Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLogic ICsLogic IC - Flip-Flop Preset/reset Differential VFSOP 8

DCT PACKAGE

(TOP VIEW)

CLK

PRE

GND

CLR

DCU PACKAGE

(TOP VIEW)

2 7

3 6

CLK

GND

PRE

CLR

PRE

RSE PACKAGE

(TOP VIEW)

CLR

GND

CLK

2 7

3 6

DQE PACKAGE

(TOP VIEW)

CLK

GND

PRE

CLR

YFP OR YZP PACKAGE

(TOP VIEW)

GND

CLK

CLR

PRE

3 6

C1 C2

B1 B2

A1 A2

SN74AUP1G74

www.ti.com

SCES644C –MARCH 2006–REVISED MARCH 2010

LOW-POWER SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP

WITH CLEAR AND PRESET

Check for Samples: SN74AUP1G74

FEATURES

• Available in the Texas Instruments NanoStar™ • Wide Operating V

Range of 0.8 V to 3.6 V

Package

• Optimized for 3.3-V Operation

• Low Static-Power Consumption:

• 3.6-V I/O Tolerant to Support Mixed-Mode

= 0.9 mA Max

Signal Operation

• Low Dynamic-Power Consumption:

• t

= 5 ns Max at 3.3 V

= 5.5 pF Typ at 3.3 V

• Suitable for Point-to-Point Applications

• Low Input Capacitance: C

= 1.5 pF Typ

• Latch-Up Performance Exceeds 100 mA Per

• Low Noise – Overshoot and Undershoot

JESD 78, Class II

<10% of V

• ESD Performance Tested Per JESD 22

• I

off

Supports Partial-Power-Down Mode

– 2000-V Human-Body Model

Operation

(A114-B, Class II)

• Schmitt-Trigger Action Allows Slow Input

– 1000-V Charged-Device Model (C101)

Transition and Better Switching Noise

Immunity at the Input

hys

= 250 mV Typ at 3.3 V)

See mechanical drawings for dimensions.

DESCRIPTION/ORDERING INFORMATION

The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable

applications. This family ensures a very low static- and dynamic-power consumption across the entire V

range

of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal

integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (25 pages)

PAGE 1
SN74AUP1G74 www.ti.com SCES644C – MARCH 2006 – REVISED MARCH 2010 LOW-POWER SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET Check for Samples: SN74AUP1G74 FEATURES 1 • • • • • • • Available in the Texas Instruments NanoStar™ Package Low Static-Power Consumption: ICC = 0.9 mA Max Low Dynamic-Power Consumption: Cpd = 5.5 pF Typ at 3.3 V Low Input Capacitance: Ci = 1.
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SN74AUP1G74 SCES644C – MARCH 2006 – REVISED MARCH 2010 www.ti.com Static-Power Consumption Dynamic-Power Consumption (µA) (pF) Switching Characteristics at 25 MHz† 100% 100% 3.5 80% 80% 2.5 60% 60% 3.3-V Logic† 40% Voltage − V 3 3.3-V LVC Logic† 40% AUP 0% † Output 0.5 20% 20% Input 2 1.5 1 0 −0.5 AUP 0% 0 Single, dual, and triple gates † Figure 1. AUP – The Lowest-Power Family 5 10 15 20 25 30 Time − ns 35 40 45 AUP1G08 data at CL = 15 pF Figure 2.
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SN74AUP1G74 www.ti.com SCES644C – MARCH 2006 – REVISED MARCH 2010 LOGIC DIAGRAM (POSITIVE LOGIC) CLR CLK 6 1 C C C 3 Q TG C C 5 C Q C D PRE 2 TG TG TG C C C 7 Pin numbers shown are for the DCT, DCU, and DQE packages ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 4.6 V VI Input voltage range (2) –0.5 4.6 V –0.5 4.6 V –0.5 VCC + 0.
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SN74AUP1G74 SCES644C – MARCH 2006 – REVISED MARCH 2010 www.ti.com RECOMMENDED OPERATING CONDITIONS (1) VCC Supply voltage VCC = 0.8 V VIH High-level input voltage VCC = 1.1 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3 V to 3.6 V MIN MAX 0.8 3.6 UNIT V VCC 0.65 × VCC V 1.6 2 VCC = 0.8 V 0 VCC = 1.1 V to 1.95 V 0.35 × VCC VIL Low-level input voltage VI Input voltage 0 3.6 VO Output voltage 0 VCC V VCC = 0.8 V –20 mA VCC = 1.1 V –1.1 VCC = 1.4 V –1.7 VCC = 1.65 –1.9 VCC = 2.
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SN74AUP1G74 www.ti.com SCES644C – MARCH 2006 – REVISED MARCH 2010 ELECTRICAL CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VOH TEST CONDITIONS VCC MIN 0.8 V to 3.6 V VCC – 0.1 VCC – 0.1 1.1 V 0.75 × VCC 0.7 × VCC IOH = –1.7 mA 1.4 V 1.11 1.03 IOH = –1.9 mA 1.65 V 1.32 1.3 2.05 1.97 2.3 V IOH = –2.7 mA 3V IOH = –4 mA 1.9 1.85 2.72 2.67 2.6 2.55 MAX 0.8 V to 3.6 V 0.1 0.1 IOL = 1.1 mA 1.1 V 0.3 × VCC 0.
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SN74AUP1G74 SCES644C – MARCH 2006 – REVISED MARCH 2010 www.ti.com TIMING REQUIREMENTS over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3) PARAMETER VCC TA = 25°C TYP 0.8 V fclock Clock frequency TA = –40°C to 85°C MIN 21 1.2 V ± 0.1 V 40 1.5 V ± 0.1 V 50 1.8 V ± 0.15 V 60 2.5 V ± 0.2 V 90 3.3 V ± 0.3 V 0.8 V CLK high or low tw PRE or CLR low 2 1.5 V ± 0.1 V 2 1.8 V ± 0.15 V 2 2.5 V ± 0.2 V 2 Data high 2 1.5 V ± 0.1 V 2 1.8 V ± 0.
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SN74AUP1G74 www.ti.com SCES644C – MARCH 2006 – REVISED MARCH 2010 SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, CL = 5 pF (unless otherwise noted) (see Figure 3 and Figure 4) PARAMETER FROM (INPUT) TO (OUTPUT) MIN 0.8 V fmax Q CLK tpd Q or Q MAX MIN 1.2 V ± 0.1 V 80 1.5 V ± 0.1 V 125 90 1.8 V ± 0.15 V 150 120 2.5 V ± 0.2 V 180 160 3.3 V ± 0.3 V 190 180 0.8 V 31 UNIT MAX 60 MHz 1.2 V ± 0.1 V 2 10 20 2.7 20.4 1.5 V ± 0.1 V 2 6 12 1.
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SN74AUP1G74 SCES644C – MARCH 2006 – REVISED MARCH 2010 www.ti.com SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, CL = 10 pF (unless otherwise noted) (see Figure 3 and Figure 4) PARAMETER FROM (INPUT) TO (OUTPUT) fmax Q CLK tpd MIN 8 Q or Q MAX MIN 46 1.2 V ± 0.1 V 65 50 1.5 V ± 0.1 V 95 55 1.8 V ± 0.15 V 110 60 2.5 V ± 0.2 V 170 130 3.3 V ± 0.3 V 180 160 0.8 V 33 UNIT MAX MHz 1.2 V ± 0.1 V 2 10 22 3.4 21.8 1.5 V ± 0.1 V 2 7 13 2.
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SN74AUP1G74 www.ti.com SCES644C – MARCH 2006 – REVISED MARCH 2010 SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 3 and Figure 4) PARAMETER FROM (INPUT) TO (OUTPUT) fmax Q CLK tpd MIN Q or Q MAX MIN 41 1.2 V ± 0.1 V 75 50 1.5 V ± 0.1 V 95 55 1.8 V ± 0.15 V 100 60 2.5 V ± 0.2 V 150 130 3.3 V ± 0.3 V 200 160 0.8 V 35 MHz 2 12 23.1 4.1 23.2 1.5 V ± 0.1 V 2 8 14.1 2.9 14.6 1.8 V ± 0.
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SN74AUP1G74 SCES644C – MARCH 2006 – REVISED MARCH 2010 www.ti.com SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 3 and Figure 4) PARAMETER FROM (INPUT) TO (OUTPUT) fmax Q CLK MIN TYP Q Q or Q MIN 21 1.2 V ± 0.1 V 50 40 1.5 V ± 0.1 V 60 50 1.8 V ± 0.15 V 75 70 2.5 V ± 0.2 V 100 90 3.3 V ± 0.3 V 100 90 0.8 V 32 UNIT MAX MHz 1.2 V ± 0.1 V 3 14 27 5.9 27 1.5 V ± 0.1 V 3 10 17 4.4 17.
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SN74AUP1G74 www.ti.com SCES644C – MARCH 2006 – REVISED MARCH 2010 PARAMETER MEASUREMENT INFORMATION (Propagation Delays, Setup and Hold Times, and Pulse Width) From Output Under Test CL (see Note A) 1 MΩ LOAD CIRCUIT CL VM VI VCC = 0.8 V VCC = 1.2 V ± 0.1 V VCC = 1.5 V ± 0.1 V VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.
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SN74AUP1G74 SCES644C – MARCH 2006 – REVISED MARCH 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION (Enable and Disable Times) 2 × VCC S1 5 kΩ From Output Under Test GND CL (see Note A) 5 kΩ TEST S1 tPLZ/tPZL tPHZ/tPZH 2 × VCC GND LOAD CIRCUIT CL VM VI V∆ VCC = 0.8 V VCC = 1.2 V ± 0.1 V VCC = 1.5 V ± 0.1 V VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.3 V 5, 10, 15, 30 pF VCC/2 VCC 0.1 V 5, 10, 15, 30 pF VCC/2 VCC 0.1 V 5, 10, 15, 30 pF VCC/2 VCC 0.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.
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PACKAGE MATERIALS INFORMATION www.ti.com 8-Sep-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74AUP1G74DCUR US8 DCU 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3 SN74AUP1G74DQER X2SON DQE 8 5000 180.0 8.4 1.2 1.6 0.55 4.0 8.0 Q1 SN74AUP1G74RSER UQFN RSE 8 5000 180.0 8.4 1.6 1.6 0.66 4.0 8.
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PACKAGE MATERIALS INFORMATION www.ti.com 8-Sep-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74AUP1G74DCUR US8 DCU 8 3000 202.0 201.0 28.0 SN74AUP1G74DQER X2SON DQE 8 5000 202.0 201.0 28.0 SN74AUP1G74RSER UQFN RSE 8 5000 202.0 201.0 28.0 SN74AUP1G74YFPR DSBGA YFP 8 3000 220.0 220.0 35.0 SN74AUP1G74YZPR DSBGA YZP 8 3000 220.0 220.0 35.
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D: Max = 1.918 mm, Min =1.858 mm E: Max = 0.918 mm, Min =0.
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D: Max = 1.59 mm, Min = 1.53 mm E: Max = 0.79 mm, Min = 0.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.