Datasheet

1
FEATURES
3
2
4
61
V
CCA
V
CCB
B
GND
A
DBV PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
3
2
4
61
V
CCA
V
CCB
B
GND
A
3
2
4
61
V
CCA
V
CCB
B
GND
A
DRL PACKAGE
(TOP VIEW)
See mechanical drawings for dimensions.
DIR
DIR
DIR
5
5
5
YZP PACKAGE
(BOTTOM VIEW)
C1
B1
A1
C2
B2
A2
B
DIR
V
CCB
A
GND
V
CCA
3
2
1
4
5
6
DESCRIPTION/ORDERING INFORMATION
SN74AVC1T45
SINGLE-BIT DUAL-SUPPLY BUS TRANSCEIVER
WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS
SCES530G DECEMBER 2003 REVISED JANUARY 2008
www.ti.com
2
Available in the Texas Instruments NanoFree™ Typical Max Data Rates
Package
500 Mbps (1.8-V to 3.3-V Translation)
Fully Configurable Dual-Rail Design Allows
320 Mbps (<1.8-V to 3.3-V Translation)
Each Port to Operate Over the Full 1.2-V to
320 Mbps (Translate to 2.5 V or 1.8 V)
3.6-V Power-Supply Range
280 Mbps (Translate to 1.5 V)
V
CC
Isolation Feature - If Either V
CC
Input Is at
240 Mbps (Translate to 1.2 V)
GND, Both Ports Are in the High-Impedance
Latch-Up Performance Exceeds 100 mA Per
State
JESD 78, Class II
DIR Input Circuit Referenced to V
CCA
ESD Protection Exceeds JESD 22
± 12-mA Output Drive at 3.3 V
2000-V Human-Body Model (A114-A)
I/Os Are 4.6-V Tolerant
200-V Machine Model (A115-A)
I
off
Supports Partial-Power-Down Mode
1000-V Charged-Device Model (C101)
Operation
This single-bit noninverting bus transceiver uses two separate configurable power-supply rails. The
SN74AVC1T45 is optimized to operate with V
CCA
/V
CCB
set at 1.4 V to 3.6 V. It is operational with V
CCA
/V
CCB
as
low as 1.2 V. The A port is designed to track V
CCA
. V
CCA
accepts any supply voltage from 1.2 V to 3.6 V. The
B port is designed to track V
CCB
. V
CCB
accepts any supply voltage from 1.2 V to 3.6 V. This allows for universal
low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V voltage nodes.
ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
NanoFree™ WCSP (DSBGA)
Reel of 3000 SN74AVC1T45YZPR _ _ _TC_
0.23-mm Large Bump YZP (Pb-free)
SOT (SOT-23) DBV Reel of 3000 SN74AVC1T45DBVR DT1_
40 ° C to 85 ° C
SOT (SC-70) DCK Reel of 3000 SN74AVC1T45DCKR TC_
SOT (SOT-553) DRL Reel of 4000 SN74AVC1T45DRLR TC_
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com .
(3) DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003 2008, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

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