Datasheet

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FEATURES
DBVPACKAGE
(TOP VIEW)
3
2
4
51
NC V
CC
Y
A
GND
Seemechanicaldrawingsfordimensions.
DNU – Donotuse
NC Nointernalconnection–
V
CC
3
2
4
51
NC
Y
A
GND
DCKPACKAGE
(TOP VIEW)
V
CC
DNU
GND
Y
A
1
4
2
3
5
YZP PACKAGE
(BOTTOMVIEW)
DRY PACKAGE
(TOP VIEW)
A
NC
6
4
2
3
GND
Y
V
CC
1
5
NC
PREVIEW
DESCRIPTION/ORDERING INFORMATION
SN74AUC1G07
SINGLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUT
SCES373Q – SEPTEMBER 2001 – REVISED JULY 2007
• Available in the Texas Instruments • Low Power Consumption, 10- μ A Max I
CC
NanoFree™ Package
• ± 8-mA Output Drive at 1.8 V
• Optimized for 1.8-V Operation and Is 3.6-V I/O
• Latch-Up Performance Exceeds 100 mA Per
Tolerant to Support Mixed-Mode Signal
JESD 78, Class II
Operation
• ESD Protection Exceeds JESD 22
• I
off
Supports Partial-Power-Down Mode
– 2000-V Human-Body Model (A114-A)
Operation
– 200-V Machine Model (A115-A)
• Sub-1-V Operable
– 1000-V Charged-Device Model (C101)
• Max t
pd
of 2.5 ns at 1.8 V
This single buffer/driver is operational at 0.8-V to 2.7-V V
CC
, but is designed specifically for 1.65-V to 1.95-V V
CC
operation.
The output of the SN74AUC1G07 is open drain and can be connected to other open-drain outputs to implement
active-low wired-OR or active-high wired-AND functions.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP Reel of 3000 SN74AUC1G07YZPR _ _ _UV_
(Pb-free)
–40 ° C to 85 ° C
SON – DRY Reel of 5000 SN74AUC1G07DRYR PREVIEW
SOT (SOT-23) – DBV Reel of 3000 SN74AUC1G07DBVR U07_
SOT (SC-70) – DCK Reel of 3000 SN74AUC1G07DCKR UV_
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com .
(3) DBV/DCK/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
UNLESS OTHERWISE NOTED this document contains
Copyright © 2001–2007, Texas Instruments Incorporated
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.