Datasheet

1
FEATURES
3
2
4
61
1A 1Y
2Y
GND
2A
3
2
4
61
1A 1Y
2Y
GND
2A
1A
2A
1Y
2Y
GND
Seemechanicaldrawingsfordimensions.
1
4
2
3
6
V
CC
V
CC
5
V
CC
5
5
DBVPACKAGE
(TOP VIEW)
DCKPACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOMVIEW)
DESCRIPTION/ORDERING INFORMATION
SN74AUC2G07
www.ti.com ............................................................................................................................................................... SCES443D – MAY 2003 – REVISED JUNE 2008
DUAL BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS
2
• Available in the Texas Instruments NanoFree™ • Low Power Consumption, 10 µ A at 1.8 V
Package
• ± 8-mA Output Drive at 1.8 V
• Optimized for 1.8-V Operation and Is 3.6-V I/O
• Latch-Up Performance Exceeds 100 mA Per
Tolerant to Support Mixed-Mode Signal
JESD 78, Class II
Operation
• ESD Protection Exceeds JESD 22
• I
off
Supports Partial-Power-Down Mode
– 2000-V Human-Body Model (A114-A)
Operation
– 200-V Machine Model (A115-A)
• Sub-1-V Operable
– 1000-V Charged-Device Model (C101)
• Max t
pd
of 2.5 ns at 1.8 V
This dual buffer/driver is operational at 0.8-V to 2.7-V V
CC
, but is designed specifically for 1.65-V to 1.95-V V
CC
operation.
The output of the SN74AUC2G07 is open drain and can be connected to other open-drain outputs to implement
active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(2)
NanoFree™ – WCSP (DSBGA)
Reel of 3000 SN74AUC2G07YZPR _ _ _UV_
0.23-mm Large Bump – YZP (Pb-free)
Reel of 3000 SN74AUC2G07DBVR
– 40C to 85C
SOT (SOT-23) – DBV U07_
Reel of 250 SN74AUC2G07DBVT
SOT (SC-70) – DCK Reel of 3000 SN74AUC2G07DCKR UV_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003 – 2008, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.