Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLogic ICsLogic IC - Multiplexer, demux FET multiplexer/demultiplexer Single supply TSSOP 16

www.ti.com

FEATURES

1B1

1B2

2B1

2B2

GND

4B1

4B2

3B1

3B2

DBQ, DGV, OR PW PACKAGE

(TOP VIEW)

RGY PACKAGE

(TOP VIEW)

1 16

8 9

4B1

4B2

3B1

3B2

1B1

1B2

2B1

2B2

GND

DESCRIPTION/ORDERING INFORMATION

SN74CB3Q3257

4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER

2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH

SCDS135A – SEPTEMBER 2003 – REVISED MARCH 2005

• Data and Control Inputs Provide Undershoot

Clamp Diodes

• High-Bandwidth Data Path

(up to 500 MHz

(1)

) • Low Power Consumption

= 0.7 mA Typ)

• 5-V Tolerant I/Os With Device Powered Up or

Powered Down • V

Operating Range From 2.3 V to 3.6 V

• Low and Flat ON-State Resistance (r

) • Data I/Os Support 0- to 5-V Signaling Levels

Characteristics Over Operating Range (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V)

= 4 Ω Typ)

• Control Inputs Can Be Driven by TTL or

• Rail-to-Rail Switching on Data I/O Ports 5-V/3.3-V CMOS Outputs

– 0- to 5-V Switching With 3.3-V V

• I

off

Supports Partial-Power-Down Mode

Operation

– 0- to 3.3-V Switching With 2.5-V V

• Latch-Up Performance Exceeds 100 mA Per

• Bidirectional Data Flow With Near-Zero

JESD 78, Class II

Propagation Delay

• ESD Performance Tested Per JESD 22

• Low Input/Output Capacitance Minimizes

Loading and Signal Distortion – 2000-V Human-Body Model

io(OFF)

= 3.5 pF Typ) (A114-B, Class II)

• Fast Switching Frequency (f

= 20 MHz Max) – 1000-V Charged-Device Model (C101)

• Supports Both Digital and Analog

(1) For additional information regarding the performance

Applications: USB Interface, Differential

characteristics of the CB3Q family, refer to the TI application

Signal Interface, Bus Isolation, Low-Distortion

report, CBT-C, CB3T, and CB3Q Signal-Switch Families,

literature number SCDA008. Signal Gating

ORDERING INFORMATION

PACKAGE

(1)

ORDERABLE PART NUMBER TOP-SIDE MARKING

QFN – RGY Tape and reel SN74CB3Q3257RGYR BU257

SSOP (QSOP) – DBQ Tape and reel SN74CB3Q3257DBQR BU257

–40 ° C to 85 ° C

TSSOP – PW Tape and reel SN74CB3Q3257PWR BU257

TVSOP – DGV Tape and reel SN74CB3Q3257DGVR BU257

(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (20 pages)

PAGE 1
SN74CB3Q3257 4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER 2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS135A – SEPTEMBER 2003 – REVISED MARCH 2005 • • • (1) For additional information regarding the performance characteristics of the CB3Q family, refer to the TI application report, CBT-C, CB3T, and CB3Q Signal-Switch Families, literature number SCDA008.
PAGE 2
SN74CB3Q3257 4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER 2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS135A – SEPTEMBER 2003 – REVISED MARCH 2005 DESCRIPTION/ORDERING INFORMATION (CONTINUED) The SN74CB3Q3257 is a high-bandwidth FET bus switch utilizing a charge pump to elevate the gate voltage of the pass transistor, providing a low and flat ON-state resistance (ron).
PAGE 3
SN74CB3Q3257 4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER 2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS135A – SEPTEMBER 2003 – REVISED MARCH 2005 LOGIC DIAGRAM (POSITIVE LOGIC) 4 2 1A 1B1 SW 3 1B2 SW 7 5 2A 2B1 SW 6 2B2 SW 3A 9 11 SW 3B1 10 SW 12 3B2 14 4A 4B1 SW 13 4B2 SW 1 S 15 OE SIMPLIFIED SCHEMATIC, EACH FET SWITCH (SW) A B VCC Charge Pump EN(1) (1) EN is the internal enable signal applied to the switch.
PAGE 4
SN74CB3Q3257 4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER 2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS135A – SEPTEMBER 2003 – REVISED MARCH 2005 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 4.6 V VIN Control input voltage range (2) (3) –0.
PAGE 5
SN74CB3Q3257 4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER 2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS135A – SEPTEMBER 2003 – REVISED MARCH 2005 Electrical Characteristics (1) over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VCC = 3.6 V, IIN MIN TYP (2) MAX TEST CONDITIONS II = –18 mA Control inputs VCC = 3.6 V, VIN = 0 to 5.5 V IOZ (3) VCC = 3.6 V, VO = 0 to 5.
PAGE 6
SN74CB3Q3257 4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER 2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS135A – SEPTEMBER 2003 – REVISED MARCH 2005 TYPICAL ron vs VI 16 VCC = 3.3 V TA = 25°C , IO = -15 mA ron – Resistance – 14 12 10 8 6 4 2 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VI - V Figure 1. Typical ron vs VI TYPICAL ICC vs CONTROL-INPUT SWITCHING FREQUENCY 12 VCC = 3.
PAGE 7
SN74CB3Q3257 4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER 2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS135A – SEPTEMBER 2003 – REVISED MARCH 2005 PARAMETER MEASUREMENT INFORMATION VCC Input Generator VIN 50 Ω 50 Ω VG1 TEST CIRCUIT DUT 2 × VCC Input Generator RL VO VI S1 50 Ω 50 Ω VG2 CL (see Note A) RL TEST VCC S1 RL VI CL tpd(s) 2.5 V ± 0.2 V 3.3 V ± 0.3 V Open Open 500 Ω 500 Ω VCC or GND VCC or GND 30 pF 50 pF tPLZ/tPZL 2.5 V ± 0.2 V 3.3 V ± 0.
PAGE 8
PACKAGE OPTION ADDENDUM www.ti.
PAGE 9
PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined.
PAGE 10
PACKAGE MATERIALS INFORMATION www.ti.com 5-Jul-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74CB3Q3257DGVR TVSOP DGV 16 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1 SN74CB3Q3257PWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 SN74CB3Q3257PWRG4 TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.
PAGE 11
PACKAGE MATERIALS INFORMATION www.ti.com 5-Jul-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74CB3Q3257DGVR TVSOP DGV 16 2000 367.0 367.0 35.0 SN74CB3Q3257PWR TSSOP PW 16 2000 364.0 364.0 27.0 SN74CB3Q3257PWRG4 TSSOP PW 16 2000 367.0 367.0 35.0 SN74CB3Q3257RGYR VQFN RGY 16 3000 367.0 367.0 35.
PAGE 12
MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°– 8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.