Datasheet

1
FEATURES
V
CC
V
CC
3
2
4
51
A
Y
B
GND
DBVPACKAGE
(TOP VIEW)
3
2
4
51
A V
CC
Y
B
GND
A
GND
Y
B
Seemechanicaldrawingsfordimensions.
1
4
2
3
5
DCKPACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOMVIEW)
DESCRIPTION/ORDERING INFORMATION
SN74AUC1G86
SINGLE 2-INPUT EXCLUSIVE-OR GATE
SCES389J – MARCH 2002 – REVISED NOVEMBER 2007
www.ti.com
2
• Available in the Texas Instruments NanoFree™ • Low Power Consumption, 10- µ A Max I
CC
Package
• ± 8-mA Output Drive at 1.8 V
• Optimized for 1.8-V Operation and Is 3.6-V I/O
• Latch-Up Performance Exceeds 100 mA Per
Tolerant to Support Mixed-Mode Signal
JESD 78, Class II
Operation
• ESD Protection Exceeds JESD 22
• I
off
Supports Partial Power-Down-Mode
– 2000-V Human-Body Model (A114-A)
Operation
– 200-V Machine Model (A115-A)
• Sub-1-V Operable
– 1000-V Charged-Device Model (C101)
• Max t
pd
of 2.5 ns at 1.8 V
This single 2-input exclusive-OR gate is operational at 0.8-V to 2.7-V V
CC
, but is designed specifically for 1.65-V
to 1.95-V V
CC
operation.
The SN74AUC1G86 performs the Boolean function Y = A ⊕ B or Y = AB + A B in positive logic.
A common application is as a true/complement element. If the input is low, the other input is reproduced in true
form at the output. If the input is high, the signal on the other input is reproduced inverted at the output.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
NanoFree™
Reel of 3000 SN74AUC1G86YZPR _ _ _UH_
WCSP (DSBGA) – YZP (Pb-free)
– 40 ° C to 85 ° C
SOT (SOT-23) – DBV Reel of 3000 SN74AUC1G86DBVR U86_
SOT (SC-70) – DCK Reel of 3000 SN74AUC1G86DCKR UH_
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com .
(3) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2002 – 2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.