999 – REVISED OCTOBER 2004 RECOMMENDED OPERATING CONDITIONS (1) VCC Supply voltage VCC = 1.65 V to 1.95 V VIH High-level input voltage MIN MAX 1.65 3.6 Low-level input voltage VI Input voltage VO Output voltage IOH High-level output current IOL Low-level output current ∆t/∆v Input transition rise or fall rate TA Operating free-air temperature (1) V 0.65 × VCC VCC = 2.3 V to 2.7 V 1.7 VCC = 2.
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SN74ALVC244 OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES188G – FEBRUARY 1999 – REVISED OCTOBER 2004 SWITCHING CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) FROM (INPUT) TO (OUTPUT) tpd A ten OE tdis OE PARAMETER VCC = 1.8 V ± 0.15 V MIN MAX Y 1 Y 1.8 Y 1.8 VCC = 2.5 V ± 0.2 V MIN MAX 4.4 1 6.9 1.5 5.9 1 VCC = 2.7 V MIN VCC = 3.3 V ± 0.3 V UNIT MAX MIN MAX 3.1 3.1 1.1 2.8 ns 5.4 5.3 1.5 4.
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SN74ALVC244 OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES188G – FEBRUARY 1999 – REVISED OCTOBER 2004 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test Open GND CL (see Note A) RL TEST S1 tpd tPLZ/tPZL tPHZ/tPZH Open VLOAD GND LOAD CIRCUIT INPUT VCC 1.8 V ± 0.15 V 2.5 V ± 0.2 V 2.7 V 3.3 V ± 0.3 V VI tr/tf VCC VCC 2.7 V 2.7 V ≤2 ns ≤2 ns ≤2.5 ns ≤2.5 ns VM VLOAD CL RL V∆ VCC/2 VCC/2 1.5 V 1.
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PACKAGE OPTION ADDENDUM www.ti.
PAGE 7
PACKAGE OPTION ADDENDUM www.ti.com 21-Dec-2009 at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
PAGE 8
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74ALVC244DGVR TVSOP DGV 20 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74ALVC244DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74ALVC244NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.
PAGE 9
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74ALVC244DGVR TVSOP DGV 20 2000 367.0 367.0 35.0 SN74ALVC244DWR SOIC DW 20 2000 367.0 367.0 45.0 SN74ALVC244NSR SO NS 20 2000 367.0 367.0 45.0 SN74ALVC244PWR TSSOP PW 20 2000 367.0 367.0 38.0 SN74ALVC244RGYR VQFN RGY 20 3000 367.0 367.0 35.
PAGE 10
MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°– 8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.