Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLogic ICsLogic IC - Buffer, driver TSSOP 56

www.ti.com

FEATURES

DESCRIPTION

136

-128-144-160

0.4

0.8

1.2

1.6

2.0

2.4

2.8

17015311910285685134170

0.4

0.8

1.2

1.6

2.0

2.4

2.8

3.2

= 25°C

Process = Nominal

- Output Current - mA

= 3.3 V

= 2.5 V

= 1.8 V

- Output Voltage - V

= 25°C

Process = Nominal

- Output Current - mA

= 3.3 V

= 2.5 V

= 1.8 V

- Output Voltage - V

-80-96-112 -32-48-64 0-16

SN74AVC16827

20-BIT BUFFER/DRIVER

WITH 3-STATE OUTPUTS

SCES176I – DECEMBER 1998 – REVISED JUNE 2005

• Dynamic Drive Capability Is Equivalent to

Standard Outputs With I

and I

of ± 24 mA

• Member of the Texas Instruments Widebus™

at 2.5-V V

CCFamily

• Overvoltage-Tolerant Inputs/Outputs Allow

• EPIC™ (Enhanced-Performance Implanted

Mixed-Voltage-Mode Data Communications

CMOS) Submicron Process

• I

off

Supports Partial-Power-Down Mode

• DOC™ (Dynamic Output Control) Circuit

Operation

Dynamically Changes Output Impedance,

Resulting in Noise Reduction Without Speed • Latch-Up Performance Exceeds 100 mA Per

Degradation JESD 78, Class II

• Less Than 2-ns Maximum Propagation Delay • Package Options Include Plastic Thin Shrink

at 2.5-V and 3.3-V V

Small-Outline (DGG) and Thin Very

Small-Outline (DGV) Packages

A Dynamic Output Control (DOC™) circuit is implemented, which, during the transition, initially lowers the output

impedance to effectively drive the load and, subsequently, raises the impedance to reduce noise. Figure 1 shows

typical V

vs I

and V

vs I

curves to illustrate the output impedance and drive capability of the circuit. At

the beginning of the signal transition, the DOC circuit provides a maximum dynamic drive that is equivalent to a

high-drive standard-output device. For more information, refer to the TI application reports, AVC Logic Family

Technology and Applications, literature number SCEA006, and Dynamic Output Control (DOC™ ) Circuitry

Technology and Applications, literature number SCEA009.

Figure 1. Output Voltage vs Output Current

This 20-bit noninverting buffer/driver is operational at 1.2-V to 3.6-V V

, but is designed specifically for 1.65-V to

3.6-V V

operation.

The SN74AVC16827 is composed of two 10-bit sections with separate output-enable signals. For either 10-bit

buffer section, the two output-enable (1 OE1 and 1 OE2 or 2 OE1 and 2 OE2) inputs must both be low for the

corresponding Y outputs to be active. If either output-enable input is high, the outputs of that 10-bit buffer section

are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE should be tied to V

through a pullup

resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

This device is fully specified for partial-power-down applications using I

off

. The I

off

circuitry disables the outputs,

preventing damaging current backflow through the device when it is powered down.

The SN74AVC16827 is characterized for operation from –40°C to 85°C.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Widebus, EPIC, DOC are trademarks of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (15 pages)

PAGE 1
SN74AVC16827 20-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES176I – DECEMBER 1998 – REVISED JUNE 2005 • FEATURES • • • • Member of the Texas Instruments Widebus™ Family EPIC™ (Enhanced-Performance Implanted CMOS) Submicron Process DOC™ (Dynamic Output Control) Circuit Dynamically Changes Output Impedance, Resulting in Noise Reduction Without Speed Degradation Less Than 2-ns Maximum Propagation Delay at 2.5-V and 3.
PAGE 2
SN74AVC16827 20-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.
PAGE 3
SN74AVC16827 20-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.
PAGE 4
SN74AVC16827 20-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES176I – DECEMBER 1998 – REVISED JUNE 2005 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 4.6 V VI Input voltage range (2) –0.5 4.6 V –0.5 4.6 V –0.5 VCC + 0.
PAGE 5
SN74AVC16827 20-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES176I – DECEMBER 1998 – REVISED JUNE 2005 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VOH VCC IOHS = –100 µA, VIH = VCC IOHS = –2 mA, VIH = 0.91 V 1.4 V IOHS = –4 mA, VIH = 1.07 V 1.65 V 1.2 IOHS = –8 mA, VIH = 1.7 V 2.3 V 1.75 IOHS = –12 mA, VIH = 2 V 3V 2.3 1.4 V to 3.6 V IOLS = 100 µA VOL MIN TYP (1) MAX UNIT VCC – 0.
PAGE 6
SN74AVC16827 20-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES176I – DECEMBER 1998 – REVISED JUNE 2005 PARAMETER MEASUREMENT INFORMATION VCC = 1.2 V AND 1.5 V ± 0.
PAGE 7
SN74AVC16827 20-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES176I – DECEMBER 1998 – REVISED JUNE 2005 PARAMETER MEASUREMENT INFORMATION VCC = 1.8 V ± 0.
PAGE 8
SN74AVC16827 20-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES176I – DECEMBER 1998 – REVISED JUNE 2005 PARAMETER MEASUREMENT INFORMATION VCC = 2.5 V ± 0.
PAGE 9
SN74AVC16827 20-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES176I – DECEMBER 1998 – REVISED JUNE 2005 PARAMETER MEASUREMENT INFORMATION VCC = 3.3 V ± 0.
PAGE 10
PACKAGE OPTION ADDENDUM www.ti.
PAGE 11
PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74AVC16827DGGR TSSOP DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1 SN74AVC16827DGVR TVSOP DGV 56 2000 330.0 24.4 6.8 11.7 1.6 12.0 24.
PAGE 12
PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74AVC16827DGGR TSSOP DGG 56 2000 346.0 346.0 41.0 SN74AVC16827DGVR TVSOP DGV 56 2000 346.0 346.0 41.
PAGE 13
MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice.
PAGE 14
MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°– 8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters.
PAGE 15
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.