Datasheet

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FEATURES
3
2
5
81
1A
1B
GND
3
2
4 5
1
V
CC
V
CC
V
CC
1Y
1Y
1Y
1B
GND
1B
GND
2A
2Y
Seemechanicaldrawingsfordimensions.
2
5
3
4
8
2Y
2B
2B
2A
2Y
2A
4
6
7
6
7
8
6
1
7
1A
DCTPACKAGE
(TOP VIEW)
DCUPACKAGE
(TOP VIEW)
YEP OR YZP PACKAGE
(BOTTOMVIEW)
1A
2B
DESCRIPTION/ORDERING INFORMATION
SN74AUC2G00
DUAL 2-INPUT POSITIVE-NAND GATE
SCES440C MAY 2003 REVISED JANUARY 2007
Available in the Texas Instruments Low Power Consumption, 10 µ A at 1.8 V
NanoFree™ Package
± 8-mA Output Drive at 1.8 V
Optimized for 1.8-V Operation and Is 3.6-V I/O
Latch-Up Performance Exceeds 100 mA Per
Tolerant to Support Mixed-Mode Signal
JESD 78, Class II
Operation
ESD Protection Exceeds JESD 22
I
off
Supports Partial-Power-Down Mode
2000-V Human-Body Model (A114-A)
Operation
200-V Machine Model (A115-A)
Sub-1-V Operable
1000-V Charged-Device Model (C101)
Max t
pd
of 1.2 ns at 1.8 V
This dual 2-input positive-NAND gate is operational at 0.8-V to 2.7-V V
CC
, but is designed specifically for 1.65-V
to 1.95-V V
CC
operation.
The SN74AUC2G00 performs the Boolean function Y = A B or Y = A + B in positive logic.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(2)
NanoFree™ WCSP (DSBGA)
Reel of 3000 SN74AUC2G00YZPR _ _ _UA_
0.23-mm Large Bump YZP (Pb-free)
–40°C to 85°C
SSOP DCT Reel of 3000 SN74AUC2G00DCTR U00_
VSSOP DCU Reel of 3000 SN74AUC2G00DCUR U00_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

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