Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLogic ICsLogic IC - Flip-Flop Standard Non-inverting SC 74 A

D V

CLK

GND

DCK PACKAGE

(TOP VIEW)

D V

CLK

GND

DRL PACKAGE

(TOP VIEW)

DBV PACKAGE

(TOP VIEW)

D V

CLK

GND

DRY PACKAGE

(TOP VIEW)

CLK

N.C.

GND

CLK

N.C.

DSF PACKAGE

(TOP VIEW)

YZP PACKAGE

(TOP VIEW)

GND

CLK

YFP PACKAGE

(TOP VIEW)

GND

CLK

N.C.

SN74AUP1G79

www.ti.com

SCES592G –JULY 2004–REVISED MAY 2010

LOW-POWER SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP

Check for Samples: SN74AUP1G79

FEATURES

• Available in the Texas Instruments NanoStar™ • Wide Operating V

Range of 0.8 V to 3.6 V

Package

• Optimized for 3.3-V Operation

• Low Static-Power Consumption:

• 3.6-V I/O Tolerant to Support Mixed-Mode

= 0.9 mA Max

Signal Operation

• Low Dynamic-Power Consumption:

• t

= 4 ns Max at 3.3 V

= 3 pF Typ at 3.3 V

• Suitable for Point-to-Point Applications

• Low Input Capacitance:

• Latch-Up Performance Exceeds 100 mA Per

= 1.5 pF Typ

JESD 78, Class II

• Low Noise: Overshoot and Undershoot

• ESD Performance Tested Per JESD 22

<10% of V

– 2000-V Human-Body Model

• I

off

Supports Partial Power-Down-Mode

(A114-B, Class II)

Operation

– 1000-V Charged-Device Model (C101)

• Input Hysteresis Allows Slow Input Transition

and Better Switching Noise Immunity at the

Input (V

hys

= 250 mV Typ at 3.3 V)

N.C. – No internal connection

See mechanical drawings for dimensions.

DESCRIPTION/ORDERING INFORMATION

The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable

applications. This family ensures a very low static and dynamic power consumption across the entire V

range

of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see

Figure 1 and Figure 2).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (27 pages)

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SN74AUP1G79 www.ti.com SCES592G – JULY 2004 – REVISED MAY 2010 LOW-POWER SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP Check for Samples: SN74AUP1G79 FEATURES 1 • • • • • • • Available in the Texas Instruments NanoStar™ Package Low Static-Power Consumption: ICC = 0.9 mA Max Low Dynamic-Power Consumption: Cpd = 3 pF Typ at 3.3 V Low Input Capacitance: Ci = 1.
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SN74AUP1G79 SCES592G – JULY 2004 – REVISED MAY 2010 www.ti.com Static-Power Consumption Dynamic-Power Consumption (µA) (pF) Switching Characteristics at 25 MHz† 100% 100% 3.5 80% 80% 2.5 60% 60% 3.3-V Logic† 40% 40% 20% Voltage − V 3 3.3-V LVC Logic† 0% † 0% Output 0.5 20% AUP Input 2 1.5 1 0 −0.5 AUP Single, dual, and triple gates 0 5 10 15 20 25 30 Time − ns 35 40 45 † AUP1G08 data at C = 15 pF L Figure 1. AUP – The Lowest-Power Family Figure 2.
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SN74AUP1G79 www.ti.com SCES592G – JULY 2004 – REVISED MAY 2010 LOGIC DIAGRAM (POSITIVE LOGIC) CLK CLK Q Q D D ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 4.6 V VI Input voltage range (2) –0.5 4.6 V –0.5 4.6 V –0.5 VCC + 0.
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SN74AUP1G79 SCES592G – JULY 2004 – REVISED MAY 2010 www.ti.com RECOMMENDED OPERATING CONDITIONS (1) VCC Supply voltage VCC = 0.8 V VIH High-level input voltage VCC = 1.1 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3 V to 3.6 V MIN MAX 0.8 3.6 UNIT V VCC 0.65 × VCC V 1.6 2 VCC = 0.8 V 0 VCC = 1.1 V to 1.95 V 0.35 × VCC VIL Low-level input voltage VI Input voltage 0 3.6 VO Output voltage 0 VCC V VCC = 0.8 V –20 mA VCC = 1.1 V –1.1 VCC = 1.4 V –1.7 VCC = 1.65 V –1.9 VCC = 2.
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SN74AUP1G79 www.ti.com SCES592G – JULY 2004 – REVISED MAY 2010 ELECTRICAL CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VOH TEST CONDITIONS VCC VCC – 0.1 VCC – 0.1 1.1 V 0.75 × VCC 0.7 × VCC IOH = –1.7 mA 1.4 V 1.11 1.03 IOH = –1.9 mA 1.65 V 1.32 1.3 2.05 1.97 2.3 V 3V IOH = –4 mA 2.67 2.6 2.55 V 0.8 V to 3.6 V 0.1 0.1 1.1 V 0.3 × VCC 0.3 × VCC IOL = 1.7 mA 1.4 V 0.31 0.37 IOL = 1.9 mA 1.65 V 0.31 0.35 0.
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SN74AUP1G79 SCES592G – JULY 2004 – REVISED MAY 2010 www.ti.com TIMING REQUIREMENTS over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3) VCC TA = 25°C TA = –40°C to 85°C TYP MIN MAX 0.8 V fclock Clock frequency 20 1.2 V ± 0.1 V 80 1.5 V ± 0.1 V 100 1.8 V ± 0.15 V 140 2.5 V ± 0.2 V 210 3.3 V ± 0.3 V tw Pulse duration, CLK high or low 4.8 1.2 V ± 0.1 V 2.2 1.5 V ± 0.1 V 1.5 1.8 V ± 0.15 V 1.6 2.5 V ± 0.2 V 1.7 3.3 V ± 0.
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SN74AUP1G79 www.ti.com SCES592G – JULY 2004 – REVISED MAY 2010 SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, CL = 5 pF (unless otherwise noted) (see Figure 3 and Figure 4) PARAMETER FROM (INPUT) TO (OUTPUT) fmax MIN CLK Q TYP MAX MIN 0.8 V 93 90 1.2 V ± 0.1 V 199 220 1.5 V ± 0.1 V 250 230 1.8 V ± 0.15 V 271 240 2.5 V ± 0.2 V 280 250 3.3 V ± 0.3 V 280 260 0.8 V 15.9 1.2 V ± 0.1 V tpd TA = –40°C to 85°C TA = 25°C VCC 3.7 6.
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SN74AUP1G79 SCES592G – JULY 2004 – REVISED MAY 2010 www.ti.com SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 3 and Figure 4) PARAMETER FROM (INPUT) TO (OUTPUT) fmax tpd CLK Q TA = –40°C to 85°C TA = 25°C VCC MIN TYP MAX MIN 0.8 V 48 30 1.2 V ± 0.1 V 112 120 1.5 V ± 0.1 V 151 160 1.8 V ± 0.15 V 194 220 2.5 V ± 0.2 V 248 250 3.3 V ± 0.3 V 280 260 0.8 V 20.3 UNIT MAX MHz 1.2 V ± 0.1 V 5 8.
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SN74AUP1G79 www.ti.com SCES592G – JULY 2004 – REVISED MAY 2010 PARAMETER MEASUREMENT INFORMATION (Propagation Delays, Setup and Hold Times, and Pulse Width) From Output Under Test CL (see Note A) 1 MΩ LOAD CIRCUIT CL VM VI VCC = 0.8 V VCC = 1.2 V ± 0.1 V VCC = 1.5 V ± 0.1 V VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.
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SN74AUP1G79 SCES592G – JULY 2004 – REVISED MAY 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION (Enable and Disable Times) 2 × VCC S1 5 kΩ From Output Under Test GND CL (see Note A) 5 kΩ TEST S1 tPLZ/tPZL tPHZ/tPZH 2 × VCC GND LOAD CIRCUIT CL VM VI V∆ VCC = 0.8 V VCC = 1.2 V ± 0.1 V VCC = 1.5 V ± 0.1 V VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.3 V 5, 10, 15, 30 pF VCC/2 VCC 0.1 V 5, 10, 15, 30 pF VCC/2 VCC 0.1 V 5, 10, 15, 30 pF VCC/2 VCC 0.
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PACKAGE OPTION ADDENDUM www.ti.
PAGE 12
PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 11-Apr-2013 Status (1) SN74AUP1G79YZPR ACTIVE Package Type Package Pins Package Drawing Qty DSBGA YZP 5 3000 Eco Plan Lead/Ball Finish (2) Green (RoHS & no Sb/Br) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) SNAGCU Level-1-260C-UNLIM (4) -40 to 85 (HW7 ~ HWN) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs.
PAGE 13
PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ SN74AUP1G79DBVR SOT-23 3000 180.0 8.4 DBV 5 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.23 3.17 1.37 4.0 8.0 Q3 SN74AUP1G79DBVT SOT-23 DBV 5 250 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3 SN74AUP1G79DCKR SC70 DCK 5 3000 180.0 9.2 2.3 2.55 1.2 4.0 8.
PAGE 14
PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74AUP1G79DBVR SOT-23 DBV 5 3000 202.0 201.0 28.0 SN74AUP1G79DBVT SOT-23 DBV 5 250 202.0 201.0 28.0 SN74AUP1G79DCKR SC70 DCK 5 3000 205.0 200.0 33.0 SN74AUP1G79DCKT SC70 DCK 5 250 202.0 201.0 28.0 SN74AUP1G79DRLR SOT DRL 5 4000 202.0 201.0 28.0 SN74AUP1G79DRYR SON DRY 6 5000 180.0 180.0 30.
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D: Max = 1.418 mm, Min =1.358 mm E: Max = 0.918 mm, Min =0.
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D: Max = 1.19 mm, Min = 1.13 mm E: Max = 0.79 mm, Min = 0.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.