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FEATURES

DCT OR DCU PACKAGE

(TOP VIEW)

GND

YZP PACKAGE

(BOTTOM VIEW)

DESCRIPTION/ORDERING INFORMATION

SN74AUC2G66

DUAL BILATERAL ANALOG SWITCH

SCES507A – NOVEMBER 2003 – REVISED JANUARY 2007

• Available in the Texas Instruments

NanoFree™ Package

• Operates at 0.8 V to 2.7 V

• Sub-1-V Operable

• Max t

of 0.5 ns at 1.8 V

• Low Power Consumption, 10 µ A at 2.7 V

• High On-Off Output Voltage Ratio

• High Degree of Linearity

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• ESD Performance Tested Per JESD 22

– 2000-V Human-Body Model

(A114-B, Class II)

– 200-V Machine Model (A115-A)

– 1000-V Charged-Device Model (C101)

This dual analog switch is operational at 0.8-V to 2.7-V V

, but is designed specifically for 1.1-V to 2.7-V V

operation.

The SN74AUC2G66 can handle both analog and digital signals. It permits signals with amplitudes of up to 2.7-V

(peak) to be transmitted in either direction.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for

analog-to-digital and digital-to-analog conversion systems.

ORDERING INFORMATION

PACKAGE

(1)

ORDERABLE PART NUMBER TOP-SIDE MARKING

(2)

NanoFree™ – WCSP (DSBGA)

Reel of 3000 SN74AUC2G66YZPR _ _ _U6_

0.23-mm Large Bump – YZP (Pb-free)

–40 ° C to 85 ° C

SSOP – DCT Reel of 3000 SN74AUC2G66DCTR U66_ _ _

VSSOP – DCU Reel of 3000 SN74AUC2G66DCUR U66_

(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.

DCU: The actual top-side marking has one additional character that designates the assembly/test site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

FUNCTION TABLE

CONTROL

INPUT SWITCH

(C)

L OFF

H ON

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (21 pages)

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SN74AUC2G66 DUAL BILATERAL ANALOG SWITCH www.ti.com SCES507A – NOVEMBER 2003 – REVISED JANUARY 2007 FEATURES • • • • • • • • • DCT OR DCU PACKAGE (TOP VIEW) Available in the Texas Instruments NanoFree™ Package Operates at 0.8 V to 2.7 V Sub-1-V Operable Max tpd of 0.5 ns at 1.8 V Low Power Consumption, 10 µA at 2.
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SN74AUC2G66 DUAL BILATERAL ANALOG SWITCH www.ti.com SCES507A – NOVEMBER 2003 – REVISED JANUARY 2007 LOGIC DIAGRAM (POSITIVE LOGIC) 1 2 A B 4 C Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range (2) –0.5 3.6 V VI Input voltage range (2) (3) –0.5 3.6 V VI/O Switch I/O voltage range –0.5 VCC + 0.
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SN74AUC2G66 DUAL BILATERAL ANALOG SWITCH www.ti.com SCES507A – NOVEMBER 2003 – REVISED JANUARY 2007 Recommended Operating Conditions VCC (1) Supply voltage VCC = 0.8 V VIH High-level input voltage MIN MAX 0.8 2.7 UNIT V VCC VCC = 1.1 V to 1.95 V VCC = 2.3 V to 2.7 V 0.65 × VCC V 1.7 VCC = 0.8 V 0 0.35 × VCC VIL Low-level input voltage VCC = 1.1 V to 1.95 V VI/O I/O port voltage 0 VCC V VI Control input voltage 0 3.6 V VCC = 2.3 V to 2.
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SN74AUC2G66 DUAL BILATERAL ANALOG SWITCH www.ti.com SCES507A – NOVEMBER 2003 – REVISED JANUARY 2007 Switching Characteristics over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 5) (1) VCC = 1.2 V ± 0.1 V VCC = 1.5 V ± 0.1 V VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V FROM (INPUT) TO (OUTPUT) VCC = 0.8 V tpd (1) A or B B or A 1 0.4 ns ten C A or B 5 0.5 3 0.5 2.1 0.5 0.9 1.6 0.5 1.4 ns tdis C A or B 5.3 0.5 4 0.5 3 0.
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SN74AUC2G66 DUAL BILATERAL ANALOG SWITCH www.ti.
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SN74AUC2G66 DUAL BILATERAL ANALOG SWITCH www.ti.com SCES507A – NOVEMBER 2003 – REVISED JANUARY 2007 PARAMETER MEASUREMENT INFORMATION VCC VCC B or A A or B VI = VCC or GND VIH VO C VC (ON) GND IS r on + V VI * VO W IS VI – VO Figure 1. On-State Resistance Test Circuit 120 VCC = 1.1 V 100 80 60 40 VCC = 1.65 V 20 VCC = 2.3 V 0 0 1 2 Figure 2.
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SN74AUC2G66 DUAL BILATERAL ANALOG SWITCH www.ti.com SCES507A – NOVEMBER 2003 – REVISED JANUARY 2007 PARAMETER MEASUREMENT INFORMATION VCC VCC VI B or A A or B A VO C VC VIL (OFF) GND Condition 1: VI = GND, VO = VCC Condition 2: VI = VCC, VO = GND Figure 3. Off-State Switch Leakage-Current Test Circuit VCC VCC VI = VCC or GND A B or A A or B VO VO = Open VIH C VC (ON) GND Figure 4.
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SN74AUC2G66 DUAL BILATERAL ANALOG SWITCH www.ti.com SCES507A – NOVEMBER 2003 – REVISED JANUARY 2007 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test CL (see Note A) Open GND RL LOAD CIRCUIT TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open VLOAD GND INPUTS VCC 0.8 V 1.2 V ± 0.1 V 1.5 V ± 0.1 V 1.8 V ± 0.15 V 2.5 V ± 0.2 V 1.8 V ± 0.15 V 2.5 V ± 0.
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SN74AUC2G66 DUAL BILATERAL ANALOG SWITCH www.ti.com SCES507A – NOVEMBER 2003 – REVISED JANUARY 2007 PARAMETER MEASUREMENT INFORMATION VCC VCC 0.1 µF C VC VIH 50 Ω fin B or A A or B VO RL (ON) GND CL VCC/2 RL/CL: 600 Ω / 50 pF RL/CL: 50 Ω / 5 pF Figure 6. Frequency Response (Switch ON) VCC VCC 0.
PAGE 10
SN74AUC2G66 DUAL BILATERAL ANALOG SWITCH www.ti.com SCES507A – NOVEMBER 2003 – REVISED JANUARY 2007 PARAMETER MEASUREMENT INFORMATION VCC VCC Rin 600 Ω B or A A or B VCC/2 VO CL 50 pF RL 600 Ω C VC GND VCC/2 50 Ω Figure 8. Crosstalk (Control Input – Switch Output) VCC VCC 0.1 µF fin 50 Ω B or A A or B RL VIL C VC RL (OFF) VCC/2 RL/CL: 600 Ω / 50 pF RL/CL: 50 Ω / 5 pF Figure 9.
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SN74AUC2G66 DUAL BILATERAL ANALOG SWITCH www.ti.com SCES507A – NOVEMBER 2003 – REVISED JANUARY 2007 PARAMETER MEASUREMENT INFORMATION VCC VCC 10 µF fin 600 Ω VIH 10 µF B or A A or B VO RL 10 kΩ C VC (ON) GND CL 50 pF VCC/2 VCC = 0.8 V, VI = 0.7 VP-P VCC = 1.1 V, VI = 1 VP-P VCC = 1.4 V, VI = 1.2 VP-P VCC = 1.65 V, VI = 1.4 VP-P VCC = 2.3 V, VI = 2 VP-P Figure 10.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line.
PAGE 14
PACKAGE MATERIALS INFORMATION www.ti.com 17-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74AUC2G66DCUR US8 DCU 8 3000 180.0 9.0 2.05 3.3 1.0 4.0 8.0 Q3 SN74AUC2G66DCUR US8 DCU 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3 SN74AUC2G66DCURG4 US8 DCU 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.
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PACKAGE MATERIALS INFORMATION www.ti.com 17-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74AUC2G66DCUR US8 DCU 8 3000 182.0 182.0 20.0 SN74AUC2G66DCUR US8 DCU 8 3000 202.0 201.0 28.0 SN74AUC2G66DCURG4 US8 DCU 8 3000 202.0 201.0 28.0 SN74AUC2G66YZPR DSBGA YZP 8 3000 220.0 220.0 34.
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MECHANICAL DATA MPDS049B – MAY 1999 – REVISED OCTOBER 2002 DCT (R-PDSO-G8) PLASTIC SMALL-OUTLINE PACKAGE 0,30 0,15 0,65 8 0,13 M 5 0,15 NOM ÇÇÇÇÇ ÇÇÇÇÇ ÇÇÇÇÇ ÇÇÇÇÇ 2,90 2,70 4,25 3,75 Gage Plane PIN 1 INDEX AREA 1 0,25 4 0° – 8° 3,15 2,75 0,60 0,20 1,30 MAX Seating Plane 0,10 0,10 0,00 NOTES: A. B. C. D. 4188781/C 09/02 All linear dimensions are in millimeters. This drawing is subject to change without notice.
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D: Max = 1.918 mm, Min =1.858 mm E: Max = 0.918 mm, Min =0.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.