Datasheet

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FEATURES
DESCRIPTION/ORDERING INFORMATION
SN74AVCA406
MMC, SD CARD, Memory Stick, SmartMedia, AND xD-Picture Card
± 15-kV ESD-PROTECTED VOLTAGE-TRANSLATION TRANSCEIVER
SCES615H – OCTOBER 2004 – REVISED JANUARY 2007
• Transceiver for Memory Card Interface • ESD Protection for Card-Side Pins (B Port)
[MultiMediaCard (MMC), Secure Digital (SD),
– ± 15 kV ( ± 12 kV on Pin 14B) – IEC 61000-4-2
Memory Stick™ Compliant Products,
ESD, Air-Gap Discharge
SmartMedia Card, and xD-Picture Card™]
– ± 8 kV – IEC 61000-4-2 ESD, Contact
• Configurable I/O Switching Levels With
Discharge
Dual-Supply Pins Operating Over Full 1.4-V to
• ESD Protection for A-Port Pins (Tested Per
3.6-V Power-Supply Range
JESD 22) Exceeds
• For Low-Power Operation, A Ports Are Placed
– 2000-V Human-Body Model (A114-B
in High-Impedance State When Card-Side
– 1000-V Charged-Device Model (C101)
Supply Voltage Is Switched Off
xxxxxxx
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
The SN74AVCA406 is a transceiver for interfacing microprocessors with MultiMediaCards (MMCs), secure
digital (SD) cards, Memory Stick™ compliant products, SmartMedia cards, or xD-Picture Cards™. It integrates
high ESD protection, which eliminates the need for external ESD diodes. Two supply-voltage pins allow the
A-port and B-port input switching thresholds to be configured separately. The A port is designed to track V
CCA
,
while the B port is designed to track V
CCB0
and V
CCB1
. V
CCA
,V
CCB0
and V
CCB1
can accept any supply voltage
from 1.4 V to 3.6 V.
Memory card standards recommend high ESD protection for devices that connect directly to the external
memory card. To meet this need, the SN74AVCA406 incorporates ± 15-kV air-gap discharge and ± 8-kV contact
discharge protection on the card side. If V
CCB0
and V
CCB1
are switched off (no card inserted), the A-port outputs
are placed in the high-impedance state to conserve power.
The SN74AVCA406 enables system designers to easily interface low-voltage microprocessors to different
memory cards operating at higher voltages. The mode (MODE0 and MODE1) pins are used to configure the
device to interface with different types of cards.
The SN74AVCA406 is offered in the 48-ball MicroStar Jr.™ ball grid array (BGA) package. This package has
dimensions of 4 × 4 mm, with a 0.5-mm ball pitch for effective board-space savings. Memory cards are widely
used in mobile phones, PDAs, digital cameras, personal media players, camcorders, set-top boxes, etc. Low
static power consumption and small package size make the SN74AVCA406 an ideal choice for these
applications.
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
TSSOP – DGGR Tape and reel SN74AVCA406DGGR AVCA406
–40 ° C to 85 ° C VFBGA – GQC Tape and reel SN74AVCA406GQCR
WM406
VFBGA – ZQC (Pb-free) Tape and reel SN74AVCA406ZQCR
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 2004–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.