Datasheet

1
FEATURES
DCT OR DCU PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
V
CCA
A1
A2
GND
V
CCB
B1
B2
DIR
YZP PACKAGE
(BOTTOM VIEW)
4
3
2
1
5
6
7
8
GND
A2
A1
V
CCA
DIR
B2
B1
V
CCB
D1 D2
C2C1
B1 B2
A1 A2
DESCRIPTION/ORDERING INFORMATION
SN74AVCH2T45
DUAL-BIT DUAL-SUPPLY BUS TRANSCEIVER
WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS
SCES582F JULY 2004 REVISED NOVEMBER 2007
www.ti.com
2
Available in the Texas Instruments NanoFree™
Package
Control Inputs V
IH
/V
IL
Levels Are Referenced to
V
CCA
Voltage
Fully Configurable Dual-Rail Design Allows
Each Port to Operate Over the Full 1.2-V to
3.6-V Power-Supply Range
I/Os Are 4.6-V Tolerant
I
off
Supports Partial Power-Down-Mode
Operation
Bus Hold on Data Inputs Eliminates the Need
for External Pullup/Pulldown Resistors
Max Data Rates
500 Mbps (1.8-V to 3.3-V Translation)
320 Mbps (<1.8-V to 3.3-V Translation)
320 Mbps (Translate to 2.5 V or 1.8 V)
280 Mbps (Translate to 1.5 V)
240 Mbps (Translate to 1.2 V)
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
1000-V Charged-Device Model (C101)
This dual-bit noninverting bus transceiver uses two separate configurable power-supply rails. The
SN74AVCH2T45 is optimized to operate with V
CCA
/V
CCB
set at 1.4 V to 3.6 V. It is operational with V
CCA
/V
CCB
as
low as 1.2 V. The A port is designed to track V
CCA
. V
CCA
accepts any supply voltage from 1.2 V to 3.6 V. The B
port is designed to track V
CCB
. V
CCB
accepts any supply voltage from 1.2 V to 3.6 V. This allows for universal
low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V voltage nodes.
ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
NanoFree™ WCSP (DSBGA)
Reel of 3000 SN74AVCH2T45YZPR _ _ _TF_
0.23-mm Large Bump YZP (Pb-free)
40 ° C to 85 ° C
SSOP DCT Reel of 3000 SN74AVCH2T45DCTR ET2_ _ _
VSSOP DCU Reel of 3000 SN74AVCH2T45DCUR ET2_
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com .
(3) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2004 2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

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