Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLogic ICsLogic IC - Buffer, driver SOIC 20

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SDAS141A − DECEMBER 1983 − REVISED JANUARY 1995

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443

• Open-Collector Outputs Drive Bus Lines or

Buffer Memory Address Registers

• Eliminates the Need for 3-State Overlap

Protection

• pnp Inputs Reduce dc Loading

• Open-Collector Versions of ′ALS244 and

′AS244

• Package Options Include Plastic

Small-Outline (DW) Packages, Ceramic

Chip Carriers (FK), and Standard Plastic (N)

and Ceramic (J) 300-mil DIPs

description

These octal buffers and line drivers are designed

specifically to improve both the performance and

density of 3-state memory address drivers, clock

drivers, and bus-oriented receivers and

transmitters by eliminating the need for 3-state

overlap protection. With the ′AS756 and

SN74AS757, these devices provide the choice of

selected combinations of inverting outputs,

symmetrical active-low output-enable (OE

)

inputs, and complementary OE and OE

inputs.

The SN54AS760 is characterized for operation

over the full military temperature range of −55°C

to 125°C. The SN74ALS760 and SN74AS760 are

characterized for operation from 0°C to 70°C.

1OE

1A1

2Y4

1A2

2Y3

1A3

2Y2

1A4

2Y1

GND

2OE

1Y1

2A4

1Y2

2A3

1Y3

2A2

1Y4

2A1

SN54AS760 ...J PACKAGE

SN74ALS760, SN74AS760 . . . DW OR N PACKAGE

(TOP VIEW)

3 2 1 20 19

910111213

1Y1

2A4

1Y2

2A3

1Y3

1A2

2Y3

1A3

2Y2

1A4

SN54AS760 . . . FK PACKAGE

(TOP VIEW)

2Y4

1A1

1OE

1Y4

2A2 2OE

2Y1

2A1

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Summary of content (18 pages)

PAGE 1
SDAS141A − DECEMBER 1983 − REVISED JANUARY 1995 • • • 1OE 1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 GND description These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters by eliminating the need for 3-state overlap protection.
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SDAS141A − DECEMBER 1983 − REVISED JANUARY 1995 logic symbol† 1OE 1A1 1A2 1A3 1A4 1 logic diagram (positive logic) 1OE EN 2 18 4 16 6 14 8 12 1A1 1Y1 2OE 1Y3 1A2 2A2 2A3 2A4 18 4 16 6 14 8 12 1Y1 1Y2 1Y4 1Y3 EN 1A4 2A1 2 1Y2 1A3 19 1 11 9 13 7 15 5 17 3 1Y4 2Y1 2Y2 2OE 2Y3 19 2Y4 2A1 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
PAGE 3
SDAS141A − DECEMBER 1983 − REVISED JANUARY 1995 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER SN74ALS760 TYP† MAX TEST CONDITIONS MIN VIK IOH VCC = 4.5 V, VCC = 4.5 V, II = − 18 mA VOH = 5.5 V IOL VCC = 4.5 V IOL = 12 mA IOL = 24 mA II IIH VCC = 5.5 V, VCC = 5.5 V, VI = 7 V VI = 2.7 V IIL VCC = 5.5 V, ICC VCC = 5.5 V VI = 0.
PAGE 4
SDAS141A − DECEMBER 1983 − REVISED JANUARY 1995 recommended operating conditions SN54AS760 SN74AS760 MIN NOM MAX MIN NOM MAX 4.5 5 5.5 4.5 5 5.5 UNIT VCC VIH Supply voltage VIL VOH Low-level input voltage 0.8 0.8 High-level output voltage 5.5 5.
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SDAS141A − DECEMBER 1983 − REVISED JANUARY 1995 PARAMETER MEASUREMENT INFORMATION SERIES 54ALS/74ALS AND 54AS/74AS DEVICES 7V RL = R1 = R2 VCC S1 RL R1 Test Point From Output Under Test CL (see Note A) From Output Under Test RL Test Point CL (see Note A) CL (see Note A) LOAD CIRCUIT FOR BI-STATE TOTEM-POLE OUTPUTS LOAD CIRCUIT FOR OPEN-COLLECTOR OUTPUTS 3.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.
PAGE 9
PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74AS760DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74AS760NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.
PAGE 10
PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74AS760DWR SOIC DW 20 2000 367.0 367.0 45.0 SN74AS760NSR SO NS 20 2000 367.0 367.0 45.
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